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市场调查报告书
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1548574

半导体封装：市场占有率分析、产业趋势与统计、成长预测（2024-2029）

Semiconductor Packaging - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2024 - 2029)
出版日期: | 出版商: Mordor Intelligence | 英文 169 Pages | 商品交期: 2-3个工作天内

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简介目录

预计2024年半导体封装市场规模为973亿美元，2029年将达1,367.7亿美元，预测期内（2024-2029年）复合年增长率为7.05%。

半导体封装市场

半导体封装是指由塑胶、陶瓷、金属、玻璃等製成的封装一个或多个离散半导体装置或积体电路的外壳。封装对于保护电子系统免受高频噪音发射、静电放电、机械损坏和冷却至关重要。

高效能运算、资料中心网路和自动驾驶汽车正在推动该市场的采用率并加速技术发展。趋势是在云端、边缘运算和设备层面拥有更大的运算资源。通讯业和基础设施产业中高端性能应用和人工智慧 (AI) 的成长也推动了所研究市场的进步。

随着前端节点变得更小，设计成本变得更加重要。先进封装 (AP) 解决方案可提高系统效能，同时降低成本并提供低延迟、更高的频宽和能源效率，有助于解决这些问题。

职场的日益数位化、远端工作和远端控制趋势的出现以及消费者对电子设备的偏好正在推动对半导体设备的需求，从而释放出广泛的新机会。随着半导体装置的成长不断加速，先进的封装技术提供了数位化时代所需的尺寸和处理能力。

世界各国政府正透过降低障碍、增加生产、研发补贴等方式加大对半导体产业的支持。例如，韩国投入了高达4,560亿美元的私人投资来建造全球最大的晶片中心，凸显了其主导该产业的野心。

同时，韩国政府推出了针对半导体产业的广泛支持措施，金额达26兆韩元（约191亿美元）。该计划涵盖财政援助、基础设施发展、研发以及对中小企业的有针对性的支持。韩国目前正在首尔郊区建造一个“巨型晶片丛集”，预计将成为世界上最大的半导体中心，并成为创造大量新就业机会的关键驱动力。

设计、开发和安装半导体封装设备以满足各种行业的需求，包括汽车、消费性电子、医疗保健、IT/通讯和航太/国防，需要大量的初始投资。这可能会限制半导体封装市场的成长。

此外，国防预算也受到通货膨胀、经济成长、政府支出优先事项、全球贸易和地缘政治动态等关键宏观经济因素的显着影响。

2023年3月，总统拜登提提案美国和平时期最大的国防预算，总额达8,860亿美元。预算包括士兵加薪 5.2% 以及创纪录的研发累计。俄罗斯在乌克兰的行动进一步强调了增加弹药支出的必要性。

据美国预算办公室称，美国国防支出将持续成长，预计持续到 2033 年。 2023年，美国将在国防支出上花费7,460亿美元，预计到2033年将增加到1.1兆美元。

