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市场调查报告书
商品编码
1467760

2024-2032 年按类型、组件（硅通孔、玻璃通孔、硅中介层）、应用、最终用户和地区分類的 3D IC 市场

3D IC Market by Type, Component (Through-Silicon Via, Through Glass Via, Silicon Interposer), Application, End User, and Region 2024-2032
出版日期: | 出版商: IMARC | 英文 137 Pages | 商品交期: 2-3个工作天内

价格

IMARC Group年全球3D IC市场规模达170亿美元。笔记型电脑、智慧型手机和平板电脑等各种具有卓越功能的紧凑型和先进消费性电子产品的购买量不断增加，是推动市场的主要因素。

三维（3D）积体电路（IC）是一个总称，代表一种製造技术，涉及将不同的硅晶片、晶片和晶圆垂直堆迭或整合在一起。这些材料进一步组合成单一封装，其中装置透过硅通孔 (TSV) 和混合键合程式连接。它还包括 3D 晶圆级晶片级封装 (WLCSP)、束重结晶、固相结晶和晶圆键合，作为堆迭过程中使用的标准技术。与二维 (2D) IC 相比，3D IC 在类似的较小面积内以相同的降低功耗提供更高的速度、最小化的占地面积和更好的功能密度。除此之外，它还提供更高的频宽、灵活性和异质集成，确保更快的讯号转换，并实现更好的电气性能。因此，3D IC 作为微电子、光子学、逻辑成像、光电子和感测器等领域的关键组件得到了广泛的应用。

3D IC 市场趋势：

3D IC 在航空航太、汽车、通讯和电信等行业的广泛使用是推动市场成长的关键因素之一。与此一致的是，由于越来越多地购买各种具有卓越功能的紧凑型和先进消费性电子产品（例如笔记型电脑、智慧型手机和平板电脑），电子产业的大幅扩张正在推动市场成长。此外，对具有最低功耗特性的先进电子架构和积体电路的需求不断增长，也促进了市场的成长。在游戏机和感测器等小型电子设备中整合 IC 和使用晶圆级封装的新兴趋势进一步支持了这一点。此外，3D IC在智慧家庭设备中的广泛应用，包括安全锁、恆温器、风扇控制器、智慧型烟雾侦测器、窗户感测器和能源监视器，有利于市场成长。它们也被进一步嵌入到各种医疗保健设备中，例如小型助听器、视觉辅助器以及心臟监视器。消费者对多种产品优势的认识不断提高，包括更快的速度、记忆体、耐用性、效率、效能和减少定时延迟，正在推动市场成长。此外，物联网（IoT）和人工智慧（AI）解决方案与无线技术的整合以及製造商为提高产品产量而推出的先进IC封装系统正在推动市场成长。其他因素，例如对高频宽记忆体（HBM）的需求不断增长和持续的产品多样化，正在积极刺激市场成长。

本报告回答的关键问题：

  • 迄今为止，全球 3D IC 市场表现如何，未来几年又将如何表现？
  • 全球3D IC市场的驱动因素、限制因素和机会是什么？
  • 主要区域市场有哪些？
  • 哪些国家代表了最具吸引力的 3D IC 市场？
  • 依类型划分市场是怎么样的？
  • 基于组件的市场区隔是什么？
  • 基于应用程式的市场区隔是什么？
  • 基于最终用户的市场区隔是什么？
  • 全球3D IC市场竞争格局如何？
  • 全球 3D IC 市场的主要参与者/公司有哪些？

目录

第一章：前言

第 2 章：范围与方法

  • 研究目的
  • 利害关係人
  • 资料来源
    • 主要资源
    • 二手资料
  • 市场预测
    • 自下而上的方法
    • 自上而下的方法
  • 预测方法

