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市场调查报告书
商品编码
1760962

全球模製互连设备(MID)市场

Molded Interconnect Device (MID)

出版日期: | 出版商: Global Industry Analysts, Inc. | 英文 223 Pages | 商品交期: 最快1-2个工作天内

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简介目录

到 2030 年,全球模塑互连设备 (MID) 市场规模将达到 57 亿美元

全球模塑互连设备 (MID) 市场规模预计在 2024 年为 26 亿美元,预计到 2030 年将达到 57 亿美元,在 2024-2030 年分析期内的复合年增长率为 13.9%。天线和连接模组是本报告分析的细分市场之一,预计其复合年增长率为 13.9%,到分析期结束时规模将达到 19 亿美元。连接器和开关细分市场在分析期间的复合年增长率预计为 12.8%。

美国市场规模将达 6.681 亿美元;中国市场预期复合年增长率为 17.9%

美国模塑互连设备 (MID) 市场规模预计在 2024 年达到 6.681 亿美元。预计到 2030 年,作为世界第二大经济体的中国市场规模将达到 14 亿美元,在 2024-2030 年的分析期内,复合年增长率为 17.9%。其他值得关注的区域市场包括日本和加拿大,预计在分析期间的复合年增长率分别为 9.5% 和 11.4%。在欧洲,预计德国的复合年增长率为 10.6%。

全球模塑互连设备 (MID) 市场 - 主要趋势和驱动因素摘要

什么是模塑互连设备 (MID)?为什么它们具有革命性?

模塑互连装置 (MID) 是一种多功能组件,将机械和电气功能整合在一个模塑热塑性部件中。该技术允许将电路直接嵌入塑胶基板,将塑胶外壳和电子线路整合成一个紧凑轻巧的部件。 MID 越来越多地应用于各种高科技应用,包括智慧型手机、汽车感测器和医疗保健设备,因为它们可以促进小型化,同时提高可靠性和性能。整合多种功能不仅可以缩小产品的尺寸和重量,还可以简化组装流程,减少所需零件数量,并最终降低整体製造成本。

技术进步如何影响 MID 产业?

技术进步在扩展MID的功能和应用方面发挥关键作用。 3D成型製程和雷射直接成型(LDS)技术的创新尤其具有变革性。例如,LDS技术能够在3D表面上以更高的精度创建复杂的电路路径,从而极大地扩展了设计灵活性以及可受益于MID技术的产品类型。此外,材料科学的进步,例如高导电性聚合物复合材料的开发和电镀技术的改进,正在提升MID的电气性能和耐用性。这些技术改进使各行各业能够生产出更复杂、更可靠的设备。

哪些市场趋势正在影响模製互连设备的采用?

MID 的普及在很大程度上受到电子市场持续小型化和整合趋势的影响。随着设备体积越来越小,消费者对设备功能的期望也越来越高,製造商纷纷转向 MID 技术来满足这些需求。这一趋势在消费性电子领域尤为明显,该领域对更轻薄、功能更丰富的设备的需求持续增长。在汽车产业,每辆汽车的电子元件数量不断增加,尤其是先进的安全和资讯娱乐系统,这推动了对能够在狭小空间内整合复杂电路的 MID 的需求。此外,在医疗领域,MID 正被用于为医疗穿戴式装置和植入提供紧凑的整合解决方案,而这些装置的空间和可靠性至关重要。

推动模塑互连设备市场成长的因素有哪些?

模塑互连设备市场的成长受到多种因素的驱动,这些因素反映了技术创新、产业需求和消费行为的动态交互作用。 3D 列印和雷射成型技术的进步拓宽了 MID 的应用范围,使其成为小型电子设备设计和製造中必不可少的一部分。对更永续製造流程的追求也推动着 MID 减少与传统电路基板和电子组件相关的废弃物和环境影响。此外,消费者对功能强大、体积小巧且节能的电子产品的需求不断增长,这推动着 MID 市场的持续成长。汽车、家电和医疗保健等行业尤其重要,因为它们越来越依赖 MID 提供的整合能力和设计灵活性,这推动它们进行创新并增强产品供应。总之,这些因素支持着模塑互连设备市场在现代技术领域的快速成长和扩张。

部分

类型(天线和连接模组、连接器和开关、感测器、照明、其他类型)、最终用途(消费性电子、通讯、医疗、汽车、工业、其他最终用途)

受访公司范例(46家值得关注的公司)

  • 2E Mechatronic GmbH & Co. KG
  • HARTING AG & Co. KG
  • JOHNAN Corporation
  • LPKF Laser & Electronics AG
  • MID Solutions GmbH
  • Molex LLC
  • Multiple Dimensions AG
  • TE Connectivity Ltd.