半导体封装市场趋势

通讯/电讯领域作为最终用户正在快速成长

  • 网路和连接的演变是显而易见的。我们从透过有线基础设施交换音讯和视讯讯号的基本交换发展到目前透过无线基础设施交换多媒体和大量资料的状态。
  • 半导体对于通讯基础设施至关重要，可处理从资料撷取和编码到加密、传输以及最终呈现给使用者的各种任务。 5G 技术预示着 IT 和通讯网路及设备的重大飞跃，提供显着更快的速度，重点，极低的延迟。这种延迟的减少对于云端游戏和 VR 内容流等应用程式尤其重要。因此，通讯和通讯业对半导体的需求不断增长预计将推动半导体封装市场的成长。
  • 同样，2024年2月，美国政府拨款4,200万美元加速美国无线创新。这些资金专门用于一个涉及美国通讯业者、国际通讯业者、领先大学和设备供应商的合作计划。该倡议旨在在达拉斯技术走廊建立一个测试、评估和研发中心，并在华盛顿特区建立一个卫星设施。这些设施的主要重点是测试网路效能、确保互通性、加强安全措施并引领新测试方法的探索。
  • 同样在 2023 年 4 月，爱立信宣布有意与加拿大政府合作，在五年内投资 4.7 亿加元（3.4544 亿美元）。这项投资主要用于6G、5G Advanced、人工智慧、Cloud RAN和核心网路等技术的研发。该倡议的目的是促进该地区通讯业的发展并支持研究设施的发展。此类投资将激增对通讯业广泛使用的半导体装置的需求，进一步推动市场成长。
  • 2024年，新兴国家的通讯业展现出技术进步与策略市场起源的结合。采用创新和先进的半导体解决方案将在这一转变中发挥关键作用，满足对连接和速度日益增长的需求，并解决安全性、永续性和客製化用户体验等关键因素。随着不断进步，电讯和半导体技术之间的合作预计将对全球数位格局产生重大影响。
  • 云端技术的日益普及、资料中心的渗透率不断提高以及5G技术的日益普及，进一步支持了半导体封装市场的成长。资料中心和云端市场的全球扩张预计将刺激资料储存的需求并进一步推动市场成长。例如，根据 Cloudscene 的数据，截至 2024 年 3 月，美国有 5,381 个资料中心，比世界上任何其他国家都多。

台湾预计将占较大市场占有率

  • 台湾是台积电（台积电）和联电（联华）等主要半导体製造商的所在地。这些公司的强大存在正在创造对先进封装解决方案的需求。
  • 例如，2024年3月，台积电鑑于AI晶片需求激增，在台湾北部、中部和南部展开大规模扩产。此次扩建包括引进一座 2 奈米工厂和一座最先进的封装工厂。台积电甚至表示可能需要投资 8 到 10 个设施来支援台湾即将推出的 1 奈米技术。
  • 对人工智慧晶片不断增长的需求推动了对 CoWoS（基板上晶圆晶片）等先进封装技术的需求。为了满足这一不断增长的需求，台积电正在扩大其位于台湾科技园中心竹南的先进封装设施。该公司计划今年开始整合工具和生产线。此外，嘉义的先进封装工厂计划于今年开始建造。
  • 台湾数位经济的成长满足了客户需求并支援高效能运算（HPC）、人工智慧（AI）和行动应用等产品，晶粒了半导体晶片的小型化和对行动应用等产品的支援。封装市场创造机会。 GSMA预测，到2025年，全球超过50%的行动网路连线将由台湾的5G技术提供支援。
  • 例如，2023 年 5 月，代工晶片製造商台积电 (TSMC) 宣布计划在 2024 年建造 7 座新工厂，以增强其全球竞争力。这些设施包括三个晶圆厂、两座台湾封装厂和两座海外晶圆厂。此次扩张是对全球对高效能运算设备和智慧型手机需求的策略性回应。先进封装工厂于 2023 年在台湾中部破土动工。
  • 此外，嘉义工厂计划于今年稍后投入运作，并计划在 2026 年部署 CoWoS（晶圆上晶片晶片）和 SoIC（小型积体电路）技术。 2024年6月，台湾半导体公司台积电面临对其先进技术的激增需求。苹果和英伟达等主要企业已经预订了台积电的生产，订单一直延续到 2026 年。
  • 为了应对这一激增，台积电计划将 3nm 价格上涨 5%，但明年先进封装价格可能会大幅上涨 10% 至 20%。台积电的3nm产品线包括N3、N3E、N3P以及新增的N3X和N3A。虽然原有的 N3 技术得到了改进，但去年第四季开始量产的 N3E 专为人工智慧加速器、高阶智慧型手机和资料中心而设计。
  • 半导体在医疗保健行业中作为工具和设备以多种方式使用。超音波技术的日益普及正在推动半导体封装在该国的使用，这与医疗保健数位化和该国医院电子产品使用的增加相一致。在台湾，製造商主要致力于透过为跨国公司契约製造生产和出口中价格分布医疗设备。
  • 2024年1月，国际贸易局根据台湾经济部的资料，强调台湾医疗设备产量快速成长。该部宣布，2023年国内生产总值达到8,928,333美元，呈现持续上升趋势，显示市场成长轨迹良好。

