全球先进封装市场规模、份额和成长分析：按类型和最终用途 - 产业预测（2024-2031）

Global Advanced Packaging Market Size, Share, Growth Analysis, By Type(Flip Chip CSP, and Flip-Chip Ball Grid Array), By End-Use(Consumer Electronics, and Automotive) - Industry Forecast 2024-2031

出版日期: 2024年03月01日 | 出版商:

SkyQuest | 英文 184 Pages | 商品交期: 3-5个工作天内

价格

简介目录

2022年全球先进封装市场规模将达到306亿美元，从2023年的330亿美元成长到2031年的603.6亿美元，并将从2023年的306亿美元成长到2031年的603.6亿美元。复合年增长率为7.84%。

先进封装为硅晶圆、逻辑单元和记忆体提供免受物理损坏和腐蚀的保护机壳，同时也为 2.5D、3D-IC 和扇出晶圆提供保护，在半导体製造的最后阶段发挥关键作用水平封装、系统级封装晶圆层次电子构装促进了晶片与电路基板之间的连接。在智慧型手机、物联网设备和高端产品需求激增的推动下，先进封装（特别是扇出晶圆层次电子构装）市场正在迅速扩大，行业供应商正在开发具有成本效益的製程以提高业务效率。迫于压力才这样做。目前，先进封装在满足各种积体电路（IC）多样化的封装需求方面具有巨大潜力，由于营运成本较高，这些积体电路主要用于高端和利基市场应用，并提供了超越传统封装方法的成长机会。先进封装的能力预计将超越传统封装解决方案，并有望在未来几年推动有利的市场趋势和该领域的进一步发展。

市场概况
北美洲
- 美国
- 加拿大
欧洲
- 德国
- 西班牙
- 法国
- 英国
- 其他欧洲国家地区
亚太地区
- 中国
- 印度
- 日本
- 韩国
- 其他亚太地区
拉丁美洲
- 巴西
- 其他拉丁美洲地区
中东和非洲 (MEA)
- 海湾合作委员会国家
- 南非
- 其他中东/非洲地区

竞争格局

前5名企业对比
主要企业市场定位（2021年）
主要市场参与者所采取的策略
关键成功策略
近期市集活动
主要企业市场占有率（2021年）

主要企业简介

Intel Corporation（United States）
Advanced Micro Devices（AMD）（United States）
Taiwan Semiconductor Manufacturing Company（TSMC）（Taiwan）
Samsung Electronics（South Korea）
ASE Group（Taiwan）
Amkor Technology（United States）
JCET Group（China）
Powertech Technology（Taiwan）
Siliconware Precision Industries Co., Ltd.（SPIL）（Taiwan）
ChipMOS Technologies Inc.（Taiwan）
UTAC Holdings Ltd.（Singapore）
Tokyo Electron Limited（Japan）
SCHOTT AG（Germany）
Palomar Technologies（United States）
Rudolph Technologies（United States）
BESI Group（Netherlands）
STATS ChipPAC Ltd.（Singapore）

简介目录

Product Code: SQMIG15H2036

Global Advanced Packaging Market size was valued at USD 30.60 billion in 2022 and is poised to grow from USD 33 billion in 2023 to USD 60.36 billion by 2031, growing at a CAGR of 7.84% during the forecast period (2024-2031).

Advanced packaging plays a crucial role as a protective enclosure safeguarding silicon wafers, logic units, and memory from physical damage and corrosion during semiconductor manufacturing's final stage, while also facilitating chip connection to circuit boards through innovative techniques like 2.5D, 3D-IC, fan-out-wafer-level packaging, and system-in-package. The market for advanced packaging, particularly fan-out wafer level packaging, has experienced rapid expansion driven by the surging demand for smartphones, IoT devices, and high-end products, prompting industry suppliers to develop cost-effective processes for improved operational efficiency. Despite currently being predominantly utilized for high-end and niche-market applications due to higher operational costs, advanced packaging holds significant potential for accommodating the diverse packaging needs of various integrated circuits (ICs), offering growth opportunities that surpass traditional packaging methods. With expectations to surpass conventional packaging solutions in capabilities, advanced packaging is poised to foster lucrative market trends and further advancements in the field in the forthcoming years.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Advanced Packaging Market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Advanced Packaging Market Segmental Analysis

The Global Advanced Packaging Market is segmented on the basis of Type, End - Use, and Region. By Type the market is segmented into Flip Chip CSP, Flip-Chip Ball Grid Array. By End - User, the market is segmented into Consumer Electronics, Automotive. By Region, the market is segmented into North America, Europe, Latin America, Asia- Pacific, Middle East and Africa.

