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市场调查报告书
商品编码
1471958

3D 堆迭市场规模和预测、全球和区域份额、趋势和成长机会分析报告范围：按互连技术、设​​备类型、最终用户和地理位置

3D Stacking Market Size and Forecast, Global and Regional Share, Trend, and Growth Opportunity Analysis Report Coverage: By Interconnecting Technology, Device Type, End User, and Geography
出版日期: | 出版商: The Insight Partners | 英文 150 Pages | 商品交期: 1-5个工作天内

价格
简介目录

2022年全球3D堆迭市场估值为18.1亿美元，预计2030年将达59.3亿美元；预计 2022 年至 2030 年复合年增长率为 16.0%。

亚太地区 3D 堆迭市场因台积电和三星半导体等知名公司在该地区拥有完善的製造设施而获得了突出地位。此外，中国、台湾、韩国和日本等国家是全球半导体和电子元件的製造中心。对智慧型手机、平板电脑和穿戴式装置等更小、更强大、更节能的装置的需求推动了该产业采用 3D 堆迭技术。

亚太地区 3D 堆迭技术的工业应用取得了显着成长。航空航太、汽车和医疗保健等产业越来越多地将 3D 堆迭用于各种目的。例如，在航空航太工业中，对轻型飞机零件的需求导致了积层製造的广泛采用，其中包括 3D 堆迭技术。因此，3D 堆迭在航空航天工业中的日益增长的应用预计将成为该地区 3D 堆迭市场的关键趋势之一。

台积电股份有限公司；英特尔公司； Advanced Micro Devices公司;恩智浦半导体；博通公司；日月光科技；德州仪器公司；联发科技、Amkor 科技；和三星半导体公司是 3D 堆迭市场报告中介绍的几位参与者。市场参与者专注于新产品的推出、扩张和多元化以及收购，这使他们能够获得现有的商机。

整体 3D 堆迭市场分析是使用主要和次要来源得出的。为了开始 3D 堆迭市场研究过程，我们利用内部和外部来源进行了详尽的次要研究，以获得与 3D 堆迭市场相关的定性和定量资讯。此流程还可用于获取所有细分市场的 3D 堆迭市场成长概况和市场预测。此外，我们还与行业参与者和评论员进行了多次主要访谈，以验证资料并获得有关该主题的更多分析见解。此流程的参与者包括副总裁、业务开发经理、市场情报经理和国家销售经理等行业专家，以及估值专家、研究分析师和关键意见领袖等外部顾问，专门从事 3D 堆迭市场预测。

目录

第 1 章：简介

第 2 章：执行摘要

  • 重要见解
  • 市场吸引力分析

第 3 章：研究方法

第 4 章：3D 堆迭市场格局

  • 概述
  • PEST分析
  • 生态系分析
    • 价值链供应商名单

第 5 章：3D 堆迭市场 - 主要市场动态

  • 主要市场驱动因素
  • 主要市场限制
  • 主要市场机会
  • 未来的趋势
  • 驱动因素和限制因素的影响分析

第 6 章：3D 堆迭市场 - 全球市场分析

  • 3D 堆迭 - 全球市场概览
  • 3D 堆迭 - 全球市场与 2031 年预测

第 7 章：3D 堆迭市场 - 收入分析 - 按互连技术，2020-2030 年

  • 概述
  • 硅通孔
  • 单晶片 3D 集成
  • 3D 混合接合

第 8 章：3D 堆迭市场 - 收入分析 - 按设备类型，2020-2030 年

  • 概述
  • 储存装置
  • MEMS/感测器
  • LED
  • 成像与光电
  • 其他的

第 9 章：3D 堆迭市场 - 收入分析 - 按最终用户，2020-2030 年

  • 概述
  • 消费性电子产品
  • 电信
  • 汽车
  • 製造业
  • 卫生保健
  • 其他的

第 10 章：3D 堆迭市场 - 收入分析，2020-2030 - 地理分析

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥

註 - 将为以下提到的地区/国家提供类似的分析

  • 欧洲
    • 德国
    • 法国
    • 义大利
    • 英国
    • 俄罗斯
    • 欧洲其他地区
  • 亚太
    • 澳洲
    • 中国
    • 印度
    • 日本
    • 韩国
    • 台湾
    • 亚太其他地区
  • 中东和非洲
    • 南非
    • 沙乌地阿拉伯
    • 阿联酋
    • 中东和非洲其他地区
  • 南美洲和中美洲
    • 巴西
    • 阿根廷
    • 南美洲和中美洲其他地区

