查看购物车
  • Traditional Chinese
  • English
  • Japanese
封面
市场调查报告书
商品编码
1572630

2024 年三维 (3D) 积体电路 (IC) 全球市场报告

Three Dimensional (3D) Integrated Circuits (IC) Global Market Report 2024
出版日期: | 出版商: The Business Research Company | 英文 175 Pages | 商品交期: 2-10个工作天内

价格
简介目录

三维（3D）积体电路（IC）市场规模预计在未来几年将快速成长。 2028年，将以15.8%的复合年增长率成长至223.3亿美元。预测期内的成长受到多种因素的推动，包括对智慧设备和高级整合的需求激增、研发活动投资增加以及伺服器、资料中心、军事和航太等产业对 3D IC 的需求不断增长这可能是由多种因素造成的。预测期内的主要趋势包括对设备小型化的持续需求、先进封装技术的使用、设备异质整合、强调永续性和能源效率、针对特定应用客製化3D IC解决方案，其中包括开发新材料以提高性能和效率，并改进製造流程以降低成本。

不断扩大的半导体产业预计将推动三维（3D）积体电路（IC）市场的成长。半导体产业包括设计、製造和销售半导体装置的公司，半导体元件是电脑、智慧型手机和工业机械等各种电子产品的重要组件。由于智慧型手机、平板电脑和穿戴式装置等消费性电子产品的渗透率不断提高，该产业正在经历显着成长，这推动了对先进半导体元件的需求。此外，5G 网路的推出将需要新的半导体技术来增强通讯、加速资料传输并改善连接性。 3D IC 为半导体应用提供了许多优势，包括提高效能、提高电源效率、空间最佳化和有效的温度控管。例如，2024年7月，代表美国半导体产业的贸易团体半导体产业协会（SIA）宣布，2024年5月全球半导体产业销售额达到491亿美元，2023年5月年增19.3%达到412 亿美元，与2024 年4 月的472 亿美元相比成长4.1%。这样，对半导体日益增长的需求正在推动3D IC市场的扩张。

三维 (3D) 积体电路 (IC) 市场的主要企业正专注于开发针对特定应用和客户要求（例如 5G 射频性能）的自订3D IC，以提高竞争力并满足精确的市场需求。方案来满足这些需求并创造更高的收益。 3D IC 技术透过将多个高速组件整合到一个封装中来为 5G 提供动力，从而提高效能、减少延迟并实现更紧凑、更有效率的网路基础设施和设备。例如，2024年5月，台湾跨国半导体公司联华电子宣布推出业界首款RFSOI（射频绝缘体上硅）技术的3D IC解决方案，标誌着5G时代的重大进步。这项开创性技术适用于联华电子的 55nm RFSOI 平台，可将电路面积减少 45% 以上，并能够将更多 RF 组件整合到 5G 设备中。这种创新的 3D IC 解决方案可解决射频 (RF) 干扰挑战，并为 5G 毫米波 (mmWave) 技术的未来发展铺平道路。

目录

第一章执行摘要

第二章 市场特点

第三章 市场趋势与策略

第四章宏观经济情景

  • 高通膨对市场的影响
  • 乌克兰与俄罗斯战争对市场的影响
  • COVID-19 对市场的影响

第五章世界市场规模与成长

  • 全球三维（3D）积体电路（IC）市场：驱动因素与限制因素
    • 市场驱动因素
    • 市场限制因素
  • 全球三维 (3D) 积体电路 (IC) 市场表现：规模与成长，2018-2023 年
  • 全球三维（3D）积体电路（IC）市场预测：规模与成长，2023-2028，2033F

第六章 市场细分

  • 全球三维 (3D) 积体电路 (IC) 市场：按组件分類的表现和预测，2018-2023、2023-2028F、2033F
  • 玻璃通孔 (TGV)
  • 穿透硅通孔(TSV)
  • 其他组件
  • 全球三维（3D）积体电路（IC）市场：依技术分類的表现与预测，2018-2023、2023-2028F、2033F
  • 3D堆迭积体电路（IC）
  • 单晶片 3D 积体电路 (IC)
  • 整合和包类型
  • 全球三维 (3D) 积体电路 (IC) 市场：按应用分類的表现和预测，2018-2023、2023-2028F、2033F
  • 航太和工业
  • 通讯与资讯科技（IT）
  • 车
  • 家电
  • 医疗保健
  • 产业
  • 其他用途