人工智慧集成

全球产业分析师正在利用可操作的专家内容和人工智慧工具改变市场和竞争情报。

Global 特定产业SLM 的典型规范,而是建立了一个从全球专家收集的内容库,其中包括视讯录影、部落格、搜寻引擎研究以及大量的公司、产品/服务和市场数据。

关税影响係数

全球产业分析师根据公司总部所在国家、製造地、进出口状况(成品和原始OEM)预测其竞争态势的变化。这种复杂且多面向的市场动态预计将以多种方式影响竞争对手,包括销货成本成本 (COGS) 上升、盈利下降、供应链重组以及其他微观和宏观市场动态。

目录

第一章调查方法

第二章执行摘要

  • 市场概览
  • 主要企业
  • 市场趋势和驱动因素
  • 全球市场展望

第三章市场分析

  • 美国
  • 加拿大
  • 日本
  • 中国
  • 欧洲
  • 法国
  • 德国
  • 义大利
  • 英国
  • 西班牙
  • 俄罗斯
  • 其他欧洲国家
  • 亚太地区
  • 澳洲
  • 印度
  • 韩国
  • 其他亚太地区
  • 拉丁美洲
  • 阿根廷
  • 巴西
  • 墨西哥
  • 其他拉丁美洲
  • 中东
  • 伊朗
  • 以色列
  • 沙乌地阿拉伯
  • 阿拉伯聯合大公国
  • 其他中东地区
  • 非洲

第四章 竞赛

简介目录
Product Code: MCP13437

Global Molded Interconnect Device (MID) Market to Reach US$5.7 Billion by 2030

The global market for Molded Interconnect Device (MID) estimated at US$2.6 Billion in the year 2024, is expected to reach US$5.7 Billion by 2030, growing at a CAGR of 13.9% over the analysis period 2024-2030. Antennae & Connectivity Modules, one of the segments analyzed in the report, is expected to record a 13.9% CAGR and reach US$1.9 Billion by the end of the analysis period. Growth in the Connectors & Switches segment is estimated at 12.8% CAGR over the analysis period.

The U.S. Market is Estimated at US$668.1 Million While China is Forecast to Grow at 17.9% CAGR

The Molded Interconnect Device (MID) market in the U.S. is estimated at US$668.1 Million in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$1.4 Billion by the year 2030 trailing a CAGR of 17.9% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 9.5% and 11.4% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 10.6% CAGR.

Global Molded Interconnect Device (MID) Market - Key Trends & Drivers Summarized

What Is a Molded Interconnect Device (MID) and Why Is It Revolutionary?

A Molded Interconnect Device (MID) is a highly versatile component that integrates both mechanical and electrical functions within a single molded thermoplastic unit. This technology allows for the incorporation of circuitry directly onto plastic substrates, combining the plastic housing and electronic interconnects into one compact and lightweight part. MIDs are increasingly used in various high-tech applications such as smartphones, automotive sensors, and healthcare devices due to their ability to facilitate miniaturization while enhancing reliability and performance. The integration of multiple functions not only reduces the size and weight of the product but also simplifies assembly processes, reduces the number of components required, and ultimately, cuts overall manufacturing costs.

How Are Technological Advancements Shaping the MID Industry?

Technological advancements play a crucial role in expanding the capabilities and applications of MIDs. Innovations in 3D molding processes and laser direct structuring (LDS) have particularly been transformative. LDS technology, for example, allows for greater precision in creating intricate circuit paths on three-dimensional surfaces, vastly increasing the design flexibility and the types of products that can benefit from MID technology. Additionally, advancements in materials science, including the development of highly conductive polymer composites and improved plating techniques, enhance the electrical performance and durability of MIDs. These technological improvements enable the production of more complex and reliable devices across a broader range of industries.

What Market Trends Are Influencing the Adoption of Molded Interconnect Devices?

The adoption of MIDs is heavily influenced by the ongoing trends in miniaturization and integration within the electronics market. As devices become smaller and consumer expectations for device functionality increase, manufacturers are turning to MID technology to meet these demands. This trend is evident in the consumer electronics sector, where there is a continuous push for thinner, more feature-packed devices. In the automotive industry, the increasing electronic content per vehicle, particularly for advanced safety and infotainment systems, drives the need for MIDs that can incorporate complex circuitry into tight spaces. Additionally, the medical sector utilizes MIDs for compact, integrated solutions in medical wearables and implants, where space and reliability are critical.

What Drives the Growth in the Molded Interconnect Devices Market?