Drivers of the Global Advanced Packaging Market

In today's electronics landscape, the ongoing push for miniaturization underscores the vital role of advanced packaging methods. These techniques are indispensable for seamlessly integrating numerous components into a singular package, thereby enhancing the device's performance and functionality on a comprehensive scale.

Restraints in the Global Advanced Packaging Market

Intellectual property issues, coupled with the absence of uniform advanced packaging solutions, can introduce uncertainties and impede market expansion by deterring companies from committing to proprietary technologies.

Market Trends of the Global Advanced Packaging Market

Fan-Out Wafer-Level Packaging (FOWLP) has surged in popularity thanks to its capacity for producing thinner, more economical packages, rendering it an appealing option for mobile devices and high-performance applications.

Executive Summary

Market Overview
Wheel of Fortune

Research Methodology

Information Procurement
Secondary & Primary Data Sources
Market Size Estimation
Market Assumptions & Limitations

Parent Market Analysis

Market Overview
Market Size
Market Dynamics
- Drivers
- Opportunities
- Restraints
- Challenges

Key Market Insights

Technology Analysis
Pricing Analysis
Supply Chain Analysis
Value Chain Analysis
Ecosystem of the Market
IP Analysis
Trade Analysis
Startup Analysis
Raw Material Analysis
Innovation Matrix
Pipeline Product Analysis
Macroeconomic Indicators
Top Investment Analysis
Key Success Factor
Degree of Competition

Market Dynamics & Outlook

Market Dynamics
- Drivers
- Opportunities
- Restraints
- Challenges
Regulatory Landscape
Porters Analysis
- Competitive rivalry
- Threat of Substitute Products
- Bargaining Power of Buyers
- Threat of New Entrants
- Bargaining Power of Suppliers
Skyquest Special Insights on Future Disruptions
- Political Impact
- Economic Impact
- Social Impact
- Technical Impact
- Environmental Impact
- Legal Impact

Global Advanced Packaging Market by Type

Market Overview
Flip Chip CSP
and Flip-Chip Ball Grid Array

Global Advanced Packaging Market by End-Use

Market Overview
Consumer Electronics
and Automotive

Global Advanced Packaging Market Size by Region

Market Overview
North America
- USA
- Canada
Europe
- Germany
- Spain
- France
- UK
- Rest of Europe
Asia Pacific
- China
- India
- Japan
- South Korea
- Rest of Asia-Pacific
Latin America
- Brazil
- Rest of Latin America
Middle East & Africa (MEA)
- GCC Countries
- South Africa
- Rest of MEA

Competitive Landscape

Top 5 Player Comparison
Market Positioning of Key Players, 2021
Strategies Adopted by Key Market Players
Top Winning Strategies
- By Development
- By Company
- By Year
Recent Activities in the Market
Key Companies Market Share (%), 2021

Key Company Profiles

Intel Corporation (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Advanced Micro Devices (AMD) (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Taiwan Semiconductor Manufacturing Company (TSMC) (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Samsung Electronics (South Korea)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
ASE Group (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Amkor Technology (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
JCET Group (China)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Powertech Technology (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Siliconware Precision Industries Co., Ltd. (SPIL) (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
ChipMOS Technologies Inc. (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
UTAC Holdings Ltd. (Singapore)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Tokyo Electron Limited (Japan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
SCHOTT AG (Germany)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Palomar Technologies (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Rudolph Technologies (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
BESI Group (Netherlands)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
STATS ChipPAC Ltd. (Singapore)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments