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市场调查报告书
商品编码
1662211

全球 3D 晶片 (3D IC) 市场

3D Chips (3D IC)
出版日期: | 出版商: Global Industry Analysts, Inc. | 英文 276 Pages | 商品交期: 最快1-2个工作天内

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简介目录

预计到 2030 年全球 3D 晶片 (3D IC) 市场规模将达到 452 亿美元

2024 年全球 3D 晶片（3D IC）市场规模估计为 168 亿美元，预计到 2030 年将达到 452 亿美元，2024 年至 2030 年的复合年增长率为 18.0%。记忆体是报告中分析的细分市场之一，预计复合年增长率为 19.2%，到分析期结束时将达到 222 亿美元。在分析期间内，LED 部分的复合年增长率预计为 18.2%。

美国市场规模估计为 46 亿美元，中国市场预估年复合成长率为 16.6%

预计2024年美国3D晶片（3D IC）市场规模将达46亿美元。中国是世界第二大经济体，预计到 2030 年市场规模将达到 67 亿美元，2024-2030 年分析期间的复合年增长率为 16.6%。其他值得注意的区域市场包括日本和加拿大，预计在分析期间的复合年增长率分别为 16.5% 和 15.2%。在欧洲，预计德国的复合年增长率约为 12.6%。

3D 晶片 (3D IC) - 主要趋势和驱动因素

3D 晶片，也称为 3D 积体电路 (3D IC)，是半导体技术的一项革命性进步，解决了传统 2D IC 的限制。这些晶片是透过堆迭多层硅晶片或晶粒并使用穿透硅通孔(TSV) 垂直连接它们製成的。这种架构设计透过提高整合密度、降低功耗，显着提高了晶片效能。垂直堆迭减少了层间互连长度，从而提高讯号传输速度并减少延迟。这使得多种类型的电路（包括逻辑、记忆体和类比）可以整合到单一封装中，以紧凑的尺寸提供增强的功能和性能。 3D IC 对各种应用都有重大影响，包括高效能运算、行动装置、资料中心和物联网 (IoT) 设备，它为克服传统半导体扩展的物理和经济障碍提供了途径。

3D IC 市场最突出的趋势之一是对高效能和节能运算解决方案的需求不断增加。资料中心和云端处理服务的快速扩张迫切需要能够以最小的能耗处理大量资料的处理器。 3D IC 因其卓越的性能和能源效率而特别适合这些需求。此外，人工智慧（AI）和机器学习（ML）应用的普及需要能够快速执行复杂运算的晶片。 3D IC 尺寸更小、性能更佳，非常适合这些应用。此外，智慧型手机和穿戴式装置等消费性电子产品的小型化趋势正在推动 3D IC 的采用。这些晶片在更小的封装内提供更多的功能，满足了消费者对更强大但更紧凑的设备的需求。异质整合的发展将不同类型的电路结合到一个三维封装中，进一步扩展了三维积体电路的潜在应用，为不同行业的特定需求提供客製化的解决方案。

3D IC 市场的成长受到多种因素的推动。其中一个主要驱动因素是电子设备的复杂性日益增加以及对更高整合度的需求。随着设备变得越来越复杂，对于能够在单一封装中整合更多功能的晶片的需求也越来越大，而 3D IC 可以实现这一点。另一个关键驱动因素是提高资料密集型应用的能源效率和效能。提高处理速度并降低功耗的能力使得 3D IC 在资料中心和高效能运算环境中具有吸引力。此外，製造技术的进步正在降低生产 3D IC 的成本，使其更适用于更广泛的应用。此外，物联网设备的普及和边缘运算日益增长的重要性也促进了市场的成长。这些应用需要小型、高效、高性能的晶片。此外，领先半导体公司的策略联盟和研发投资正在加速 3D IC 技术的创新和应用。新材料的整合和先进封装技术的发展也正在扩大3D IC的功能和应用。总而言之，技术进步、市场需求和策略投资的整合正在推动 3D IC 市场向前发展，预计将在运算效能、能源效率和设备功能方面取得重大进展。

部分

产品（记忆体、LED、感测器、MEMS）；类型（加法 3D、单片 3D）；最终用户（消费性电子、通讯、汽车、军事和航太、医疗设备、工业、其他最终用户）

受访公司范例（26家值得关注的公司）

  • Amkor Technology, Inc.
  • Applied Materials, Inc.
  • ASE Technology Holding, Co., Ltd.
  • Micron Technology, Inc.
  • NVIDIA Corporation
  • Renesas Electronics Corporation
  • STATS ChipPAC Pte., Ltd.
  • STMicroelectronics NV
  • Taiwan Semiconductor Manufacturing Co., Ltd.（TSMC）
  • Toshiba Corporation

目录

第一章调查方法

第 2 章执行摘要

  • 市场概况
  • 主要企业
  • 市场趋势和驱动因素
  • 全球市场展望

第三章 市场分析

  • 美国
  • 加拿大
  • 日本
  • 中国
  • 欧洲
  • 法国
  • 德国
  • 义大利
  • 英国
  • 其他欧洲国家
  • 亚太地区
  • 其他地区

第四章 竞赛

简介目录
Product Code: MCP-6575

Global 3D Chips (3D IC) Market to Reach US$45.2 Billion by 2030

The global market for 3D Chips (3D IC) estimated at US$16.8 Billion in the year 2024, is expected to reach US$45.2 Billion by 2030, growing at a CAGR of 18.0% over the analysis period 2024-2030. Memory, one of the segments analyzed in the report, is expected to record a 19.2% CAGR and reach US$22.2 Billion by the end of the analysis period. Growth in the LEDs segment is estimated at 18.2% CAGR over the analysis period.