半导体封装产业概况

半导体封装市场是半固体的，主要企业包括日月光科技控股、安靠科技、江苏长江、电子科技（JCET）、硅件精密工业和力成科技有限公司。市场上的公司正在采取联盟和收购等策略来加强其产品供应并获得永续的竞争优势。

  • 2024年4月，三星的AVP团队订单了英伟达AI晶片的先进封装合同，使该公司能够供应未来的高频宽记忆体晶片。三星电子的 AVP 团队将负责提供内插器和 2.5D 封装技术来封装 NVIDIA 的 AI 处理器。然而，这些处理器中使用的HBM和GPU晶片来自其他供应商。 2.5D封装技术使得CPU、GPU、HBM等晶片能够水平整合内插器上。
  • 2023年12月，长电科技在江苏省江阴市开设半导体封装测试博物馆。该博物馆是展示积体电路封装和测试领域的专业设施。这标誌着长电科技为推动封测产业所做的新的努力。该博物馆是江阴市积体电路领域科技发展的象征，同时也是介绍封装测试产业成果的平台。

其他好处

  • Excel 格式的市场预测 (ME) 表
  • 3 个月分析师支持

目录

第一章简介

  • 研究假设和市场定义
  • 调查范围

第二章调查方法

第三章执行摘要

第四章市场洞察

  • 市场概况
  • 产业吸引力－波特五力分析
    • 供应商的议价能力
    • 买方议价能力
    • 新进入者的威胁
    • 替代品的威胁
    • 竞争公司之间的敌对关係
  • 产业价值链分析
  • COVID-19副作用和其他宏观经济因素对市场的影响

第五章市场动态

  • 市场驱动因素
    • 各行业半导体装置消费扩大
    • 政府政策及新兴国家政策利多
  • 市场限制因素
    • 半导体IC设计初始投资高且复杂

第六章 市场细分

  • 按封装平台
    • 先进封装
      • 覆晶
      • SIP
      • 2.5D/3D
      • 嵌入式晶粒
      • 扇入式晶圆级封装 (FI-WLP)
      • 扇出晶圆级封装 (FO-WLP)
    • 传统包装
  • 按最终用户产业
    • 家用电子产品
    • 航太/国防
    • 医疗设备
    • 通讯/电讯
    • 汽车工业
    • 能源/照明
  • 按地区
    • 美国
    • 中国
    • 台湾
    • 韩国
    • 日本
    • 欧洲
    • 拉丁美洲
    • 中东/非洲

第七章 竞争格局

  • 公司简介
    • ASE Technology Holding Co. Ltd
    • Amkor Technology
    • Jiangsu Changjiang Electronics Technology Co. Ltd（JCET）
    • Siliconware Precision Industries Co. Ltd
    • Powertech Technology Inc.
    • Tianshui Huatian Technology Co. Ltd
    • Fujitsu Semiconductor Ltd
    • UTAC Holdings Ltd
    • Chipmos Technologies Inc.
    • Chipbond Technology Corporation
    • Intel Corporation
    • Samsung Electronics Co. Ltd
    • Unisem（M）Berhad
    • Interconnect Systems Inc.（ISI）

第八章投资分析

第9章市场的未来

简介目录
Product Code: 49165

The Semiconductor Packaging Market size is estimated at USD 97.30 billion in 2024, and is expected to reach USD 136.77 billion by 2029, growing at a CAGR of 7.05% during the forecast period (2024-2029).

Semiconductor Packaging - Market

Semiconductor packaging refers to a casing that contains one or more discrete semiconductor devices or integrated circuits made up of plastic, ceramic, metal, or glass casing. Packaging is crucial for protecting an electronic system from radio frequency noise emission, electrostatic discharge, mechanical damage, and cooling.

High-performance computing, data center networking, and autonomous vehicles are pushing the adoption rates for the market studied and accelerating its technological evolution. The trend is to have more enormous computing resources at the cloud, edge computing, and device levels. The advancements in the market studied are also possible due to the growth in high-end performance applications and artificial intelligence (AI) in the telecom and infrastructure industry.

