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市场调查报告书
商品编码
1536975

面板级封装的全球市场：市场占有率分析、产业趋势/统计、成长预测（2024-2029）

Panel Level Packaging - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2024 - 2029)
出版日期: | 出版商: Mordor Intelligence | 英文 112 Pages | 商品交期: 2-3个工作天内

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简介目录

预计2024年全球面板级封装市场规模将达2.5亿美元，2029年将达13.8亿美元，预计在预测期内（2024-2029年）复合年增长率为41.07%。

面板级封装市场

半导体产业正在经历快速成长，半导体已成为所有现代技术的基本组成部分。该领域的进步和创新对所有下游技术产生直接影响，从而推动了市场研究的需求。

主要亮点

  • 随着半导体产业重要性的增加，对增强封装解决方案的需求也在增加，从而导致了新的半导体封装技术的发展。
  • 面板级封装（PLP）是最近备受关注的技术。 PLP是指以面板尺寸加工的半导体封装。对于面板级封装，组装过程包括面板级的晶片贴装、重新布线、成型和凸块製造。
  • 由于更多的封装以面板并行格式进行处理，因此与圆形晶圆几何形状相比，这种类型的封装提供了更好的面积利用率（面板/晶圆尺寸与封装尺寸之间的差异） 。因此，包装成本的降低已成为市场成长的主要动力之一。 PLP 对环境的影响也很小，因为它产生的废弃物较少，碳足迹也较少。
  • 面板级封装（PLP）市场也面临挑战。该技术的高成本及其实施的复杂性可能会阻碍其广泛接受。封装製程有两种类型：模具领先型和RDL领先型。然而，这种封装类型会带来晶片移位的问题。晶片移位被认为是最大的问题之一，因为它会降低产量比率或对产量比率产生负面影响。这增加了对包装过程进行更大控制的需求，从而增加了复杂性并限制了市场成长。
  • 在后 COVID-19 时期，由于成本效益以及从晶圆到大型面板格式的封装尺寸的增加，面板级封装预计将获得更多关注。并行製造的封装数量的增加也是支持市场成长的主要优势。 PLP 可以采用其他技术领域的製程、材料和设备。印刷电路基板(PCB)、液晶显示器 (LCD)、太阳能设备等均以面板尺寸製造，为扇出面板级封装提供了一种新方法。

面板级封装市场趋势

市场区隔：家电产业占主要份额

  • 智慧型手机、穿戴式装置、平板装置等家用电器变得越来越薄、越来越小。为了满足更小尺寸和更轻重量的需求，PLP 允许製造商增加组件密度并更有效地利用空间。对于这些设备，PLP 减少的占地面积对于实现复杂的设计和充分利用可用空间至关重要。
  • 消费性电子产业与努力实现产品差异化的製造商竞争。 PLP 透过在消费性电子产品中实现复杂的设计、增加的功能和改进的性能来提供市场优势。为了维持市场地位，製造商正在利用 PLP 来满足消费者需求并推出创新产品。
  • 近年来，5G和物联网的日益普及为市场创造了巨大的成长机会。例如，根据 5G Americas 的数据，全球 5G 用户数量预计在 2024 年将达到 28 亿，2027 年将达到 59 亿。
  • 随着5G投资的增加，对相容5G的智慧型手机的需求也随之增加。 Cyber​​media Research 的一份报告显示，自 2020 年首次推出以来，5G 智慧型手机销量增长了 13 倍，到 2023年终，5G 智慧型手机出货量每年增长 70%。 5G智慧型手机的市场占有率预计到2023年将达到45%，而2020年仅为4%。
  • 同样，由于物联网 (IoT) 的日益普及，连接设备的数量近年来也迅速增加，物联网是一种使用互联网和支援 IP 的通讯协定来实现物与人之间通讯的技术。例如，据思科称，到 2023 年，连网设备数量将达到 293 亿台。物联网用例的显着扩展预计将成为市场成长的主要驱动力。