第 7 章 区域/国家分析

  • 全球三维（3D）积体电路（IC）市场：区域表现与预测，2018-2023、2023-2028F、2033F
  • 全球三维（3D）积体电路（IC）市场：按国家分類的表现和预测，2018-2023、2023-2028F、2033F

第八章亚太市场

第九章 中国市场

第十章 印度市场

第十一章 日本市场

第十二章 澳洲市场

第十三章 印尼市场

第14章 韩国市场

第十五章 西欧市场

第十六章英国市场

第十七章 德国市场

第十八章 法国市场

第十九章 义大利市场

第20章 西班牙市场

第21章 东欧市场

第22章 俄罗斯市场

第23章 北美市场

第24章美国市场

第25章加拿大市场

第26章 南美洲市场

第27章 巴西市场

第28章 中东市场

第29章 非洲市场

第三十章 竞争格局及公司概况

  • 三维（3D）积体电路（IC）市场：竞争格局
  • 三维 (3D) 积体电路 (IC) 市场：公司简介
    • Samsung Electronics Co. Ltd.
    • Taiwan Semiconductor Manufacturing Company（TSMC）
    • Intel Corporation
    • International Business Machines Corporation
    • Qualcomm Incorporated

第31章 其他大型创新企业

  • SK Hynix Inc.
  • Broadcom Inc.
  • Micron Technology Inc.
  • NVIDIA Corporation
  • Toshiba Corporation
  • Advanced Micro Devices Inc.（AMD）
  • ASML Holding NV
  • Texas Instruments Incorporated
  • MediaTek Inc.
  • STMicroelectronics NV
  • Infineon Technologies AG
  • NXP Semiconductors NV
  • Analog Devices Inc.
  • Renesas Electronics Corporation
  • United Microelectronics Corporation

第32章竞争基准化分析

第 33 章. 竞争对手仪表板

第三十四章 重大併购

第35章前瞻性与潜力分析

第36章附录

简介目录
Product Code: r19798

Three-dimensional (3D) integrated circuits (ICs) are semiconductor devices where multiple layers of circuits are vertically stacked to form a single, compact unit. This vertical stacking allows for higher integration density, enhanced performance, and a smaller footprint compared to traditional two-dimensional (2D) ICs.

The primary components of three-dimensional (3D) integrated circuits (ICs) include through-glass vias (TGVs), silicon vias (TSVs), and others. Through-glass vias are tiny holes or channels created through a glass substrate to enable electrical signals to pass between different layers of a 3D IC, using glass as an insulating material due to its dielectric properties. The technology types include 3D stacked integrated circuits (ICs), monolithic 3D integrable circuits (ICs), and various integration and packaging types for applications such as aerospace and industrial, telecommunication and information technology (IT), automotive, consumer electronics, medical, industrial, and others.

The three dimensional (3D) integrated circuit (IC) market research report is one of a series of new reports from the business research company that provides three dimensional (3D) integrated circuit (IC) market statistics, including three dimensional (3D) integrated circuit (IC) industry global market size, regional shares, competitors with an three dimensional (3D) integrated circuit (IC) market share, detailed three dimensional (3D) integrated circuit (IC) market segments, market trends and opportunities, and any further data you may need to thrive in the three dimensional (3D) integrated circuit (IC) industry. This three dimensional (3D) integrated circuit (IC) market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.

The three dimensional (3D) integrated circuit (IC) market size has grown rapidly in recent years. It will grow from $10.73 billion in 2023 to $12.41 billion in 2024 at a compound annual growth rate (CAGR) of 15.7%. The growth during the historic period can be attributed to several factors, including increased demand for advanced electronic products, the rising need for improved energy efficiency, and the growing demand for higher-performance electronics. Additionally, there has been a high demand for 3D packaging using TSVs, an increasing number of portable devices, greater adoption in other high-growth verticals, and initial investments in R&D for 3D ICs.

The three dimensional (3D) integrated circuit (IC) market size is expected to see rapid growth in the next few years. It will grow to $22.33 billion in 2028 at a compound annual growth rate (CAGR) of 15.8%. The growth in the forecast period can be attributed to several factors, including a spike in demand for smart devices and sophisticated integrations, increased investment in research and development activities, and a growing need for 3D ICs in sectors such as servers, data hubs, the military, and aerospace. Key trends during the forecast period encompass the ongoing need for device miniaturization, the use of advanced packaging technologies, the heterogeneous integration of devices, a focus on sustainability and energy efficiency, the customization of 3D IC solutions for specific applications, the development of new materials for enhanced performance and efficiency, and improved manufacturing processes to reduce costs.

The expanding semiconductor industry is expected to drive the growth of the three-dimensional (3D) integrated circuit (IC) market. The semiconductor industry includes companies involved in designing, manufacturing, and selling semiconductor devices, which are crucial components in various electronic products such as computers, smartphones, and industrial machinery. This industry is experiencing substantial growth due to the increasing prevalence of consumer electronics, including smartphones, tablets, and wearable devices, which boosts the demand for advanced semiconductor components. Additionally, the rollout of 5G networks necessitates new semiconductor technologies for enhanced communication, faster data transfer, and improved connectivity. 3D ICs offer numerous benefits for semiconductor applications, such as enhanced performance, improved power efficiency, space optimization, and effective thermal management. For example, in July 2024, the Semiconductor Industry Association (SIA), a US-based trade association representing the United States semiconductor industry, reported that global semiconductor industry sales reached $49.1 billion in May 2024, a 19.3% increase compared to $41.2 billion in May 2023, and a 4.1% increase compared to $47.2 billion in April 2024. Thus, the growing need for semiconductors drives the expansion of the 3D IC market.

Leading companies in the Three Dimensional (3D) Integrated Circuits (IC) market are focusing on developing custom 3D ICs tailored to specific applications or customer requirements, such as 5G radio frequency performance, to gain a competitive edge, meet precise market demands, and drive higher revenue through specialized solutions. 3D IC technology enhances 5G by integrating multiple high-speed components into a single package, improving performance, reducing latency, and enabling more compact and efficient network infrastructure and devices. For instance, in May 2024, United Microelectronics Corporation, a Taiwan-based multinational corporation and semiconductor company, introduced the industry's first 3D IC solution for radio frequency silicon on insulator (RFSOI) technology, marking a significant advancement in the 5G era. This pioneering technology, available on UMC's 55nm RFSOI platform, reduces circuit footprint by over 45%, allowing for the integration of more RF components into 5G devices. This innovative 3D IC solution addresses the challenge of radio frequency (RF) interference and paves the way for future developments in 5G millimeter-wave (mmWave) technology.

In February 2022, Advanced Micro Devices Inc. (AMD), a US-based semiconductor company, acquired Xilinx Inc. for an undisclosed amount. The acquisition of Xilinx aims to enhance AMD's portfolio by incorporating Xilinx's leading FPGA and adaptive computing technologies, thereby strengthening AMD's position in high-performance computing, data centers, and embedded markets. Xilinx Inc. is a US-based technology and semiconductor company that manufactures 3D ICs.

Major companies operating in the three dimensional (3D) integrated circuits (IC) market are Samsung Electronics Co. Ltd., Taiwan Semiconductor Manufacturing Company (TSMC), Intel Corporation, International Business Machines Corporation, Qualcomm Incorporated, SK Hynix Inc., Broadcom Inc., Micron Technology Inc., NVIDIA Corporation, Toshiba Corporation, Advanced Micro Devices Inc. (AMD), ASML Holding N.V., Texas Instruments Incorporated, MediaTek Inc., STMicroelectronics N.V., Infineon Technologies AG, NXP Semiconductors N.V., Analog Devices Inc., Renesas Electronics Corporation, United Microelectronics Corporation, ON Semiconductor Corporation, GlobalFoundries Inc., Microchip Technology Incorporated, Marvell Technology Group Ltd., JCET Group, Xilinx Inc., Silicon Labs Inc., Rambus Inc.

North America was the largest region in the three dimensional (3D) integrated circuit (IC) market in 2023. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in the three dimensional (3D) integrated circuits (IC) market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

The countries covered in the three dimensional (3D) integrated circuits (IC) market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The three-dimensional (3D) integrated circuit (IC) market consists of sales of chip-on-chip (CoC), wafer-on-wafer (WoW), and chip-on-wafer (CoW). Values in this market are 'factory gate' values, that is, the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

Three Dimensional (3D) Integrated Circuits (IC) Global Market Report 2024 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.

This report focuses on three dimensional (3D) integrated circuits (IC) market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.

Reasons to Purchase

  • Gain a truly global perspective with the most comprehensive report available on this market covering 50+ geographies.
  • Understand how the market has been affected by the COVID-19 and how it is responding as the impact of the virus abates.
  • Assess the Russia - Ukraine war's impact on agriculture, energy and mineral commodity supply and its direct and indirect impact on the market.
  • Measure the impact of high global inflation on market growth.
  • Create regional and country strategies on the basis of local data and analysis.
  • Identify growth segments for investment.
  • Outperform competitors using forecast data and the drivers and trends shaping the market.
  • Understand customers based on the latest market shares.
  • Benchmark performance against key competitors.
  • Suitable for supporting your internal and external presentations with reliable high quality data and analysis
  • Report will be updated with the latest data and delivered to you within 3-5 working days of order along with an Excel data sheet for easy data extraction and analysis.
  • All data from the report will also be delivered in an excel dashboard format.

Where is the largest and fastest growing market for three dimensional (3D) integrated circuits (IC) ? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward? The three dimensional (3D) integrated circuits (IC) market global report from the Business Research Company answers all these questions and many more.

The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.

  • The market characteristics section of the report defines and explains the market.
  • The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
  • The forecasts are made after considering the major factors currently impacting the market. These include:

The impact of sanctions, supply chain disruptions, and altered demand for goods and services due to the Russian Ukraine war, impacting various macro-economic factors and parameters in the Eastern European region and its subsequent effect on global markets.

The impact of higher inflation in many countries and the resulting spike in interest rates.

The continued but declining impact of COVID-19 on supply chains and consumption patterns.

  • Market segmentations break down the market into sub markets.
  • The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth. It covers the growth trajectory of COVID-19 for all regions, key developed countries and major emerging markets.
  • The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
  • The trends and strategies section analyses the shape of the market as it emerges from the crisis and suggests how companies can grow as the market recovers.

Scope

  • Markets Covered:1) By Components: Through Glass Vias (TGVs); Through Silicon Vias (TSVs); Other Components
  • 2) By Technology: 3D Stacked Integrated Circuit (ICs); Monolithic 3D Integrated Circuit (ICs); Integration And Packaging Type
  • 3) By Application: Aerospace And Industrial; Telecommunication And Information Technology (IT); Automotive; Consumer Electronics; Medical; Industrial; Other Applications
  • Companies Mentioned: Samsung Electronics Co. Ltd.; Taiwan Semiconductor Manufacturing Company (TSMC); Intel Corporation; International Business Machines Corporation; Qualcomm Incorporated
  • Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Russia; South Korea; UK; USA; Canada; Italy; Spain
  • Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
  • Time series: Five years historic and ten years forecast.
  • Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita,
  • Data segmentations: country and regional historic and forecast data, market share of competitors, market segments.
  • Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
  • Delivery format: PDF, Word and Excel Data Dashboard.

Table of Contents

1. Executive Summary

2. Three Dimensional (3D) Integrated Circuits (IC) Market Characteristics

3. Three Dimensional (3D) Integrated Circuits (IC) Market Trends And Strategies

4. Three Dimensional (3D) Integrated Circuits (IC) Market - Macro Economic Scenario

  • 4.1. Impact Of High Inflation On The Market
  • 4.2. Ukraine-Russia War Impact On The Market
  • 4.3. COVID-19 Impact On The Market

5. Global Three Dimensional (3D) Integrated Circuits (IC) Market Size and Growth

  • 5.1. Global Three Dimensional (3D) Integrated Circuits (IC) Market Drivers and Restraints
    • 5.1.1. Drivers Of The Market
    • 5.1.2. Restraints Of The Market
  • 5.2. Global Three Dimensional (3D) Integrated Circuits (IC) Historic Market Size and Growth, 2018 - 2023, Value ($ Billion)
  • 5.3. Global Three Dimensional (3D) Integrated Circuits (IC) Forecast Market Size and Growth, 2023 - 2028, 2033F, Value ($ Billion)

6. Three Dimensional (3D) Integrated Circuits (IC) Market Segmentation

  • 6.1. Global Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • Through Glass Vias (TGVs)
  • Through Silicon Vias (TSVs)
  • Other Components
  • 6.2. Global Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 3D Stacked Integrated Circuit (ICs)
  • Monolithic 3D Integrated Circuit (ICs)
  • Integration And Packaging Type
  • 6.3. Global Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • Aerospace And Industrial
  • Telecommunication And Information Technology (IT)
  • Automotive
  • Consumer Electronics
  • Medical
  • Industrial
  • Other Applications