As the front-end node becomes smaller, design cost becomes increasingly important. Advanced packaging (AP) solutions aid in solving these problems by reducing the cost while enhancing system performance and offering lower latency, increased bandwidth, and power efficiency.

The increasing digitization of the workplace, the emergence of remote working and remote operation trends, and the growing consumer preference for electronics have increased the demand for semiconductor devices capable of unlocking a wide range of new opportunities. As the growth of semiconductor devices continues to accelerate, advanced packaging technologies provide the size and processing power necessary for the digitized era.

Global governments are increasingly supporting the semiconductor industry by lowering barriers and ramping up production, research, and development subsidies. For instance, South Korea committed a staggering USD 456 billion in private investments to construct the world's largest chip center, underlining its ambitions for industry dominance.

In tandem with this, the South Korean government rolled out an extensive support initiative for its semiconductor industry, valued at KRW 26 trillion (approximately USD 19.1 billion). This program spans financial aid, infrastructure development, R&D, and targeted assistance for its SMEs. Just outside Seoul, South Korea is currently in the works of creating a "mega chip cluster," which is projected to become the largest semiconductor hub globally and a key driver in creating numerous new employment opportunities.

A significantly high initial investment is required in designing, developing, and setting up semiconductor packaging units as per the requirements of different industries such as automotive, consumer electronics, healthcare, IT and telecommunication, and aerospace and defense. This can restrict the growth of the semiconductor packaging market.

Moreover, the defense budgets of various countries are significantly influenced by major macroeconomic factors such as inflation, economic growth, government spending priorities, and global trade and geopolitical dynamics.

In March 2023, President Joe Biden proposed the largest peacetime US defense budget, totaling USD 886 billion. This budget notably included a 5.2% pay raise for troops and marked the highest-ever allocation for research and development. The backdrop of Russia's actions in Ukraine further underscored the need for increased spending on munitions.

As per the US Congressional Budget Office, the United States is set to witness a consistent rise in defense spending, with projections extending until 2033. In 2023, the United States spent USD 746 billion on defense, with forecasts indicating a climb to USD 1.1 trillion by 2033.

Semiconductor Packaging Market Trends

The Communication and Telecom Segment to be the Fastest Growing End User

  • The evolution in networking and connectivity is quite visible. It has evolved from the basic exchange of voice and visual signals through wired infrastructure to the current state of exchanging multimedia and large volumes of data through wireless infrastructure.
  • Semiconductors are pivotal in telecom infrastructure, handling tasks from capturing and encoding data to encryption, transmission, and, ultimately, user presentation. 5G technology heralds a significant leap in telecommunication networks and devices, offering notably faster speeds than its predecessors and, crucially, boasting remarkably low latency. This reduced latency is especially vital for applications like cloud gaming and VR content streaming. Thus, the increasing demand for semiconductors in the communication and telecom industry is expected to propel the growth of the semiconductor packaging market.
  • Similarly, in February 2024, the US government allocated a substantial USD 42 million toward fostering wireless innovation within the nation. This funding was earmarked for a collaborative project involving US carriers, international counterparts, leading universities, and equipment suppliers. The initiative aimed to set up a testing, evaluation, and R&D center in the Dallas Technology Corridor, complemented by a satellite facility in Washington, DC. The primary focus of these facilities would be testing network performance, ensuring interoperability, enhancing security measures, and spearheading research into novel testing methodologies.
  • Similarly, in April 2023, Ericsson expressed its intention to collaborate with the Canadian government and invest CAD 470 million (USD 345.44 million) over five years. This investment was directed toward researching and developing technologies such as 6G, 5G advanced, artificial intelligence, Cloud RAN, and core networks. The objective of this initiative was to foster the growth of the telecommunications industry in the region and support the development of research facilities. These investments were poised to surge the demand for semiconductor devices due to their widespread use in the telecommunications industry, further bolstering the market's growth.
  • In 2024, the telecommunications industry across emerging nations showcased a mix of technological advancements and strategic market development. Incorporating innovative and advanced semiconductor solutions played a vital role in this shift, meeting the increasing needs for connectivity and speed and addressing crucial elements like security, sustainability, and customized user experience. With ongoing progress, the collaboration between telecom and semiconductor technologies is expected to significantly influence the global digital landscape.
  • The growing adoption of cloud technology, increasing penetration of data centers, and rising popularity of 5G technology are further bolstering the growth of the semiconductor packaging market. The increasing expansion of the data center and cloud market worldwide is expected to fuel the demand for data storage, further propelling the market's growth. For instance, according to Cloudscene, as of March 2024, there were 5,381 data centers in the United States, the most of any country worldwide.