第 3 章：执行摘要

第 4 章：简介

  • 概述
  • 主要行业趋势

第 5 章：全球 3D IC 市场

  • 市场概况
  • 市场业绩
  • COVID-19 的影响
  • 市场预测

第 6 章：市场区隔：按类型

  • 堆迭 3D
    • 市场走向
    • 市场预测
  • 整体式 3D
    • 市场走向
    • 市场预测

第 7 章：市场区隔：按组成部分

  • 硅通孔 (TSV)
    • 市场走向
    • 市场预测
  • 玻璃通孔 (TGV)
    • 市场走向
    • 市场预测
  • 硅中介层
    • 市场走向
    • 市场预测

第 8 章：市场区隔：按应用

  • 逻辑
    • 市场走向
    • 市场预测
  • 成像与光电
    • 市场走向
    • 市场预测
  • 记忆
    • 市场走向
    • 市场预测
  • MEMS/感测器
    • 市场走向
    • 市场预测
  • 引领
    • 市场走向
    • 市场预测
  • 其他的
    • 市场走向
    • 市场预测

第 9 章：市场区隔：按最终用户

  • 消费性电子产品
    • 市场走向
    • 市场预测
  • 电信
    • 市场走向
    • 市场预测
  • 汽车
    • 市场走向
    • 市场预测
  • 军事和航太
    • 市场走向
    • 市场预测
  • 医疗设备
    • 市场走向
    • 市场预测
  • 工业的
    • 市场走向
    • 市场预测
  • 其他的
    • 市场走向
    • 市场预测

第 10 章：市场区隔：按地区

  • 北美洲
    • 美国
      • 市场走向
      • 市场预测
    • 加拿大
      • 市场走向
      • 市场预测
  • 亚太
    • 中国
      • 市场走向
      • 市场预测
    • 日本
      • 市场走向
      • 市场预测
    • 印度
      • 市场走向
      • 市场预测
    • 韩国
      • 市场走向
      • 市场预测
    • 澳洲
      • 市场走向
      • 市场预测
    • 印尼
      • 市场走向
      • 市场预测
    • 其他的
      • 市场走向
      • 市场预测
  • 欧洲
    • 德国
      • 市场走向
      • 市场预测
    • 法国
      • 市场走向
      • 市场预测
    • 英国
      • 市场走向
      • 市场预测
    • 义大利
      • 市场走向
      • 市场预测
    • 西班牙
      • 市场走向
      • 市场预测
    • 俄罗斯
      • 市场走向
      • 市场预测
    • 其他的
      • 市场走向
      • 市场预测
  • 拉丁美洲
    • 巴西
      • 市场走向
      • 市场预测
    • 墨西哥
      • 市场走向
      • 市场预测
    • 其他的
      • 市场走向
      • 市场预测
  • 中东和非洲
    • 市场走向
    • 市场细分：按国家/地区
    • 市场预测

第 11 章：驱动因素、限制与机会

  • 概述
  • 司机
  • 限制
  • 机会

第 12 章：价值链分析

第 13 章：波特五力分析

  • 概述
  • 买家的议价能力
  • 供应商的议价能力
  • 竞争程度
  • 新进入者的威胁
  • 替代品的威胁

第 14 章：价格分析

第15章：竞争格局

  • 市场结构
  • 关键参与者
  • 关键参与者简介
    • Advanced Micro Devices Inc.
    • MonolithIC 3D Inc.
Product Code: SR112024A6723

The global 3D IC market size reached US$ 17.0 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 84.7 Billion by 2032, exhibiting a growth rate (CAGR) of 18.96% during 2024-2032. The increasing purchase of various compact and advanced consumer electronic products with superior functionality, such as laptops, smartphones, and tablets, represents the prime factor driving the market.

Three-dimensional (3D) integrated circuit (IC) refers to an umbrella term representing a manufacturing technology that involves stacking or integrating different silicon die, chips and wafers together vertically. These materials are further combined into a single package wherein the device is connected via silicon vias (TSVs) and hybrid bonding procedures. It also encompasses 3D wafer-level chip-scale packaging (WLCSP), beam re-crystallization, solid phase crystallization, and wafer bonding as standard technologies used in the stacking process. As compared to two-dimensional (2D) IC, 3D IC offers higher speed, minimized footprint, and better functional density at the same reduced power in a similar smaller area. Apart from this, it provides higher bandwidth, flexibility, and heterogeneous integration, ensures faster signal transitions, and enables better electrical performances. As a result, 3D IC finds extensive applications as a key component in microelectronics, photonics, logic imaging, optoelectronics, and sensors.

3D IC Market Trends:

The widespread utilization of 3D IC across industries, such as aerospace, automotive and communications and telecom, represents one of the key factors driving the market growth. In line with this, the considerable expansion in the electronics industry on account of the increasing purchase of various compact and advanced consumer electronics products with superior functionality, such as laptops, smartphones, and tablets, is driving the market growth. Moreover, the rising need for advanced electronics architecture and integrated circuits with minimal power consumption properties, is contributing to the market growth. This is further supported by the emerging trend of incorporating ICs and using wafer-level packaging in miniaturized electronic devices, such as gaming consoles and sensors. Additionally, the extensive incorporation of 3D IC in smart home devices, including security locks, thermostats, fan controllers, smart smoke detectors, window sensors, and energy monitors, is favoring the market growth. They are further embedded in diverse healthcare devices, such as small hearing and visual aids and heart monitors. The escalating consumer awareness regarding the multiple product benefits, including better speed, memory, durability, efficiency, performance, and reduced timing delays, is propelling the market growth. Furthermore, the integration of the Internet of Things (IoT) and artificial intelligence (AI) solutions with wireless technologies and the advent of advanced IC packaging systems by manufacturers to improve product production is impelling the market growth. Other factors, such as the fueling need for high-bandwidth memory (HBM) and ongoing product diversification, are positively stimulating the market growth.

Key Market Segmentation:

IMARC Group provides an analysis of the key trends in each segment of the global 3D IC market, along with forecasts at the global, regional, and country level from 2024-2032. Our report has categorized the market based on type, component, application and end user.

Type Insights:

Stacked 3D

Monolithic 3D

The report has also provided a detailed breakup and analysis of the 3D IC market based on the type. This includes stacked and monolithic 3D. According to the report, stacked 3D represented the largest segment.

Component Insights:

Through-Silicon Via (TSV)

Through Glass Via (TGV)

Silicon Interposer

A detailed breakup and analysis of the 3D IC market based on the component has also been provided in the report. This includes through-silicon via (TSV), through glass via (TGV) and silicon interposer. According to the report, through-silicon via (TSV) accounted for the largest market share.

Application Insights:

Logic

Imaging and Optoelectronics

Memory

MEMS/Sensors

LED

Others

The report has also provided a detailed breakup and analysis of the 3D IC market based on the application. This includes logic, imaging and optoelectronics, memory, MEMS/sensors, LED, and others. According to the report, MEMS/sensors represented the largest segment.

End User Insights:

Consumer Electronics

Telecommunication

Automotive

Military and Aerospace

Medical Devices

Industrial

Others

A detailed breakup and analysis of the 3D IC market based on the end user has also been provided in the report. This includes consumer electronics, telecommunication, automotive, military and aerospace, medical devices, industrial and others. According to the report, consumer electronics accounted for the largest market share.

Regional Insights:

North America

United States

Canada

Asia Pacific

China

Japan

India

South Korea

Australia

Indonesia

Others

Europe

Germany

France

United Kingdom

Italy

Spain

Russia

Others

Latin America

Brazil

Mexico

Others

Middle East and Africa

The report has also provided a comprehensive analysis of all the major regional markets that include North America (the United States and Canada), Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others), Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others), Latin America (Brazil, Mexico, and others), and the Middle East and Africa. According to the report, Asia Pacific was the largest market for 3D IC. Some of the factors driving the Asia Pacific 3D IC market included its rapid expansion in the electronics sector and the increasing purchase of compact consumer electronic products with superior functionality.