中国可望引领市场

  • 中国是最大的半导体消费国，这主要得益于国内电子市场的规模。该国是世界上最大的消费性电子产品生产国和出口国，许多全球供应商都建立了设施以利用低廉的劳动力成本。
  • 电子製造业近期也持续稳定扩张。根据工业信部《中国日报》报道，2023年，电子资讯製造业主要企业付加增加价值年均成长3.4%。工信部表示，主要产品中，行动电话产量15.7亿部，与前一年同期比较成长6.9%，其中智慧型手机11.4亿部，与前一年同期比较成长1.9%。近年来，为促进电子产业的成长做出了多项努力。
  • 中国在5G采用方面也处于世界领先地位。根据工业和资讯化部 (MIIT) 的数据，截至 2023 年 2 月，中国的 5G 用户目标为 5.9201 亿。到 2025 年，这一数字预计将超过 10 亿。基础设施建设正在进行中，以扩大 5G 在中国的普及。
  • 例如，截至2023年10月，中国约有322万个5G基地台，占所有行动基地台的28.1%。
  • 随着5G在日本的普及，5G相容设备的普及也不断增加。例如，根据中国通讯研究院预测，2023年全国5G智慧型手机出货量将与前一年同期比较增加约11.9%，达到2.4亿台，整体智慧型手机出货量市场将与前一年同期比较增加约1.1%。这些趋势预计将有利于该国研究市场的成长，因为先进的封装技术可以帮助解决 5G 晶片的许多性能要求。
  • 此外，中国在生产和消费方面均领先汽车市场，预计将有利于该国的市场成长。对更清洁、更安全的车辆的需求不断增长是该国汽车行业的主要趋势之一，并正在推动所研究市场的成长。自动驾驶汽车、电气化、机舱丰富化、连接性和软体定义以及区域架构等主要行业趋势也支持汽车行业的市场成长。

面板级封装产业概述

面板级封装市场处于半固化状态，主要参与者包括三星电子、英特尔公司、Nepes 公司、日月光集团和力成科技公司。市场公司正在采取联盟和收购等策略来增强其产品阵容并获得永续的竞争优势。

  • 2023年12月－NEPES开发了“METIS”，一种用于边缘运算的智慧半导体。 Metis 采用了 Nepes 尖端 2.5D 和 3D 封装平台 nePACTM 中的 cx-BGA（球栅阵列）。 nePACTM是新一代尖端封装技术，基于扇出技术和覆晶接合技术，实现多层布线和精细RDL布线。适用于人工智慧半导体等高整合、高性能晶片。
  • 2023年6月－日月光科技控股子公司环旭电子在波兰设立工厂。此举反映出欧洲客户对该公司产品的需求不断成长。此次扩建将使环旭电子能够在波兰生产更多产品，以满足客户需求并因应市场成长。

其他好处：

  • Excel 格式的市场预测 (ME) 表
  • 3 个月的分析师支持

目录

第一章 简介

  • 研究假设和市场定义
  • 调查范围

第二章调查方法

第三章执行摘要

第四章市场洞察

  • 市场概况
  • 产业吸引力－波特五力分析
    • 供应商的议价能力
    • 买方议价能力
    • 新进入者的威胁
    • 替代品的威胁
    • 竞争公司之间敌对关係的强度
  • 产业价值链/供应链分析
  • 评估宏观经济因素对市场的影响

第五章市场动态

  • 市场驱动因素
    • 降低封装製程成本
    • 对小型、高性能电子设备的需求不断增长
    • 加大研发投入
  • 市场限制因素
    • 包装工艺复杂

第六章 市场细分

  • 按工业用途
    • 家电
    • 车
    • 通讯
    • 其他工业应用
  • 按地区
    • 美国
    • 中国
    • 韩国
    • 台湾
    • 日本
    • 欧洲
    • 世界其他地区

第七章 竞争格局

  • 公司简介
    • Samsung Electronics Co. Ltd
    • Intel Corporation
    • Nepes Corporation
    • ASE Group
    • Powertech Technology Inc.
    • Fraunhofer Institute for Reliability and Micro integration IZM
    • Unimicron Technology Corporation
    • DECA Technologies Inc.
    • JCET/STATSChipPAC

第八章投资分析

第9章市场的未来

简介目录
Product Code: 66590

The Panel Level Packaging Market size is estimated at USD 0.25 billion in 2024, and is expected to reach USD 1.38 billion by 2029, growing at a CAGR of 41.07% during the forecast period (2024-2029).

