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CMP 耗材浆料和抛光垫市场：2024-2025
市场调查报告书
商品编码
1501230

CMP 耗材浆料和抛光垫市场：2024-2025

CMP Consumables Slurry & Pads Executive Edition Market Report 2024-2025
出版日期: | 出版商: TECHCET | 英文 46 Pages | 商品交期: 最快1-2个工作天内

价格

本报告调查了 CMP 耗材浆料和抛光垫市场，并提供了半导体装置製造中使用的 CMP 抛光垫和抛光垫的市场概况和供应链。

目录

第1章 半导体市场现况与展望

  • 世界经济与展望
  • 半导体产业与全球经济的联繫
  • TECHCET半导体销售预测
  • 台湾外包厂商每月销售趋势
  • 半导体製造业的成长与扩张
  • 晶片扩张的巨额投资
  • WW FAB 扩张推动成长
  • 美国新厂
  • 政策和贸易趋势及影响
  • 半导体材料概述

第2章 CMP浆料与抛光垫

  • CMP耗材市场前景
  • 影响 CMP 耗材前景的细分市场趋势
  • 技术趋势
  • 区域趋势
  • CMP浆料5年获利预测
  • 浆料供应商竞争格局
    • 氧化物（二氧化铈）浆料市场
    • HKMG浆料市场
    • 多晶硅浆料市场
    • 氧化物（二氧化硅）浆料市场
    • 钨浆市场
    • CU散装浆料市场
    • 铜阻隔浆料市场
    • 新金属（CO、MO、RU等）浆料市场
    • CU背面电源浆料市场
  • CMP Slurry 併购活动、投资、公告和合作伙伴关係
  • EHS：与浆料处置、回收和回收相关的问题
  • 物流问题
  • TECHHCET 分析师对 CMP 浆料市场的评级
  • CMP PADS 5年收入预测
  • 垫供应商的竞争格局
  • CMP PAD 物流问题、併购活动、公告和合作伙伴关係
  • TECHHCET 分析师评级

This report provides an executive overview of the market landscape and supply-chain for CMP Pads and Slurry used in semiconductor device fabrication. It includes concise information about key suppliers, issues/trends in the material supply chain, estimates on supplier share ranking, and forecasts for the material segments.This Executive Edition(TM) report provides focused information for Business Development Managers, Supply Chain Managers, R&D directors, Investors / Financial Analysts and Policy Makers.

TABLE OF CONTENTS

1. SEMICONDUCTOR MARKET STATUS & OUTLOOK

  • 1.1. WORLDWIDE ECONOMY AND OUTLOOK
  • 1.2. SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY
  • 1.3. TECHCET'S SEMICONDUCTOR REVENUE FORECAST
  • 1.4. TAIWAN OUTSOURCE MANUFACTURER MONTHLY SALES TRENDS
  • 1.5. SEMICONDUCTOR FABRICATION GROWTH & EXPANSION
  • 1.6. IN THE MIDST OF HUGE INVESTMENT IN CHIP EXPANSIONS
  • 1.7. WW FAB EXPANSION DRIVING GROWTH
  • 1.8. NEW FABS IN THE US
  • 1.9. POLICY & TRADE TRENDS AND IMPACT
  • 1.10. SEMICONDUCTOR MATERIALS OVERVIEW

2. CMP SLURRY AND PADS

  • 2.1. CMP CONSUMABLES MARKET OUTLOOK
  • 2.2. SEGMENT TRENDS IMPACTING CMP CONSUMABLES OUTLOOK
  • 2.3. TECHNOLOGY TRENDS
  • 2.4. REGIONAL TRENDS
  • 2.5. CMP SLURRIES 5-YEAR REVENUE FORECAST
    • 2.5.1. CMP SLURRIES 5-YEAR FORECAST BY UNITS
  • 2.6. SLURRY SUPPLIER COMPETITIVE LANDSCAPE
    • 2.6.1. OXIDE (CERIA) SLURRY MARKET
    • 2.6.2. HKMG SLURRY MARKET
    • 2.6.3. POLYSILICON SLURRY MARKET
    • 2.6.4. OXIDE (SILICA) SLURRY MARKET
    • 2.6.5. TUNGSTEN SLURRY MARKET
    • 2.6.6. CU BULK SLURRY MARKET
    • 2.6.7. COPPER BARRIER SLURRY MARKET
    • 2.6.8. NEW METALS (CO, MO, RU, ETC.) SLURRY MARKET
    • 2.6.9. CU BACKSIDE POWER SLURRY MARKET
  • 2.7. CMP SLURRY M&A ACTIVITY, INVESTMENTS, ANNOUNCEMENTS AND PARTNERSHIPS
  • 2.8. EHS: ISSUES FOR SLURRY DISPOSAL, RECYCLING AND RECLAIM
    • 2.8.1. EHS: ISSUES FOR NEW MATERIALS
  • 2.9. LOGISTIC ISSUES
  • 2.10. TECHCET ANALYST ASSESSMENT OF CMP SLURRY MARKET
  • 2.11. CMP PADS 5-YEAR REVENUE FORECAST
    • 2.11.1. CMP PADS 5-YEAR REVENUE FORECAST BY WAFER SIZE
    • 2.11.2. CMP PADS 5-YEAR FORECAST BY UNITS
  • 2.12. PAD SUPPLIER COMPETITIVE LANDSCAPE
    • 2.12.1. PAD SUPPLIER COMPETITIVE LANDSCAPE: NEW ENTRANTS
  • 2.13. CMP PAD LOGISTICS ISSUES, M&A ACTIVITY, ANNOUNCEMENTS AND PARTNERSHIPS
  • 2.14. TECHCET ANALYST ASSESSMENT

LIST OF FIGURES

  • FIGURE 1.1: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2023)
  • FIGURE 1.2: SEMICONDUCTOR CHIP REVENUE FORECAST
  • FIGURE 1.3: TECHCET'S TAIWAN SEMICONDUCTOR INDUSTRY INDEX (TTSITM)
  • FIGURE 1.4: TSMC PHOENIX CAMPUS WITH THE 2ND FAB VISIBLE IN THE BACKGROUND
  • FIGURE 1.5: ESTIMATED GLOBAL FAB SPENDING 2023-2028
  • FIGURE 1.6: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD
  • FIGURE 1.7: FAB EXPANSIONS WITHIN THE US
  • FIGURE 2.1: CMP CONSUMABLES FORECAST
  • FIGURE 2.2: CMP STEPS FOR ADVANCED DEVICES
  • FIGURE 2.3: CMOS TECHNOLOGY ROADMAP
  • FIGURE 2.4: SLURRY AND PAD REVENUE BY HQ REGION
  • FIGURE 2.5: CMP SLURRY REVENUE BY APPLICATION
  • FIGURE 2.6: FORECASTED SLURRY VOLUME DEMAND
  • FIGURE 2.7: CMP PAD REVENUE FORECAST BY APPLICATION
  • FIGURE 2.8: CMP PAD REVENUE BY WAFER SIZE
  • FIGURE 2.9: FORECASTED QUANTITY PAD USAGE

LIST OF TABLES

  • TABLE 1.1: GLOBAL GDP AND SEMICONDUCTOR REVENUES
  • TABLE 2.1: 2023 SLURRY SUPPLIER RANKING
  • TABLE 2.2: OXIDE (CERIA) CMP SLURRY 2023 - $399M SUPPLIER RANKING
  • TABLE 2.3: HKMG/FRONT-END CMP SLURRY 2023 - $67M MARKET SHARE
  • TABLE 2.4: POLYSILICON CMP SLURRY 2023 - $40M MARKET SHARE
  • TABLE 2.5: OXIDE (SILICA) CMP SLURRY 2023 - $236M MARKET SHARE
  • TABLE 2.6: TUNGSTEN CMP SLURRY 2023 - $429M MARKET SHARE
  • TABLE 2.7: CU-BULK CMP SLURRY 2023 - $302M MARKET SHARE
  • TABLE 2.8: CU-BARRIER CMP SLURRY 2023 SUPPLIER MARKET SHARE
  • TABLE 2.9: NEW METALS CMP SLURRY 2023 MARKET SHARE - $3M
  • TABLE 2.10: CU BACKSIDE POWER CMP SLURRY 2023 MARKET SHARE - $1M
  • TABLE 2.11: 2023 PAD SUPPLIER RANKINGS
  • TABLE 2.12: PAD AND SUB-PAD SUPPLIER LIST