Competitive Landscape:

The report has also provided a comprehensive analysis of the competitive landscape in the global 3D IC market. Detailed profiles of all major companies have also been provided. Some of the companies covered include Advanced Micro Devices Inc., MonolithIC 3D Inc., etc. Kindly note that this only represents a partial list of companies, and the complete list has been provided in the report.

Key Questions Answered in This Report:

  • How has the global 3D IC market performed so far and how will it perform in the coming years?
  • What are the drivers, restraints, and opportunities in the global 3D IC market?
  • What are the key regional markets?
  • Which countries represent the most attractive 3D IC markets?
  • What is the breakup of the market based on the type?
  • What is the breakup of the market based on the component?
  • What is the breakup of the market based on the application?
  • What is the breakup of the market based on the end user?
  • What is the competitive structure of the global 3D IC market?
  • Who are the key players/companies in the global 3D IC market?

Table of Contents

1 Preface

2 Scope and Methodology

  • 2.1 Objectives of the Study
  • 2.2 Stakeholders
  • 2.3 Data Sources
    • 2.3.1 Primary Sources
    • 2.3.2 Secondary Sources
  • 2.4 Market Estimation
    • 2.4.1 Bottom-Up Approach
    • 2.4.2 Top-Down Approach
  • 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

  • 4.1 Overview
  • 4.2 Key Industry Trends

5 Global 3D IC Market

  • 5.1 Market Overview
  • 5.2 Market Performance
  • 5.3 Impact of COVID-19
  • 5.4 Market Forecast

6 Market Breakup by Type

  • 6.1 Stacked 3D
    • 6.1.1 Market Trends
    • 6.1.2 Market Forecast
  • 6.2 Monolithic 3D
    • 6.2.1 Market Trends
    • 6.2.2 Market Forecast

7 Market Breakup by Component

  • 7.1 Through-Silicon Via (TSV)
    • 7.1.1 Market Trends
    • 7.1.2 Market Forecast
  • 7.2 Through Glass Via (TGV)
    • 7.2.1 Market Trends
    • 7.2.2 Market Forecast
  • 7.3 Silicon Interposer
    • 7.3.1 Market Trends
    • 7.3.2 Market Forecast

8 Market Breakup by Application

  • 8.1 Logic
    • 8.1.1 Market Trends
    • 8.1.2 Market Forecast
  • 8.2 Imaging and Optoelectronics
    • 8.2.1 Market Trends
    • 8.2.2 Market Forecast
  • 8.3 Memory
    • 8.3.1 Market Trends
    • 8.3.2 Market Forecast
  • 8.4 MEMS/Sensors
    • 8.4.1 Market Trends
    • 8.4.2 Market Forecast
  • 8.5 LED
    • 8.5.1 Market Trends
    • 8.5.2 Market Forecast
  • 8.6 Others
    • 8.6.1 Market Trends
    • 8.6.2 Market Forecast

9 Market Breakup by End User

  • 9.1 Consumer Electronics
    • 9.1.1 Market Trends
    • 9.1.2 Market Forecast
  • 9.2 Telecommunication
    • 9.2.1 Market Trends
    • 9.2.2 Market Forecast
  • 9.3 Automotive
    • 9.3.1 Market Trends
    • 9.3.2 Market Forecast
  • 9.4 Military and Aerospace
    • 9.4.1 Market Trends
    • 9.4.2 Market Forecast
  • 9.5 Medical Devices
    • 9.5.1 Market Trends
    • 9.5.2 Market Forecast
  • 9.6 Industrial
    • 9.6.1 Market Trends
    • 9.6.2 Market Forecast
  • 9.7 Others
    • 9.7.1 Market Trends
    • 9.7.2 Market Forecast

10 Market Breakup by Region

  • 10.1 North America
    • 10.1.1 United States
      • 10.1.1.1 Market Trends
      • 10.1.1.2 Market Forecast
    • 10.1.2 Canada
      • 10.1.2.1 Market Trends
      • 10.1.2.2 Market Forecast
  • 10.2 Asia-Pacific
    • 10.2.1 China
      • 10.2.1.1 Market Trends
      • 10.2.1.2 Market Forecast
    • 10.2.2 Japan
      • 10.2.2.1 Market Trends
      • 10.2.2.2 Market Forecast
    • 10.2.3 India
      • 10.2.3.1 Market Trends
      • 10.2.3.2 Market Forecast
    • 10.2.4 South Korea
      • 10.2.4.1 Market Trends
      • 10.2.4.2 Market Forecast
    • 10.2.5 Australia
      • 10.2.5.1 Market Trends
      • 10.2.5.2 Market Forecast
    • 10.2.6 Indonesia
      • 10.2.6.1 Market Trends
      • 10.2.6.2 Market Forecast
    • 10.2.7 Others
      • 10.2.7.1 Market Trends
      • 10.2.7.2 Market Forecast
  • 10.3 Europe
    • 10.3.1 Germany
      • 10.3.1.1 Market Trends
      • 10.3.1.2 Market Forecast
    • 10.3.2 France
      • 10.3.2.1 Market Trends
      • 10.3.2.2 Market Forecast
    • 10.3.3 United Kingdom
      • 10.3.3.1 Market Trends
      • 10.3.3.2 Market Forecast
    • 10.3.4 Italy
      • 10.3.4.1 Market Trends
      • 10.3.4.2 Market Forecast
    • 10.3.5 Spain
      • 10.3.5.1 Market Trends
      • 10.3.5.2 Market Forecast
    • 10.3.6 Russia
      • 10.3.6.1 Market Trends
      • 10.3.6.2 Market Forecast
    • 10.3.7 Others
      • 10.3.7.1 Market Trends
      • 10.3.7.2 Market Forecast
  • 10.4 Latin America
    • 10.4.1 Brazil
      • 10.4.1.1 Market Trends
      • 10.4.1.2 Market Forecast
    • 10.4.2 Mexico
      • 10.4.2.1 Market Trends
      • 10.4.2.2 Market Forecast
    • 10.4.3 Others
      • 10.4.3.1 Market Trends
      • 10.4.3.2 Market Forecast
  • 10.5 Middle East and Africa
    • 10.5.1 Market Trends
    • 10.5.2 Market Breakup by Country
    • 10.5.3 Market Forecast

11 Drivers, Restraints, and Opportunities

  • 11.1 Overview
  • 11.2 Drivers
  • 11.3 Restraints
  • 11.4 Opportunities

12 Value Chain Analysis

13 Porters Five Forces Analysis

  • 13.1 Overview
  • 13.2 Bargaining Power of Buyers
  • 13.3 Bargaining Power of Suppliers
  • 13.4 Degree of Competition
  • 13.5 Threat of New Entrants
  • 13.6 Threat of Substitutes

14 Price Analysis

15 Competitive Landscape

  • 15.1 Market Structure
  • 15.2 Key Players
  • 15.3 Profiles of Key Players
    • 15.3.1 Advanced Micro Devices Inc.
      • 15.3.1.1 Company Overview
      • 15.3.1.2 Product Portfolio
      • 15.3.1.3 SWOT Analysis
    • 15.3.2 MonolithIC 3D Inc.
      • 15.3.2.1 Company Overview
      • 15.3.2.2 Product Portfolio

Kindly, note that this only represents a partial list of companies, and the complete list has been provided in the report