7. Three Dimensional (3D) Integrated Circuits (IC) Market Regional And Country Analysis

  • 7.1. Global Three Dimensional (3D) Integrated Circuits (IC) Market, Split By Region, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 7.2. Global Three Dimensional (3D) Integrated Circuits (IC) Market, Split By Country, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

8. Asia-Pacific Three Dimensional (3D) Integrated Circuits (IC) Market

  • 8.1. Asia-Pacific Three Dimensional (3D) Integrated Circuits (IC) Market Overview
  • Region Information, Impact Of COVID-19, Market Information, Background Information, Government Initiatives, Regulations, Regulatory Bodies, Major Associations, Taxes Levied, Corporate Tax Structure, Investments, Major Companies
  • 8.2. Asia-Pacific Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 8.3. Asia-Pacific Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 8.4. Asia-Pacific Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

9. China Three Dimensional (3D) Integrated Circuits (IC) Market

  • 9.1. China Three Dimensional (3D) Integrated Circuits (IC) Market Overview
  • 9.2. China Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2018-2023, 2023-2028F, 2033F,$ Billion
  • 9.3. China Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F,$ Billion
  • 9.4. China Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F,$ Billion

10. India Three Dimensional (3D) Integrated Circuits (IC) Market

  • 10.1. India Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 10.2. India Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 10.3. India Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

11. Japan Three Dimensional (3D) Integrated Circuits (IC) Market

  • 11.1. Japan Three Dimensional (3D) Integrated Circuits (IC) Market Overview
  • 11.2. Japan Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 11.3. Japan Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 11.4. Japan Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

12. Australia Three Dimensional (3D) Integrated Circuits (IC) Market

  • 12.1. Australia Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 12.2. Australia Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 12.3. Australia Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

13. Indonesia Three Dimensional (3D) Integrated Circuits (IC) Market

  • 13.1. Indonesia Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 13.2. Indonesia Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 13.3. Indonesia Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

14. South Korea Three Dimensional (3D) Integrated Circuits (IC) Market

  • 14.1. South Korea Three Dimensional (3D) Integrated Circuits (IC) Market Overview
  • 14.2. South Korea Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 14.3. South Korea Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 14.4. South Korea Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

15. Western Europe Three Dimensional (3D) Integrated Circuits (IC) Market

  • 15.1. Western Europe Three Dimensional (3D) Integrated Circuits (IC) Market Overview
  • 15.2. Western Europe Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 15.3. Western Europe Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 15.4. Western Europe Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

16. UK Three Dimensional (3D) Integrated Circuits (IC) Market

  • 16.1. UK Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 16.2. UK Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 16.3. UK Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

17. Germany Three Dimensional (3D) Integrated Circuits (IC) Market

  • 17.1. Germany Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 17.2. Germany Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 17.3. Germany Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

18. France Three Dimensional (3D) Integrated Circuits (IC) Market

  • 18.1. France Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 18.2. France Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 18.3. France Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

19. Italy Three Dimensional (3D) Integrated Circuits (IC) Market

  • 19.1. Italy Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 19.2. Italy Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 19.3. Italy Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

20. Spain Three Dimensional (3D) Integrated Circuits (IC) Market

  • 20.1. Spain Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 20.2. Spain Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 20.3. Spain Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

21. Eastern Europe Three Dimensional (3D) Integrated Circuits (IC) Market

  • 21.1. Eastern Europe Three Dimensional (3D) Integrated Circuits (IC) Market Overview
  • 21.2. Eastern Europe Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 21.3. Eastern Europe Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 21.4. Eastern Europe Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

22. Russia Three Dimensional (3D) Integrated Circuits (IC) Market

  • 22.1. Russia Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 22.2. Russia Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 22.3. Russia Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

23. North America Three Dimensional (3D) Integrated Circuits (IC) Market

  • 23.1. North America Three Dimensional (3D) Integrated Circuits (IC) Market Overview
  • 23.2. North America Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 23.3. North America Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 23.4. North America Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

24. USA Three Dimensional (3D) Integrated Circuits (IC) Market

  • 24.1. USA Three Dimensional (3D) Integrated Circuits (IC) Market Overview
  • 24.2. USA Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 24.3. USA Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 24.4. USA Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

25. Canada Three Dimensional (3D) Integrated Circuits (IC) Market

  • 25.1. Canada Three Dimensional (3D) Integrated Circuits (IC) Market Overview
  • 25.2. Canada Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 25.3. Canada Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 25.4. Canada Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