Taiwan is Expected to Hold Significant Market Share

  • Taiwan is home to some of the largest semiconductor manufacturers, such as TSMC (Taiwan Semiconductor Manufacturing Company) and United Microelectronics Corporation (UMC). The robust presence of these companies creates a demand for advanced packaging solutions.
  • For instance, in March 2024, TSMC, considering the surging demand for AI chips, launched a significant expansion across Northern, Central, and Southern Taiwan. This expansion encompasses the introduction of 2-nanometer fabs and cutting-edge packaging plants. TSMC had even hinted at the potential need to invest in eight to ten facilities to support the upcoming 1-nanometer technology in Taiwan.
  • The rising demand for AI chips is fueling the necessity for advanced packaging technologies, such as CoWoS (Chip-on-Wafer-on-Substrate). To meet this escalating demand, TSMC is ramping up its advanced packaging facilities in Zhunan, located in the heart of Taiwan's Science Park. The company will kick off tool-in and production line integration this year. Additionally, construction for an advanced packaging facility in Chiayi is slated to begin this year.
  • The growth of Taiwan's digital economy to meet customers' needs and support products such as high-performance computing (HPC), artificial intelligence (AI), and mobile applications has created an opportunity for the semiconductor packaging market in Taiwan as its use in combining semiconductor dies on top of each other for miniaturized and high-performance applications of semiconductor chips. GSMA's forecast predicts that by 2025, over 50% of global mobile internet connections will be powered by 5G technology in Taiwan.
  • For instance, in May 2023, Taiwan Semiconductor Manufacturing Co. (TSMC), the contract chip manufacturer, announced its plans to construct seven new facilities in 2024 to enhance its global competitive edge. These facilities would include three wafer plants, two packaging factories in Taiwan, and two overseas wafer plants. This expansion was a strategic response to the worldwide appetite for high-performance computing devices and smartphones. Construction commenced on an advanced packaging factory in Central Taiwan in 2023.
  • Additionally, a facility in Chiayi is set to kick off later this year, with plans to roll out Chip-on-Wafer-on-Substrate (CoWoS) and small outline integrated circuit (SoIC) technologies by 2026. In June 2024, Taiwan's semiconductor company, TSMC, grappled with a soaring demand for its advanced technology. Key players like Apple and NVIDIA have fully booked TSMC's production, with orders stretching into 2026.
  • In response to this surge, TSMC is eyeing a 5% hike in its 3 nm prices, while its advanced packaging rates could see a steeper rise of 10% to 20% in the coming year. TSMC's 3 nm lineup comprises N3, N3E, and N3P, alongside newer additions N3X and N3A. While the original N3 technology undergoes enhancements, N3E, which commenced mass production in Q4 of the previous year, is designed for AI accelerators, premium smartphones, and data centers.
  • Semiconductors are used in various ways as tools and equipment in the healthcare industry. The expanding use of ultrasound technology encourages the use of semiconductor packaging in the country, which is in line with the growth of healthcare digitalization and electronic device usage in the country's hospitals. In Taiwan, manufacturers significantly focus on producing and exporting mid-to-low-end medical equipment through contract manufacturing for multinational companies.
  • In January 2024, the International Trade Administration highlighted a surge in the country's medical device production by data from the Taiwan Ministry of Economic Affairs. The ministry published that the total local production in 2023 reached USD 8,928,333, marking a consistent upward trend and showing a promising growth trajectory for the market.