The growth in the molded interconnect devices market is driven by several factors, reflecting the dynamic interplay of technological innovation, industry demands, and consumer behavior. Advances in 3D printing and laser structuring technologies have broadened the scope of MID applications, making them indispensable in the design and manufacture of compact electronic devices. The push for more sustainable manufacturing processes also favors MIDs, as they reduce the waste and environmental impact associated with traditional circuit boards and electronic assemblies. Furthermore, the increasing consumer demand for sophisticated, yet smaller and energy-efficient electronic products stimulates continuous growth in the MID market. Industries such as automotive, consumer electronics, and healthcare are particularly pivotal, as they increasingly rely on the integration capabilities and design flexibility offered by MIDs to innovate and enhance product offerings. These factors collectively underscore the burgeoning reliance on and expansion of the molded interconnect devices market in the modern technological landscape.

SCOPE OF STUDY:

The report analyzes the Molded Interconnect Device (MID) market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Type (Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting, Other Types); End-Use (Consumer Electronics, Telecommunications, Medical, Automotive, Industrial, Other End-Uses)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.

Select Competitors (Total 46 Featured) -

  • 2E Mechatronic GmbH & Co. KG
  • HARTING AG & Co. KG
  • JOHNAN Corporation
  • LPKF Laser & Electronics AG
  • MID Solutions GmbH
  • Molex LLC
  • Multiple Dimensions AG
  • TE Connectivity Ltd.

AI INTEGRATIONS

We're transforming market and competitive intelligence with validated expert content and AI tools.

Instead of following the general norm of querying LLMs and Industry-specific SLMs, we built repositories of content curated from domain experts worldwide including video transcripts, blogs, search engines research, and massive amounts of enterprise, product/service, and market data.

TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by increasing the Cost of Goods Sold (COGS), reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • Tariff Impact on Global Supply Chain Patterns
    • Global Economic Update
    • Molded Interconnect Device (MID) - Global Key Competitors Percentage Market Share in 2025 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Advancements in 3D Molding Technologies Propel the Growth of Molded Interconnect Devices (MIDs)
    • Increasing Demand for Miniaturization in Consumer Electronics Spurs Adoption of MIDs
    • Expansion of Automotive Applications Drives Innovations in MID Technology
    • Integration of MIDs in Medical Devices Enhances Functionality and Compactness
    • Rise of IoT and Connected Devices Boosts Market Opportunities for MIDs
    • Technological Convergence in Multi-Functional Devices Amplifies Use of Molded Interconnect Devices
    • Growing Environmental Regulations Promote Development of Eco-Friendly MID Materials
    • Adoption of MID Technology in Smart Wearables Generates Market Growth
    • Advancements in Laser Direct Structuring (LDS) Techniques Expand MID Capabilities
    • Increasing Role of MIDs in Aerospace and Defense for Lightweight Solutions
    • Consumer Demand for Sleek, Integrated Interfaces Strengthens Market for MIDs
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Molded Interconnect Device (MID) Market Analysis of Annual Sales in US$ Thousand for Years 2015 through 2030
    • TABLE 2: World Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 3: World 6-Year Perspective for Molded Interconnect Device (MID) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets for Years 2025 & 2030
    • TABLE 4: World Recent Past, Current & Future Analysis for Antennae & Connectivity Modules by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 5: World 6-Year Perspective for Antennae & Connectivity Modules by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 6: World Recent Past, Current & Future Analysis for Connectors & Switches by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 7: World 6-Year Perspective for Connectors & Switches by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 8: World Recent Past, Current & Future Analysis for Sensors by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 9: World 6-Year Perspective for Sensors by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 10: World Recent Past, Current & Future Analysis for Lighting by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 11: World 6-Year Perspective for Lighting by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 12: World Recent Past, Current & Future Analysis for Other Types by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 13: World 6-Year Perspective for Other Types by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 14: World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 15: World 6-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 16: World Recent Past, Current & Future Analysis for Telecommunications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 17: World 6-Year Perspective for Telecommunications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 18: World Recent Past, Current & Future Analysis for Medical by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 19: World 6-Year Perspective for Medical by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 20: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 21: World 6-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 22: World Recent Past, Current & Future Analysis for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 23: World 6-Year Perspective for Industrial by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 24: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 25: World 6-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
    • TABLE 26: USA Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 27: USA 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 28: USA Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 29: USA 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • CANADA
    • TABLE 30: Canada Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 31: Canada 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 32: Canada Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 33: Canada 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • JAPAN
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
    • TABLE 34: Japan Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 35: Japan 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 36: Japan Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 37: Japan 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • CHINA
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
    • TABLE 38: China Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 39: China 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 40: China Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 41: China 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • EUROPE
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
    • TABLE 42: Europe Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 43: Europe 6-Year Perspective for Molded Interconnect Device (MID) by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets for Years 2025 & 2030
    • TABLE 44: Europe Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 45: Europe 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 46: Europe Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 47: Europe 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • FRANCE
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
    • TABLE 48: France Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 49: France 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 50: France Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 51: France 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • GERMANY
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
    • TABLE 52: Germany Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 53: Germany 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 54: Germany Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 55: Germany 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • ITALY
    • TABLE 56: Italy Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 57: Italy 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 58: Italy Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 59: Italy 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • UNITED KINGDOM
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
    • TABLE 60: UK Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 61: UK 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 62: UK Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 63: UK 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • SPAIN
    • TABLE 64: Spain Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 65: Spain 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 66: Spain Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 67: Spain 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • RUSSIA
    • TABLE 68: Russia Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 69: Russia 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 70: Russia Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 71: Russia 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • REST OF EUROPE
    • TABLE 72: Rest of Europe Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 73: Rest of Europe 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 74: Rest of Europe Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 75: Rest of Europe 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • ASIA-PACIFIC
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
    • TABLE 76: Asia-Pacific Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 77: Asia-Pacific 6-Year Perspective for Molded Interconnect Device (MID) by Geographic Region - Percentage Breakdown of Value Sales for Australia, India, South Korea and Rest of Asia-Pacific Markets for Years 2025 & 2030
    • TABLE 78: Asia-Pacific Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 79: Asia-Pacific 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 80: Asia-Pacific Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 81: Asia-Pacific 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • AUSTRALIA
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Australia for 2025 (E)
    • TABLE 82: Australia Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 83: Australia 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 84: Australia Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 85: Australia 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • INDIA
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in India for 2025 (E)
    • TABLE 86: India Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 87: India 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 88: India Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 89: India 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • SOUTH KOREA
    • TABLE 90: South Korea Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 91: South Korea 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 92: South Korea Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 93: South Korea 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • REST OF ASIA-PACIFIC
    • TABLE 94: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 95: Rest of Asia-Pacific 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 96: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 97: Rest of Asia-Pacific 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • LATIN AMERICA
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Latin America for 2025 (E)
    • TABLE 98: Latin America Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 99: Latin America 6-Year Perspective for Molded Interconnect Device (MID) by Geographic Region - Percentage Breakdown of Value Sales for Argentina, Brazil, Mexico and Rest of Latin America Markets for Years 2025 & 2030
    • TABLE 100: Latin America Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 101: Latin America 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 102: Latin America Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 103: Latin America 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • ARGENTINA
    • TABLE 104: Argentina Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 105: Argentina 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 106: Argentina Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 107: Argentina 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • BRAZIL
    • TABLE 108: Brazil Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 109: Brazil 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 110: Brazil Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 111: Brazil 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • MEXICO
    • TABLE 112: Mexico Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 113: Mexico 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 114: Mexico Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 115: Mexico 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • REST OF LATIN AMERICA
    • TABLE 116: Rest of Latin America Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 117: Rest of Latin America 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 118: Rest of Latin America Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 119: Rest of Latin America 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • MIDDLE EAST
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Middle East for 2025 (E)
    • TABLE 120: Middle East Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 121: Middle East 6-Year Perspective for Molded Interconnect Device (MID) by Geographic Region - Percentage Breakdown of Value Sales for Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets for Years 2025 & 2030
    • TABLE 122: Middle East Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 123: Middle East 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 124: Middle East Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 125: Middle East 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • IRAN
    • TABLE 126: Iran Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 127: Iran 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 128: Iran Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 129: Iran 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • ISRAEL
    • TABLE 130: Israel Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 131: Israel 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 132: Israel Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 133: Israel 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • SAUDI ARABIA
    • TABLE 134: Saudi Arabia Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 135: Saudi Arabia 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 136: Saudi Arabia Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 137: Saudi Arabia 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • UNITED ARAB EMIRATES
    • TABLE 138: UAE Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 139: UAE 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 140: UAE Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 141: UAE 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • REST OF MIDDLE EAST
    • TABLE 142: Rest of Middle East Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 143: Rest of Middle East 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 144: Rest of Middle East Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 145: Rest of Middle East 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030
  • AFRICA
    • Molded Interconnect Device (MID) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Africa for 2025 (E)
    • TABLE 146: Africa Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by Type - Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 147: Africa 6-Year Perspective for Molded Interconnect Device (MID) by Type - Percentage Breakdown of Value Sales for Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting and Other Types for the Years 2025 & 2030
    • TABLE 148: Africa Recent Past, Current & Future Analysis for Molded Interconnect Device (MID) by End-Use - Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 149: Africa 6-Year Perspective for Molded Interconnect Device (MID) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Medical, Automotive, Industrial and Other End-Uses for the Years 2025 & 2030

IV. COMPETITION