The U.S. Market is Estimated at US$4.6 Billion While China is Forecast to Grow at 16.6% CAGR

The 3D Chips (3D IC) market in the U.S. is estimated at US$4.6 Billion in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$6.7 Billion by the year 2030 trailing a CAGR of 16.6% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 16.5% and 15.2% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 12.6% CAGR.

3D Chips (3D IC) - Key Trends and Drivers

3D chips, also known as 3D integrated circuits (3D ICs), represent a transformative advancement in semiconductor technology, addressing the limitations of traditional 2D ICs. These chips are created by stacking multiple layers of silicon wafers or dies and connecting them vertically using through-silicon vias (TSVs). This architectural design significantly enhances chip performance by increasing density and reducing power consumption. The vertical stacking shortens the interconnect lengths between layers, which improves signal transmission speed and reduces latency. This allows for integrating various types of circuits, such as logic, memory, and analog, within a single package, enhancing functionality and performance in a compact form factor. The impact of 3D ICs is profound across various applications, including high-performance computing, mobile devices, data centers, and Internet of Things (IoT) devices, offering a path to overcoming the physical and economic barriers of traditional semiconductor scaling.

One of the most prominent trends in the 3D IC market is the escalating demand for high-performance and energy-efficient computing solutions. As data centers and cloud computing services expand rapidly, there is a pressing need for processors capable of handling vast amounts of data with minimal energy consumption. 3D ICs are particularly well-suited for these demands due to their superior performance and energy efficiency. Additionally, the surge in artificial intelligence (AI) and machine learning (ML) applications necessitates chips that can execute complex computations swiftly. The compactness and enhanced performance of 3D ICs make them ideal for these applications. Moreover, the ongoing trend of miniaturization in consumer electronics, such as smartphones and wearable devices, is propelling the adoption of 3D ICs. These chips enable more functionality within smaller packages, addressing consumer demand for more powerful yet compact devices. The development of heterogeneous integration, where different types of circuits are combined in a single 3D package, further expands the potential applications of 3D ICs, offering solutions tailored to specific needs across various sectors.

The growth in the 3D IC market is driven by several factors. One major driver is the increasing complexity of electronic devices and the need for higher integration levels. As devices become more sophisticated, there is a greater demand for chips that can integrate more functions within a single package, which 3D ICs can provide. Another key driver is the push for improved energy efficiency and performance in data-intensive applications. The ability of 3D ICs to reduce power consumption while enhancing processing speed makes them attractive for use in data centers and high-performance computing environments. Additionally, advancements in fabrication and manufacturing technologies have reduced the costs associated with 3D IC production, making them more accessible to a broader range of applications. The proliferation of IoT devices and the increasing importance of edge computing also contribute to the market growth, as these applications require compact, efficient, and high-performance chips. Moreover, strategic collaborations and investments in research and development by major semiconductor companies are accelerating the innovation and adoption of 3D IC technologies. The integration of new materials and the development of advanced packaging techniques are also expanding the capabilities and applications of 3D ICs. In summary, the convergence of technological advancements, market demands, and strategic investments is propelling the 3D IC market forward, promising significant advancements in computing performance, energy efficiency, and device functionality.

SCOPE OF STUDY:

The report analyzes the 3D Chips (3D IC) market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Product (Memory, LEDs, Sensors, MEMS); Type (Stacked 3D, Monolithic 3D); End-Use (Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector, Other End-Uses)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.

Select Competitors (Total 26 Featured) -

  • Amkor Technology, Inc.
  • Applied Materials, Inc.
  • ASE Technology Holding, Co., Ltd.
  • Micron Technology, Inc.
  • NVIDIA Corporation
  • Renesas Electronics Corporation
  • STATS ChipPAC Pte., Ltd.
  • STMicroelectronics NV
  • Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC)
  • Toshiba Corporation