List of Figures

  • Figure 1: Global: 3D IC Market: Major Drivers and Challenges
  • Figure 2: Global: 3D IC Market: Sales Value (in Billion US$), 2018-2023
  • Figure 3: Global: 3D IC Market Forecast: Sales Value (in Billion US$), 2024-2032
  • Figure 4: Global: 3D IC Market: Breakup by Type (in %), 2023
  • Figure 5: Global: 3D IC Market: Breakup by Component (in %), 2023
  • Figure 6: Global: 3D IC Market: Breakup by Application (in %), 2023
  • Figure 7: Global: 3D IC Market: Breakup by End User (in %), 2023
  • Figure 8: Global: 3D IC Market: Breakup by Region (in %), 2023
  • Figure 9: Global: 3D IC (Stacked 3D) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 10: Global: 3D IC (Stacked 3D) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 11: Global: 3D IC (Monolithic 3D) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 12: Global: 3D IC (Monolithic 3D) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 13: Global: 3D IC (Through-Silicon Via (TSV)) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 14: Global: 3D IC (Through-Silicon Via (TSV)) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 15: Global: 3D IC (Through Glass Via (TGV)) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 16: Global: 3D IC (Through Glass Via (TGV)) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 17: Global: 3D IC (Silicon Interposer) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 18: Global: 3D IC (Silicon Interposer) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 19: Global: 3D IC (Logic) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 20: Global: 3D IC (Logic) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 21: Global: 3D IC (Imaging and Optoelectronics) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 22: Global: 3D IC (Imaging and Optoelectronics) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 23: Global: 3D IC (Memory) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 24: Global: 3D IC (Memory) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 25: Global: 3D IC (MEMS/Sensors) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 26: Global: 3D IC (MEMS/Sensors) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 27: Global: 3D IC (LED) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 28: Global: 3D IC (LED) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 29: Global: 3D IC (Other Applications) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 30: Global: 3D IC (Other Applications) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 31: Global: 3D IC (Consumer Electronics) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 32: Global: 3D IC (Consumer Electronics) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 33: Global: 3D IC (Telecommunication) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 34: Global: 3D IC (Telecommunication) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 35: Global: 3D IC (Automotive) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 36: Global: 3D IC (Automotive) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 37: Global: 3D IC (Military and Aerospace) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 38: Global: 3D IC (Military and Aerospace) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 39: Global: 3D IC (Medical Devices) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 40: Global: 3D IC (Medical Devices) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 41: Global: 3D IC (Industrial) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 42: Global: 3D IC (Industrial) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 43: Global: 3D IC (Other End Users) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 44: Global: 3D IC (Other End Users) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 45: North America: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 46: North America: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 47: United States: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 48: United States: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 49: Canada: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 50: Canada: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 51: Asia-Pacific: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 52: Asia-Pacific: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 53: China: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 54: China: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 55: Japan: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 56: Japan: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 57: India: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 58: India: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 59: South Korea: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 60: South Korea: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 61: Australia: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 62: Australia: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 63: Indonesia: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 64: Indonesia: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 65: Others: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 66: Others: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 67: Europe: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 68: Europe: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 69: Germany: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 70: Germany: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 71: France: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 72: France: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 73: United Kingdom: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 74: United Kingdom: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 75: Italy: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 76: Italy: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 77: Spain: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 78: Spain: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 79: Russia: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 80: Russia: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 81: Others: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 82: Others: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 83: Latin America: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 84: Latin America: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 85: Brazil: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 86: Brazil: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 87: Mexico: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 88: Mexico: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 89: Others: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 90: Others: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 91: Middle East and Africa: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 92: Middle East and Africa: 3D IC Market: Breakup by Country (in %), 2023
  • Figure 93: Middle East and Africa: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 94: Global: 3D IC Industry: Drivers, Restraints, and Opportunities
  • Figure 95: Global: 3D IC Industry: Value Chain Analysis
  • Figure 96: Global: 3D IC Industry: Porter's Five Forces Analysis

List of Tables

  • Table 1: Global: 3D IC Market: Key Industry Highlights, 2023 and 2032
  • Table 2: Global: 3D IC Market Forecast: Breakup by Type (in Million US$), 2024-2032
  • Table 3: Global: 3D IC Market Forecast: Breakup by Component (in Million US$), 2024-2032
  • Table 4: Global: 3D IC Market Forecast: Breakup by Application (in Million US$), 2024-2032
  • Table 5: Global: 3D IC Market Forecast: Breakup by End User (in Million US$), 2024-2032
  • Table 6: Global: 3D IC Market Forecast: Breakup by Region (in Million US$), 2024-2032
  • Table 7: Global: 3D IC Market: Competitive Structure
  • Table 8: Global: 3D IC Market: Key Player