Panel Level Packaging - Market

The semiconductor industry is witnessing rapid growth, with semiconductors emerging as the basic building blocks of all modern technology. The advancements and innovations in this field directly impact all downstream technologies and drive the need for the market studied.

Key Highlights

  • With the importance of the semiconductor industry growing, the demand for enhanced packaging solutions is also increasing, leading to the development of new semiconductor packaging techniques.
  • Panel-level packaging (PLP) is a technology that has gained prominence recently. PLP refers to semiconductor packaging processed on a panel size. In panel-level packaging, the assembly process includes the fabrication of die attach, redistribution lines, molding, and bumping at the panel level.
  • As more packages may be processed in panel and parallel formats, this type of packaging facilitates a much better area utilization (ratio between panel/wafer size and package size) compared to round wafer shapes. Hence, a lower packaging cost is among the primary drivers for the market's growth. PLP has a lower environmental impact due to a lower waste generation and carbon footprint.
  • The panel-level packaging (PLP) market also encounters certain challenges. The substantial expenses linked to the technology and the intricate nature of its implementation might impede its extensive acceptance. The packaging process involves both types, mold first and RDL first. However, the type of packaging involves problems in die shift. Shifting the die is considered one of the biggest issues as it may cause lesser yield or negatively influence the yields. This increases the need for more control over the packaging process and adds complexity, restraining the market's growth.
  • In the post-COVID-19 period, the focus on panel-level packaging is anticipated to increase due to the cost benefits and the expansion of the packaging size from wafers to larger panel formats. Increasing the number of packages manufactured in parallel is another major advantage supporting the market's growth. PLP may adopt processes, materials, and equipment from other technology areas. Printed circuit boards (PCB), liquid crystal displays (LCD), or solar equipment are manufactured on panel sizes and offer new approaches for fan-out panel-level packaging.

Panel Level Packaging Market Trends

Consumer Electronics Segment to Hold Major Market Share

  • Consumer electronics such as smartphones, wearables, and tablets are becoming increasingly thin and compact. To meet the needs of miniaturization and light form factors, PLP allows manufacturers to achieve greater component density and more efficient use of space. For these devices, the reduced footprint caused by PLP is essential as it will enable sleek designs and maximize their utilization of available space.
  • The consumer electronics industry competes with manufacturers who strive to differentiate products. By enabling sleek designs, increased functionality, and improved performance for consumer electronics devices, PLP provides an advantage to the market. To maintain their position in the market, manufacturers take advantage of PLP to meet consumer demands and introduce innovative products.
  • The increasing penetration of 5G and IoT in recent years presents significant growth opportunities for the market. For instance, as per 5G Americas, the 5G subscriptions worldwide are estimated to reach 2.8 billion in 2024 and 5.9 billion by 2027.
  • With the rising investments in 5G, the demand for 5G-enabled smartphones is also increasing parallelly. According to a report from Cybermedia Research, by the end of 2023, after recording a 13 times increase in 5G smartphone sales since its first introduction in 2020, shipments of 5G smartphones increased by 70% yearly. From only 4% in 2020, 5G smartphones were projected to capture a possible 45% market share in 2023.
  • Similarly, owing to the rising adoption of the Internet of Things (IoT), the technology that enables communications between things and people using the Internet and IP-enabled protocols, the number of connected devices has been increasing rapidly in recent years. For instance, as per Cisco, there would be 29.3 billion networked devices in 2023. The massive expansion in IoT use cases will provide a significant impetus to market growth.

China is Expected to Lead the Market

  • China is the largest semiconductor consumer, primarily due to the size of the domestic electronics market. The country is the world's largest producer and exporter of consumer electronics, as a significantly more significant number of global vendors have established their facilities to leverage the benefits of cheap labor costs.
  • The electronics manufacturing industry has also recently continued to maintain steady expansion. As per a report by the Ministry of Industry and Information Technology via China Daily, in 2023, the industrial added value of major companies in the electronic information manufacturing sector grew by 3.4% yearly. According to the ministry, among significant products, the output of mobile phones increased by 6.9% Y-o-Y to 1.57 billion units, within which the number of smartphones increased by 1.9% Y-o-Y to 1.14 billion units. Several initiatives have been taken in recent years to boost the electronics industry's growth.
  • China also leads in 5G adoption globally. According to the Ministry of Industry and Information Technology (MIIT), China aims to have 592.01 million 5G users as of February 2023. This number is anticipated to surpass 1 billion mark by 2025. A combined effort is being made to develop the supporting infrastructure to expand the footprint of 5G across the country.
  • For instance, as of October 2023, China had about 3.22 million 5G base stations, constituting 28.1% of its entire mobile base station.
  • The growing implementation of 5G in the country has also increased the uptake of 5G-enabled devices. For instance, according to the China Academy of Information and Communications Technology (CAICT), in 2023, 5G smartphone shipments in the country grew by about 11.9% Y-o-Y to 240 million units, while the overall smartphone shipments market grew by about 1.1%, compared to the previous year. As advanced packaging technologies may help resolve many of the 5G chip performance requirements, such trends are anticipated to favor the studied market's growth in the country.
  • China is also a leading automotive market in production and consumption, which is anticipated to favor the market's growth in the country. The rising demand for cleaner and safer vehicles is among the major trends in the country's automotive industry, which supports the studied market's growth. Industry megatrends, including autonomous vehicles, electrification, enriched cabins, connectivity and software definition, and zonal architecture, also support the market's growth in the automotive segment.

Panel Level Packaging Industry Overview

The panel level packaging market is semi-consolidated with the presence of major players like Samsung Electronics Co. Ltd, Intel Corporation, Nepes Corporation, ASE Group, and Powertech Technology Inc. Players in the market are adopting strategies such as partnerships and acquisitions to enhance their product offerings and gain sustainable competitive advantage.

  • December 2023 - NEPES developed 'METIS,' an intelligent semiconductor for edge computing. Metis applied cx-BGA (Ball Grid Array) of nePACTM, Nepes' cutting-edge 2.5D & 3D package platform. nePACTM is a next-generation cutting-edge package technology that implements multi-layer and fine RDL wiring based on fan-out technology and flip-chip bonding technology. It is suitable for highly integrated, high-performance chips such as artificial intelligence semiconductors.
  • June 2023 - USI, a subsidiary of ASE Technology Holding Co. Ltd, inaugurated another factory in Poland. This move reflects the growing need for the company's products from European customers. By expanding, USI may make more goods in Poland, meet customer needs, and keep up with market growth.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.2.1 Bargaining Power of Suppliers
    • 4.2.2 Bargaining Power of Buyers
    • 4.2.3 Threat of New Entrants
    • 4.2.4 Threat of Substitute Products
    • 4.2.5 Intensity of Competitive Rivalry
  • 4.3 Industry Value Chain/Supply Chain Analysis
  • 4.4 Assessment of Impact of Macroeconomic Factors on the Market

5 MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Reduced Cost of Packaging Process
    • 5.1.2 Increasing Demand for Compact and High Functionality Electronic Devices
    • 5.1.3 Increased Investment on Research and Development Activities
  • 5.2 Market Restraints
    • 5.2.1 Complexity in Packaging Process

6 MARKET SEGMENTATION

  • 6.1 By Industry Application
    • 6.1.1 Consumer Electronics
    • 6.1.2 Automotive
    • 6.1.3 Telecommunication
    • 6.1.4 Other Industry Applications
  • 6.2 By Geography
    • 6.2.1 United States
    • 6.2.2 China
    • 6.2.3 Korea
    • 6.2.4 Taiwan
    • 6.2.5 Japan
    • 6.2.6 Europe
    • 6.2.7 Rest of the World

7 COMPETITIVE LANDSCAPE

  • 7.1 Company Profiles*
    • 7.1.1 Samsung Electronics Co. Ltd
    • 7.1.2 Intel Corporation
    • 7.1.3 Nepes Corporation
    • 7.1.4 ASE Group
    • 7.1.5 Powertech Technology Inc.
    • 7.1.6 Fraunhofer Institute for Reliability and Micro integration IZM
    • 7.1.7 Unimicron Technology Corporation
    • 7.1.8 DECA Technologies Inc.
    • 7.1.9 JCET/ STATSChipPAC

8 INVESTMENT ANALYSIS

9 FUTURE OF THE MARKET