Semiconductor Packaging Industry Overview

The semiconductor packaging market is semi-consolidated with the presence of significant players like ASE Technology Holding Co. Ltd, Amkor Technology, Jiangsu Changjiang, Electronics Technology Co. Ltd (JCET), Siliconware Precision Industries Co. Ltd, and Powertech Technology Inc. Players in the market are adopting strategies, such as partnerships and acquisitions, to enhance their product offerings and gain sustainable competitive advantage.

  • In April 2024, Samsung's AVP team received an order for advanced packaging for NVIDIA's AI chip, allowing for the future supply of high-bandwidth memory chips. The AVP team at Samsung Electronics will be responsible for providing interposer and 2.5D packaging technology for packaging NVIDIA's AI processors. However, the HBM and GPU chips used in these processors will come from other suppliers. The 2.5D packaging technology allows for the horizontal integration of chips such as CPUs, GPUs, and HBMs on an interposer.
  • In December 2023, JCET opened the Semiconductor Packaging and Test Museum in Jiangyin, Jiangsu Province. The museum is a dedicated establishment that exhibits the realm of integrated circuit packaging and testing. It signifies a fresh endeavor by JCET to propel the packaging and testing industry. The museum acts as a prominent symbol for fostering science and technology in the IC sector within Jiangyin while also serving as a platform to showcase the accomplishments of the packaging and testing industry.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.2.1 Bargaining Power of Suppliers
    • 4.2.2 Bargaining Power of Buyers
    • 4.2.3 Threat of New Entrants
    • 4.2.4 Threat of Substitutes
    • 4.2.5 Intensity of Competitive Rivalry
  • 4.3 Industry Value Chain Analysis
  • 4.4 Impact of COVID-19 Aftereffects and Other Macroeconomic Factors on the Market

5 MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Growing Consumption of Semiconductor Devices Across Industries
    • 5.1.2 Favorable Government Policies and Regulations in Developing Countries
  • 5.2 Market Restraints
    • 5.2.1 High Initial Investment and Increasing Complexity of Semiconductor IC Designs

6 MARKET SEGMENTATION

  • 6.1 By Packaging Platform
    • 6.1.1 Advanced Packaging
      • 6.1.1.1 Flip Chip
      • 6.1.1.2 SIP
      • 6.1.1.3 2.5D/3D
      • 6.1.1.4 Embedded Die
      • 6.1.1.5 Fan-in Wafer Level Packaging (FI-WLP)
      • 6.1.1.6 Fan-out Wafer Level Packaging (FO-WLP)
    • 6.1.2 Traditional Packaging
  • 6.2 By End-user Industry
    • 6.2.1 Consumer Electronics
    • 6.2.2 Aerospace and Defense
    • 6.2.3 Medical Devices
    • 6.2.4 Communications and Telecom
    • 6.2.5 Automotive Industry
    • 6.2.6 Energy and Lighting
  • 6.3 By Geography
    • 6.3.1 United States
    • 6.3.2 China
    • 6.3.3 Taiwan
    • 6.3.4 South Korea
    • 6.3.5 Japan
    • 6.3.6 Europe
    • 6.3.7 Latin America
    • 6.3.8 Middle East and Africa

7 COMPETITIVE LANDSCAPE

  • 7.1 Company Profiles
    • 7.1.1 ASE Technology Holding Co. Ltd
    • 7.1.2 Amkor Technology
    • 7.1.3 Jiangsu Changjiang Electronics Technology Co. Ltd (JCET)
    • 7.1.4 Siliconware Precision Industries Co. Ltd
    • 7.1.5 Powertech Technology Inc.
    • 7.1.6 Tianshui Huatian Technology Co. Ltd
    • 7.1.7 Fujitsu Semiconductor Ltd
    • 7.1.8 UTAC Holdings Ltd
    • 7.1.9 Chipmos Technologies Inc.
    • 7.1.10 Chipbond Technology Corporation
    • 7.1.11 Intel Corporation
    • 7.1.12 Samsung Electronics Co. Ltd
    • 7.1.13 Unisem (M) Berhad
    • 7.1.14 Interconnect Systems Inc. (ISI)

8 INVESTMENT ANALYSIS

9 FUTURE OF THE MARKET