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • Global Economic Update
    • 3D Chips (3D IC) - Global Key Competitors Percentage Market Share in 2025 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Increasing Demand for High-Performance Computing Drives Adoption
    • Advances in Through-Silicon Via (TSV) Technology Propel Growth
    • Expansion of Data Centers Spurs Demand for Energy-Efficient 3D ICs
    • Rise of AI and Machine Learning Applications Expands Addressable Market Opportunity
    • Miniaturization Trends in Consumer Electronics Strengthen Business Case for 3D ICs
    • Growing Complexity of Electronic Devices Generates Demand for Higher Integration
    • Innovations in Heterogeneous Integration Techniques Accelerate Adoption
    • Shift Towards Edge Computing Sustains Growth in 3D IC Market
    • Consumer Demand for Compact and Powerful Devices Propels Market Growth
    • Development of Advanced Packaging Solutions Expands Market Opportunities
    • Emergence of Smart Devices Accelerates Demand for 3D ICs
    • Integration of New Materials in 3D ICs Generates Opportunities for Enhanced Functionality
    • Evolving Cloud Computing Requirements Propel Need for High-Density 3D ICs
    • Focus on Reducing Latency in Data Processing: Here's the Story of 3D IC Impact
    • Adoption of Biometric and Security Technologies Drives Market Growth for 3D ICs
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World 3D Chips (3D IC) Market Analysis of Annual Sales in US$ Million for Years 2015 through 2030
    • TABLE 2: World Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 3: World 6-Year Perspective for 3D Chips (3D IC) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2025 & 2030
    • TABLE 4: World Recent Past, Current & Future Analysis for Memory by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 5: World 6-Year Perspective for Memory by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 6: World Recent Past, Current & Future Analysis for LEDs by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 7: World 6-Year Perspective for LEDs by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 8: World Recent Past, Current & Future Analysis for Sensors by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 9: World 6-Year Perspective for Sensors by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 10: World Recent Past, Current & Future Analysis for MEMS by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 11: World 6-Year Perspective for MEMS by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 12: World Recent Past, Current & Future Analysis for Stacked 3D by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 13: World 6-Year Perspective for Stacked 3D by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 14: World Recent Past, Current & Future Analysis for Monolithic 3D by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 15: World 6-Year Perspective for Monolithic 3D by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 16: World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 17: World 6-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 18: World Recent Past, Current & Future Analysis for Telecommunications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 19: World 6-Year Perspective for Telecommunications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 20: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 21: World 6-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 22: World Recent Past, Current & Future Analysis for Military & Aerospace by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 23: World 6-Year Perspective for Military & Aerospace by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 24: World Recent Past, Current & Future Analysis for Medical Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 25: World 6-Year Perspective for Medical Devices by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 26: World Recent Past, Current & Future Analysis for Industrial Sector by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 27: World 6-Year Perspective for Industrial Sector by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
    • TABLE 28: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 29: World 6-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • 3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
    • TABLE 30: USA Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 31: USA 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
    • TABLE 32: USA Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 33: USA 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
    • TABLE 34: USA Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 35: USA 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
  • CANADA
    • TABLE 36: Canada Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 37: Canada 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
    • TABLE 38: Canada Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 39: Canada 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
    • TABLE 40: Canada Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 41: Canada 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
  • JAPAN
    • 3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
    • TABLE 42: Japan Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 43: Japan 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
    • TABLE 44: Japan Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 45: Japan 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
    • TABLE 46: Japan Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 47: Japan 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
  • CHINA
    • 3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
    • TABLE 48: China Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 49: China 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
    • TABLE 50: China Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 51: China 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
    • TABLE 52: China Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 53: China 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
  • EUROPE
    • 3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
    • TABLE 54: Europe Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 55: Europe 6-Year Perspective for 3D Chips (3D IC) by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2025 & 2030
    • TABLE 56: Europe Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 57: Europe 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
    • TABLE 58: Europe Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 59: Europe 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
    • TABLE 60: Europe Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 61: Europe 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
  • FRANCE
    • 3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
    • TABLE 62: France Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 63: France 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
    • TABLE 64: France Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 65: France 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
    • TABLE 66: France Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 67: France 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
  • GERMANY
    • 3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
    • TABLE 68: Germany Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 69: Germany 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
    • TABLE 70: Germany Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 71: Germany 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
    • TABLE 72: Germany Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 73: Germany 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
  • ITALY
    • TABLE 74: Italy Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 75: Italy 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
    • TABLE 76: Italy Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 77: Italy 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
    • TABLE 78: Italy Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 79: Italy 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
  • UNITED KINGDOM
    • 3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
    • TABLE 80: UK Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 81: UK 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
    • TABLE 82: UK Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 83: UK 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
    • TABLE 84: UK Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 85: UK 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
  • REST OF EUROPE
    • TABLE 86: Rest of Europe Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 87: Rest of Europe 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
    • TABLE 88: Rest of Europe Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 89: Rest of Europe 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
    • TABLE 90: Rest of Europe Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 91: Rest of Europe 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
  • ASIA-PACIFIC
    • 3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
    • TABLE 92: Asia-Pacific Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 93: Asia-Pacific 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
    • TABLE 94: Asia-Pacific Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 95: Asia-Pacific 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
    • TABLE 96: Asia-Pacific Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 97: Asia-Pacific 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
  • REST OF WORLD
    • TABLE 98: Rest of World Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 99: Rest of World 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
    • TABLE 100: Rest of World Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 101: Rest of World 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
    • TABLE 102: Rest of World Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 103: Rest of World 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030

IV. COMPETITION