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有限元素和先进封装用金属化学品全球市场分析（2022-2023）
市场调查报告书
商品编码
1413691

有限元素和先进封装用金属化学品全球市场分析（2022-2023）

Metal Chemicals for FE & Advanced Packaging Market Report 2023-2024 (Critical Materials Report)
出版日期: | 出版商: TECHCET | 英文 170 Pages | 商品交期: 最快1-2个工作天内

价格

本报告分析了先进封装（晶圆级）和半导体装置製造（镶嵌製程）中使用的金属化学品的市场趋势和供应链。它还包括有关镀铜和添加剂的趋势、市场份额结构、技术趋势、供应商简介等资讯。附录中还包括供应商产品比较图，总结了先进封装中使用的电镀产品的公开资讯。

有关金属化学品市场最新资讯和报告亮点的特色新闻稿：

目录

第一章执行摘要

第二章 研究范围、目的与研究方法

第三章 半导体产业市场现况与展望

  • 世界经济
    • 连结半导体产业与全球经济
    • 半导体销售额成长率
    • 台湾月度销售趋势
    • 2023年高度不确定性－半导体收入成长预计将放缓至负值
  • 电子产品市场
    • 手机
    • PC 出货量
    • 伺服器/IT市场
  • 半导体製造业的成长与扩张
    • 铸造厂扩建公告：概述
    • 透过在世界各地扩大铸造厂来加速成长
    • 资本支出趋势
    • 技术路线图
    • 代工投资评估
  • 政策和贸易趋势及影响
  • 半导体材料概述
    • 晶片生产进度可能受到材料产能限制
    • 持续的物流问题：对西方世界的负面影响
    • Techcet晶圆开始预测至2026年
    • Techcet材料预测

第四章金属化学品市场：按细分市场

  • 定义
  • 金属电镀化学品市场：概述
    • 概述：先进封装和镶嵌金属化
    • 概述：电镀市场的转变趋势
  • 先进封装金属化：市场驱动因素
    • 先进封装：镀铜添加剂收入
    • 先进封装：铜化学品收入
    • 先进封装添加剂用量
    • 其他先进封装用电镀材料
    • 镀锡/锡银
  • 镶嵌成长趋势
    • 镶嵌驱动因素
    • 镶嵌铜电镀收入
    • 镶嵌添加量

第五章科技趋势

  • 封装技术趋势
    • 封装技术挑战
  • 技术趋势
    • 市场驱动的技术趋势
    • ADV逻辑互连布线技术的演变
    • CU镶嵌品质要求
    • 逻辑金属化路线图
    • ADV 逻辑嵌入式电源轨
    • 技术路线图：采用 MO 或 RU 的 DRAM
    • 先驱技术路线图：采用 MO 或 RU 的 3D NAND
    • 逻辑製程流程范例：20-32NM逻辑PVD
    • 技术要求总结1/2　

第六章 竞争状况

  • 先进封装镶嵌整体市场份额
  • OEM市占率：电镀设备
  • 按应用划分的市场份额：用于先进封装的 CU 电镀
  • 按地区/其他公司
  • 併购 (M&A) 活动

第七章 分析师评价

  • 先进金属电镀的利用：市场评估

第八章 供应商简介

  • BASF
  • DUPONT
  • CHANG CHUN GROUP
  • INCHEON CHEMICAL COMPANY
  • ISHIHARA CHEMICAL/UNICON
  • JX NIPPON MINING AND METALS
  • 其他

第 9 章附录 A：封装技术的趋势

This report covers the Metal Chemicals market trends and supply-chain as it applied to Advanced Packaging (wafer level) and Semiconductor Device Manufacturing (damascene process). Included are forecasts for copper plating and additives, market shares, technical trends, and supplier profiles. Also included in the appendix is a supplier product comparison table of publicly available information on plating products used for advanced packaging.

This report comes with 3 Quarterly Updates featuring updated market information and forecasting from the report analyst.

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

  • 1.1. EXECUTIVE SUMMARY
  • 1.2. ADVANCED PACKAGING PER WAFER STARTS
  • 1.3. DEVICE DEMAND DRIVERS-LOGIC
  • 1.4. CU PLATING FORECAST FOR DAMASCENE (FE) AND ADVANCED PACKAGING
  • 1.5. MARKET SHARES
  • 1.6. SUPPLIER ACTIVITIES-VARIOUS ANNOUNCEMENTS
  • 1.7. RISK FACTORS
  • 1.8. ANALYST ASSESSMENT

2. SCOPE, PURPOSE AND METHODOLOGY

  • 2.1. SCOPE
  • 2.2. PURPOSE
  • 2.3. METHODOLOGY
  • 2.4. OVERVIEW OF OTHER TECHCET CMR™ 2022 REPORTS

3. SEMICONDUCTOR INDUSTRY MARKET OUTLOOK

  • 3.1. WORLDWIDE ECONOMY
    • 3.1.1. SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY
    • 3.1.2. SEMICONDUCTOR SALES GROWTH
    • 3.1.3. TAIWAN MONTHLY SALES TRENDS
    • 3.1.4. UNCERTAINTY ABOUNDS ESPECIALLY FOR 2023-SLOWER TO NEGATIVE SEMI REVENUE GROWTH EXPECTED
  • 3.2. ELECTRONIC GOODS MARKET
    • 3.2.1. SMARTPHONES
    • 3.2.2. PC UNIT SHIPMENTS
      • 3.2.2.1. ELECTRIC VEHICLE (EV) MARKET TRENDS
      • 3.2.2.2. INCREASE IN SEMICONDUCTOR CONTENT FOR AUTOS
    • 3.2.3. SERVERS / IT MARKET
  • 3.3. SEMICONDUCTOR FABRICATION GROWTH & EXPANSION
    • 3.3.1. FAB EXPANSION ANNOUNCEMENT SUMMARY
    • 3.3.2. WW FAB EXPANSION DRIVING GROWTH
    • 3.3.3. EQUIPMENT SPENDING TRENDS
    • 3.3.4. TECHNOLOGY ROADMAPS
    • 3.3.5. FAB INVESTMENT ASSESSMENT
  • 3.4. POLICY & TRADE TRENDS AND IMPACT
    • 3.4.1. POLICY AND TRADE ISSUES
  • 3.5. SEMICONDUCTOR MATERIALS OUTLOOK
    • 3.5.1. COULD MATERIALS CAPACITY LIMIT CHIP PRODUCTION SCHEDULES?
    • 3.5.2. CONTINUED LOGISTICS ISSUES PLAGUE THE WESTERN WORLD
    • 3.5.3. TECHCET WAFER STARTS FORECAST THROUGH 2026
      • 3.5.3.1. TECHCET WAFER START MODELING METHODOLOGY
    • 3.5.4. TECHCET'S MATERIAL FORECAST

4. METAL CHEMICALS MARKET BY SEGMENT

  • 4.1. DEFINITIONS
  • 4.2. METAL PLATING CHEMICALS MARKET OVERVIEW
    • 4.2.1. OVERVIEW-ADVANCED PACKAGING AND DAMASCENE METALLIZATION
    • 4.2.2. OVERVIEW-PLATING MARKET TRANSITIONAL TRENDS
  • 4.3. ADVANCED PACKAGING METALLIZATION-MARKET DRIVERS
    • 4.3.1. ADVANCED PACKAGING-ADDITIVES FOR CU PLATING REVENUE
    • 4.3.2. ADVANCED PACKAGING-COPPER CHEMICALS REVENUE
    • 4.3.3. ADVANCED PACKAGING ADDITIVE VOLUMES
    • 4.3.4. OTHER PLATING MATERIALS FOR ADVANCED PACKAGING
    • 4.3.5. SN / SNAG PLATING
      • 4.3.5.1. WW NI PLATING MARKET FORECAST
  • 4.4. DAMASCENE GROWTH TRENDS
    • 4.4.1. DAMASCENE GROWTH DRIVERS
    • 4.4.2. DAMASCENE CU PLATING REVENUES
    • 4.4.3. DAMASCENE ADDITIVE VOLUMES

5. TECHNICAL TRENDS

  • 5.1. PACKAGING TECH TRENDS
    • 5.1.1. PACKAGING TECHNICAL CHALLENGES
  • 5.2. TECH TRENDS
    • 5.2.1. MARKET DRIVES TECHNOLOGY TRENDS
    • 5.2.2. ADV LOGIC INTERCONNECT WIRING TECHNOLOGY EVOLUTION
      • 5.2.2.1. TRENDS-MOL AND BEOL IRDS ROADMAP
    • 5.2.3. CU DAMASCENE QUALIFICATION REQUIREMENTS
    • 5.2.4. LOGIC METALLIZATION ROADMAP
      • 5.2.4.1. INTERCONNECT FOR ADVANCED LOGIC
    • 5.2.5. ADV LOGIC BURIED POWER RAIL
    • 5.2.6. TECHNOLOGY ROADMAP: DRAM WITH MO OR RU
      • 5.2.6.1. GENERAL PROCESS FLOW ADVANCED DRAM
    • 5.2.7. PRECURSOR TECHNOLOGY ROADMAP: 3D NAND USING MO OR RU
      • 5.2.7.1. 3D-NAND GENERATIONS 2020-2025
    • 5.2.8. EXAMPLE OF LOGIC PRO CESS FLOW 20 NM TO 32 NM LOGIC PVD
    • 5.2.8. TECHNICAL REQUIREMENTS SUMMARY 1/2
      • 5.2.8.1. TECHNICAL REQUIREMENTS SUMMARY 2/2

6. COMPETITIVE LANDSCAPE

  • 6.1. TOTAL ADVANCED PACKAGING AND DAMASCENE MARKET SHARES
  • 6.2. OEM MARKET SHARE-PLATING EQUIPMENT
  • 6.3. MARKET SHARE BY APPLICATION-CU PLATING FOR ADVANCED PACKAGING
  • 6.4. REGIONAL PLAYERS AND OTHERS
  • 6.5. M&A ACTIVITY

7. ANALYST ASSESSMENT

  • 7.1. ADVANCED METAL PLATING APPLICATIONS MARKET ASSESSMENT

8. SUPPLIER PROFILES

  • BASF
  • DUPONT
  • CHANG CHUN GROUP
  • INCHEON CHEMICAL COMPANY
  • ISHIHARA CHEMICAL/UNICON
  • JX NIPPON MINING AND METALS
  • AND MORE...

9. APPENDIX A: PACKAGING TECH TRENDS

LIST OF FIGURES

  • FIGURE 1: PLATING MATERIALS FOR ADVANCED PACKAGING AND DEVICE CU INTERCONNECT REVENUES ($M'S)
  • FIGURE 2: ADVANCED PACKAGING APPLICATIONS IN MILLIONS OF WAFERS
  • FIGURE 3: ADVANCED LOGIC DEVICES GROWTH FORECAST
  • FIGURE 4: COPPER PLATING CHEMICALS REVENUES ($M'S) FOR ADVANCED PACKAGING & FE/DAMASCENE
  • FIGURE 5: TOTAL PLATING MARKET SHARES FOR ADVANCED PACKAGING AND SEMICONDUCTOR DEVICE MFG. 2022
  • FIGURE 6: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2021)
  • FIGURE 7: WORLDWIDE SEMICONDUCTOR SALES
  • FIGURE 8: TECHCET'S TAIWAN SEMICONDUCTOR INDUSTRY INDEX*
  • FIGURE 9: 2022 SEMICONDUCTOR INDUSTRY REVENUE GROWTH FORECASTS
  • FIGURE 10: 2023 SEMICONDUCTOR INDUSTRY REVENUE GROWTH FORECASTS
  • FIGURE 11: SEMICONDUCTOR CHIP APPLICATIONS
  • FIGURE 12: MOBILE PHONE SHIPMENTS WW ESTIMATES
  • FIGURE 13: WORLDWIDE PC AND TABLET FORECAST, 2021, Q3
  • FIGURE 14: GLOBAL EV TRENDS
  • FIGURE 15: SEMICONDUCTOR SPEND PER VEHICLE TYPE
  • FIGURE 16: TSMC CONSTRUCTION SITE IN ARIZONA
  • FIGURE 17: CHIP EXPANSIONS 2021-2026 > US$460 B
  • FIGURE 18: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD
  • FIGURE 19: 3-MONTH AVERAGE SEMICONDUCTOR EQUIPMENT BILLINGS
  • FIGURE 20: OVERVIEW OF DEVICE TECHNOLOGY ROADMAP
  • FIGURE 21: EUROPE CHIP EXPANSION UPSIDE
  • FIGURE 22: TECHCET WAFER START FORECAST BY NODE
  • FIGURE 23: TECHCET MATERIALS FORECAST
  • FIGURE 24: PACKAGING METALLIZATION APPLICATIONS
  • FIGURE 25: USE OF SILICON INTERPOSER
  • FIGURE 26: VERSIONS OF TSV & PROCESS FLOW EXAMPLE
  • FIGURE 27: PLATING MATERIALS FOR ADVANCED PACKAGING AND DEVICE CU INTERCONNECT REVENUES ($M'S)
  • FIGURE 28: CU PLATING CHEMICALS 5-YEAR FORECAST
  • FIGURE 29: ADVANCED PACKAGING APPLICATIONS IN MILLIONS OF WAFERS
  • FIGURE 30: CU PLATING ADVANCED PACKAGING REVENUE FORECAST ESTIMATES
  • FIGURE 31: CU PILLAR & CU RDL SEGMENTED FORECAST
  • FIGURE 32: ADV. PACKAGING CU/VMS VOLUME DEMAND FORECAST
  • FIGURE 33: ADV. PACKAGING CU PLATING ADDITIVES VOLUME DEMAND FORECAST
  • FIGURE 34: MATERIALS STACK USING CU PILLAR (< 40 UM PITCH)
  • FIGURE 35: SN AND SNAG PLATING REVENUE
  • FIGURE 36: NICKEL PLATING REVENUE
  • FIGURE 37: ADVANCED LOGIC DEVICES GROWTH FORECAST
  • FIGURE 38: ADV LOGIC METAL PLATING WAFER PASSES
  • FIGURE 39: WW DAMASCENE REVENUE FORECAST ESTIMATES
  • FIGURE 40: DAMASCENE CU VMS VOLUME DEMAND FORECAST ESTIMATES
  • FIGURE 41: DAMASCENE CU PLATING ADDITIVES CHEMICAL VOLUME DEMAND FORECAST
  • FIGURE 42: KEY TRENDS IN ADVANCED PACKAGING
  • FIGURE 43: CHALLENGES OF ELECTROPLATING VIA FILL
  • FIGURE 44: METAL LEVELS PER LOGIC NODE
  • FIGURE 45: INTERCONNECT METAL COMPARISON BY RESISTIVITY
  • FIGURE 46: CU DAMASCENE QUALIFICATION
  • FIGURE 47: LEADING EDGE LOGIC POWER RAIL SCHEMES
  • FIGURE 48: DRAM STRUCTURE
  • FIGURE 49: 3D NAND STRUCTURE
  • FIGURE 50: TOTAL PLATING FOR ADV. PACKAGING AND SEMICONDUCTOR DEVICE MANUFACTURING 2022
  • FIGURE 51: PLATING EQUIPMENT OEM MARKET SHARES 2020%
  • FIGURE 52: PLATING CHEMICAL SUPPLIER FOR DAMASCENE AND ADVANCED PACKAGING APPLICATIONS
  • FIGURE 53: CLEANING COMPLEXITY
  • FIGURE 54: OSATS PACKAGING BUSINESS CANNIBALIZATION TREND
  • FIGURE 55: WAFER LEVEL PLATING
  • FIGURE 56: ADVANCED PACKAGING MARKET DRIVERS AND APPLICATIONS.
  • FIGURE 57: COMPARISON WITH DAMASCENE-TYPE RDL
  • FIGURE 58: USE OF SILICON INTERPOSER
  • FIGURE 59: APPLE EXAMPLE INTERPOSERS
  • FIGURE 60: TSV PROCESS FLOW EXAMPLE

LIST OF TABLES

  • TABLE 1: GLOBAL GDP AND SEMICONDUCTOR REVENUES*
  • TABLE 2: IMF ECONOMIC OUTLOOK*
  • TABLE 3: DATA CENTER SYSTEMS AND COMMUNICATION SERVICES FORECAST 2021
  • TABLE 4: IRDS 2022 LOGIC CORE INTERCONNECT ROADMAP
  • TABLE 5: LOGIC DEVICE ROADMAP FOR METALS
  • TABLE 6: METALS REQUIRED FOR DEVICE FEATURES
  • TABLE 7: DRAM USE OF MO OR RU PRESENT & FUTURE
  • TABLE 8: GENERAL PROCESS FLOW ADVANCED DRAM
  • TABLE 9: 3D NAND MATERIAL CHANGES PRESENT & FUTURE
  • TABLE 10: NUMBER OF STACKS (S) & LAYERS (L) PER GENERATION OF 3DNAND
  • TABLE 11: EXAMPLE OF LOGIC PROCESS FLOW 20 NM TO 32 NM LOGIC PVD
  • TABLE 12: TECHNICAL REQUIREMENTS SUMMARY 1/2
  • TABLE 13: TECHNICAL REQUIREMENTS SUMMARY 2/2
  • TABLE 14: REGIONAL PLAYERS-MARKET LEADER AND "OTHERS"
  • TABLE 15: CU PACKAGING APPLICATIONS AND REQUIREMENTS