26. South America Three Dimensional (3D) Integrated Circuits (IC) Market

  • 26.1. South America Three Dimensional (3D) Integrated Circuits (IC) Market Overview
  • 26.2. South America Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 26.3. South America Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 26.4. South America Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

27. Brazil Three Dimensional (3D) Integrated Circuits (IC) Market

  • 27.1. Brazil Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 27.2. Brazil Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 27.3. Brazil Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

28. Middle East Three Dimensional (3D) Integrated Circuits (IC) Market

  • 28.1. Middle East Three Dimensional (3D) Integrated Circuits (IC) Market Overview
  • 28.2. Middle East Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 28.3. Middle East Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 28.4. Middle East Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

29. Africa Three Dimensional (3D) Integrated Circuits (IC) Market

  • 29.1. Africa Three Dimensional (3D) Integrated Circuits (IC) Market Overview
  • 29.2. Africa Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Components, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 29.3. Africa Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 29.4. Africa Three Dimensional (3D) Integrated Circuits (IC) Market, Segmentation By Application, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

30. Three Dimensional (3D) Integrated Circuits (IC) Market Competitive Landscape And Company Profiles

  • 30.1. Three Dimensional (3D) Integrated Circuits (IC) Market Competitive Landscape
  • 30.2. Three Dimensional (3D) Integrated Circuits (IC) Market Company Profiles
    • 30.2.1. Samsung Electronics Co. Ltd.
      • 30.2.1.1. Overview
      • 30.2.1.2. Products and Services
      • 30.2.1.3. Strategy
      • 30.2.1.4. Financial Performance
    • 30.2.2. Taiwan Semiconductor Manufacturing Company (TSMC)
      • 30.2.2.1. Overview
      • 30.2.2.2. Products and Services
      • 30.2.2.3. Strategy
      • 30.2.2.4. Financial Performance
    • 30.2.3. Intel Corporation
      • 30.2.3.1. Overview
      • 30.2.3.2. Products and Services
      • 30.2.3.3. Strategy
      • 30.2.3.4. Financial Performance
    • 30.2.4. International Business Machines Corporation
      • 30.2.4.1. Overview
      • 30.2.4.2. Products and Services
      • 30.2.4.3. Strategy
      • 30.2.4.4. Financial Performance
    • 30.2.5. Qualcomm Incorporated
      • 30.2.5.1. Overview
      • 30.2.5.2. Products and Services
      • 30.2.5.3. Strategy
      • 30.2.5.4. Financial Performance

31. Three Dimensional (3D) Integrated Circuits (IC) Market Other Major And Innovative Companies

  • 31.1. SK Hynix Inc.
  • 31.2. Broadcom Inc.
  • 31.3. Micron Technology Inc.
  • 31.4. NVIDIA Corporation
  • 31.5. Toshiba Corporation
  • 31.6. Advanced Micro Devices Inc. (AMD)
  • 31.7. ASML Holding N.V.
  • 31.8. Texas Instruments Incorporated
  • 31.9. MediaTek Inc.
  • 31.10. STMicroelectronics N.V.
  • 31.11. Infineon Technologies AG
  • 31.12. NXP Semiconductors N.V.
  • 31.13. Analog Devices Inc.
  • 31.14. Renesas Electronics Corporation
  • 31.15. United Microelectronics Corporation

32. Global Three Dimensional (3D) Integrated Circuits (IC) Market Competitive Benchmarking

33. Global Three Dimensional (3D) Integrated Circuits (IC) Market Competitive Dashboard

34. Key Mergers And Acquisitions In The Three Dimensional (3D) Integrated Circuits (IC) Market

35. Three Dimensional (3D) Integrated Circuits (IC) Market Future Outlook and Potential Analysis

  • 35.1 Three Dimensional (3D) Integrated Circuits (IC) Market In 2028 - Countries Offering Most New Opportunities
  • 35.2 Three Dimensional (3D) Integrated Circuits (IC) Market In 2028 - Segments Offering Most New Opportunities
  • 35.3 Three Dimensional (3D) Integrated Circuits (IC) Market In 2028 - Growth Strategies
    • 35.3.1 Market Trend Based Strategies
    • 35.3.2 Competitor Strategies

36. Appendix

  • 36.1. Abbreviations
  • 36.2. Currencies
  • 36.3. Historic And Forecast Inflation Rates
  • 36.4. Research Inquiries
  • 36.5. The Business Research Company
  • 36.6. Copyright And Disclaimer