查看购物车
  • Traditional Chinese
  • English
  • Japanese
封面
市场调查报告书
商品编码
1416808

半导体抛光垫片市场报告：2030 年趋势、预测与竞争分析

Semiconductor Polishing Pads Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 - page report | 商品交期: 3个工作天内

价格

※ 本网页内容可能与最新版本有所差异。详细情况请与我们联繫。

简介目录

半导体抛光垫片趋势与预测

预计到 2030 年，全球半导体抛光垫片市场将达到 11 亿美元，2024 年至 2030 年复合年增长率为 5.7%。该市场的主要驱动力是5G、物联网、人工智慧、电子设备小型化趋势的上升以及半导体晶圆在各种应用中的使用不断增加。全球半导体抛光垫片市场的未来前景广阔，300毫米晶圆和200毫米晶圆市场存在机会。

半导体抛光垫片市场洞察

Lucintel 预计在预测期内会有更高的增长，因为硬质 CMP垫片由聚氨酯等更坚固的材料製成，使其适合主动去除晶圆表面多余的材料。我预测是这样的。

由于该地区最大的两个经济体中国和印度的汽车和电子行业的扩张，以及韩国、日本和中国电子行业足迹的扩大，预计亚太地区在预测期内将经历最高的增长。 它一直。

常问问题

Q1.市场规模为：

A1. 到2030年，全球半导体抛光垫片市场预计将达到11亿美元。

Q2.市场成长预测是多少：

A2. 2024年至2030年，全球半导体抛光垫片市场预计将以5.7%的复合年增长率成长。

Q3.影响市场成长的主要驱动因素是：

A3. 该市场的主要驱动力是5G、物联网和人工智慧等最尖端科技的日益普及、电子设备小型化趋势的增强以及半导体晶圆在各种应用中的使用不断增加。

Q4.市场的主要细分市场是：

A4. 半导体抛光垫片市场前景看好，300毫米晶圆和200毫米晶圆市场有机会。

Q5.市场的主要企业是：

A5. 主要半导体抛光垫片公司如下。

  • DuPont
  • 3M
  • Cabot Corporation
  • Amtech System
  • FNS POWER TECHNOLOGY
  • Fujibo
  • TWI Innovation Network

Q6.未来最大的细分市场是什么？

A6.Lucintel 预计在预测期内会有更高的成长，因为硬 CMP垫片由聚氨酯等更坚固的材料製成，使其适合主动去除晶圆表面的多余材料。我们预测

Q7. 未来五年预计哪些地区的市场成长最大？

A7. 由于该地区最大的两个经济体中国和印度的汽车和电子行业的扩张，以及韩国、日本和中国电子行业足迹的扩大，预计亚太地区在预测期内将经历最高的增长。这是预料之中的。

Q8. 可以客製化报告吗？

A8. 是的，Lucintel 提供 10% 的客製化服务，无需额外付费。

目录

第一章执行摘要

第二章全球半导体抛光垫片市场：市场动态

  • 简介、背景、分类
  • 供应链
  • 产业驱动因素与挑战

第三章 2018-2030年市场趋势及预测分析

  • 宏观经济趋势（2018-2023）与预测（2024-2030）
  • 全球半导体抛光垫片市场趋势（2018-2023）与预测（2024-2030）
  • 全球半导体抛光垫片市场，依类型
    • 硬质 CMP垫片
    • 软质 CMP垫片
  • 全球半导体抛光垫片市场（按应用）
    • 300m晶圆
    • 200毫米晶圆
    • 其他的

第四章 2018-2030年区域市场趋势及预测分析

  • 全球半导体抛光垫片市场区域分布
  • 北美半导体抛光垫片市场
  • 欧洲半导体抛光垫片市场
  • 亚太半导体抛光垫片市场
  • 其他地区半导体抛光垫片市场

第五章 竞争分析

  • 产品系列分析
  • 营运整合
  • 波特五力分析

第六章 成长机会与策略分析

  • 成长机会分析
    • 按类型分類的全球半导体抛光垫片市场成长机会
    • 全球半导体抛光垫片市场成长机会（按应用）
    • 按地区分類的全球半导体抛光垫片市场成长机会
  • 全球半导体抛光垫片市场新趋势
  • 战略分析
    • 新产品开发
    • 全球半导体抛光垫片市场产能扩张
    • 全球半导体抛光垫片市场的併购、收购和合资企业
    • 认证和许可

第七章主要企业概况

  • DuPont
  • 3M
  • Cabot Corporation
  • Amtech System
  • FNS POWER TECHNOLOGY
  • Fujibo
  • TWI Innovation Network
简介目录

Semiconductor Polishing Pads Trends and Forecast

The future of the global semiconductor polishing pads market looks promising with opportunities in the 300 mm wafer and 200 mm wafer markets. The global semiconductor polishing pads market is expected to reach an estimated $1.1 billion by 2030 with a CAGR of 5.7% from 2024 to 2030. The major drivers for this market are increasing uptake of cutting-edge technology like 5G, the internet of things, and artificial intelligence, growing tendency of electronic device miniaturization, and increasing use of semiconductor wafers in various applications.

A more than 150-page report is developed to help in your business decisions.

Semiconductor Polishing Pads by Segment

The study includes a forecast for the global semiconductor polishing pads by type, application, and region.

Semiconductor Polishing Pads Market by Type [Shipment Analysis by Value from 2018 to 2030]:

  • Hard CMP Pads
  • Soft CMP Pads

Semiconductor Polishing Pads Market by Application [Shipment Analysis by Value from 2018 to 2030]:

  • 300M Wafer
  • 200Mm Wafer
  • Others

Semiconductor Polishing Pads Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Semiconductor Polishing Pads Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies semiconductor polishing pads companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the semiconductor polishing pads companies profiled in this report include-

  • DuPont
  • 3M
  • Cabot Corporation
  • Amtech System
  • FNS POWER TECHNOLOGY
  • Fujibo
  • TWI Innovation Network

Semiconductor Polishing Pads Market Insights

Lucintel forecasts that hard cmp pads is expected to witness the higher growth over the forecast period because of construction of more robust materials, such as polyurethane, and are appropriate for removing superfluous material from the wafer surface in an aggressive manner.

APAC is expected to witness highest growth over the forecast period due to expansion of the automobile and electronics industries in the region's two largest economies, China and India, as well as the expanding electronics industry hubs in South Korea, Japan, and China.

Features of the Global Semiconductor Polishing Pads Market

Market Size Estimates: Semiconductor polishing pads market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Semiconductor polishing pads market size by type, application, and region in terms of value ($B).

Regional Analysis: Semiconductor polishing pads market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different type, application, and regions for the semiconductor polishing pads market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the semiconductor polishing pads market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the semiconductor polishing pads market size?

Answer: The global semiconductor polishing pads market is expected to reach an estimated $1.1 billion by 2030.

Q2. What is the growth forecast for semiconductor polishing pads market?

Answer: The global semiconductor polishing pads market is expected to grow with a CAGR of 5.7% from 2024 to 2030.

Q3. What are the major drivers influencing the growth of the semiconductor polishing pads market?

Answer: The major drivers for this market are increasing uptake of cutting-edge technology like 5G, the internet of things, and artificial intelligence, growing tendency of electronic device miniaturization and increasing use of semiconductor wafers in various applications.

Q4. What are the major segments for semiconductor polishing pads market?

Answer: The future of the semiconductor polishing pads market looks promising with opportunities in the 300 mm wafer and 200 mm wafer markets.

Q5. Who are the key semiconductor polishing pads market companies?

Answer: Some of the key semiconductor polishing pads companies are as follows:

  • DuPont
  • 3M
  • Cabot Corporation
  • Amtech System
  • FNS POWER TECHNOLOGY
  • Fujibo
  • TWI Innovation Network

Q6. Which semiconductor polishing pads market segment will be the largest in future?

Answer: Lucintel forecasts that hard cmp pads is expected to witness the higher growth over the forecast period because of construction of more robust materials, such as polyurethane, and are appropriate for removing superfluous material from the wafer surface in an aggressive manner.

Q7. In semiconductor polishing pads market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period due to expansion of the automobile and electronics industries in the region's two largest economies, China and India, as well as the expanding electronics industry hubs in South Korea, Japan, and China.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the semiconductor polishing pads market by type (hard cmp pads and soft cmp pads), application (300m wafer, 200mm wafer, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Semiconductor Polishing Pads Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Semiconductor Polishing Pads Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Semiconductor Polishing Pads Market by Type
    • 3.3.1: Hard CMP Pads
    • 3.3.2: Soft CMP Pads
  • 3.4: Global Semiconductor Polishing Pads Market by Application
    • 3.4.1: 300m Wafer
    • 3.4.2: 200mm Wafer
    • 3.4.3: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Semiconductor Polishing Pads Market by Region
  • 4.2: North American Semiconductor Polishing Pads Market
    • 4.2.2: North American Semiconductor Polishing Pads Market by Application: 300m Wafer, 200mm Wafer, and Others
  • 4.3: European Semiconductor Polishing Pads Market
    • 4.3.1: European Semiconductor Polishing Pads Market by Type: Hard CMP Pads and Soft CMP Pads
    • 4.3.2: European Semiconductor Polishing Pads Market by Application: 300m Wafer, 200mm Wafer, and Others
  • 4.4: APAC Semiconductor Polishing Pads Market
    • 4.4.1: APAC Semiconductor Polishing Pads Market by Type: Hard CMP Pads and Soft CMP Pads
    • 4.4.2: APAC Semiconductor Polishing Pads Market by Application: 300m Wafer, 200mm Wafer, and Others
  • 4.5: ROW Semiconductor Polishing Pads Market
    • 4.5.1: ROW Semiconductor Polishing Pads Market by Type: Hard CMP Pads and Soft CMP Pads
    • 4.5.2: ROW Semiconductor Polishing Pads Market by Application: 300m Wafer, 200mm Wafer, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Semiconductor Polishing Pads Market by Type
    • 6.1.2: Growth Opportunities for the Global Semiconductor Polishing Pads Market by Application
    • 6.1.3: Growth Opportunities for the Global Semiconductor Polishing Pads Market by Region
  • 6.2: Emerging Trends in the Global Semiconductor Polishing Pads Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Semiconductor Polishing Pads Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Semiconductor Polishing Pads Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: DuPont
  • 7.2: 3M
  • 7.3: Cabot Corporation
  • 7.4: Amtech System
  • 7.5: FNS POWER TECHNOLOGY
  • 7.6: Fujibo
  • 7.7: TWI Innovation Network