第 11 章：产业格局

  • 併购
  • 协议、合作、合资企业
  • 新产品发布
  • 扩张和其他策略发展

第 12 章：竞争格局

  • 关键参与者的热图分析
  • 公司定位与专注

第 13 章：3D 堆迭市场 - 主要公司简介

  • Taiwan Semiconductor Manufacturing Company Limited
  • Intel Corporation
  • Advanced Micro Devices
  • NXP Semiconductors
  • Broadcom Inc.
  • ASE Technology
  • Texas Instruments Incorporated
  • MediaTek Inc.
  • Amkor Technology
  • Samsung Semiconductor, Inc.

第 14 章：附录

简介目录
Product Code: TIPRE00039036

The global 3D stacking market was valued at US$ 1.81 billion in 2022 and is expected to reach US$ 5.93 billion by 2030; it is projected to register a CAGR of 16.0% from 2022 to 2030. The 3D stacking market report emphasizes the key factors driving the market and showcases the developments of prominent players.

The Asia Pacific 3D stacking market has gained prominence owing to the presence of well-established manufacturing facilities of renowned companies-such as Taiwan Semiconductor Manufacturing Company Limited and Samsung Semiconductor, Inc.-in the region. Moreover, countries such as China, Taiwan, South Korea, and Japan are global manufacturing hubs for semiconductors and electronic components. The demand for smaller, more powerful, and energy-efficient devices, such as smartphones, tablets, and wearables, drives the adoption of 3D stacking technologies in this industry.

Asia Pacific has witnessed remarkable growth in the industrial applications of 3D stacking technologies. Industries such as aerospace, automotive, and healthcare are increasingly utilizing 3D stacking for various purposes. For instance, in the aerospace industry, the demand for lightweight aircraft components has led to the widespread adoption of additive manufacturing, which includes 3D stacking techniques. Thus, the growing application of 3D stacking in the aerospace industry is anticipated to be one of the key 3D stacking market trends in the region.

Taiwan Semiconductor Manufacturing Company Limited; Intel Corporation; Advanced Micro Devices; NXP Semiconductors; Broadcom Inc.; ASE Technology; Texas Instruments Incorporated; MediaTek Inc., Amkor Technology; and Samsung Semiconductor, Inc. are a few players profiled in the 3D stacking market report. The market players focus on new product launches, expansion and diversification, and acquisition, which allow them to access prevailing business opportunities.

The overall 3D stacking market analysis has been derived using both primary and secondary sources. To begin the 3D stacking market research process, exhaustive secondary research has been conducted using internal and external sources to obtain qualitative and quantitative information related to the 3D stacking market. The process also serves the purpose of obtaining an overview and market forecast for the 3D stacking market growth with respect to all market segments. Also, multiple primary interviews have been conducted with industry participants and commentators to validate the data and gain more analytical insights about the topic. Participants of this process include industry experts such as VPs, business development managers, market intelligence managers, and national sales managers-along with external consultants such as valuation experts, research analysts, and key opinion leaders-specializing in the 3D stacking market forecast.

Table Of Contents

1. Introduction

  • 1.1 Scope of the Study
  • 1.2 Market Definition, Assumptions and Limitations
  • 1.3 Market Segmentation

2. Executive Summary

  • 2.1 Key Insights
  • 2.2 Market Attractiveness Analysis

3. Research Methodology

4. 3D Stacking Market Landscape

  • 4.1 Overview
  • 4.2 PEST Analysis
  • 4.3 Ecosystem Analysis
    • 4.3.1 List of Vendors in the Value Chain

5. 3D Stacking Market - Key Market Dynamics

  • 5.1 Key Market Drivers
  • 5.2 Key Market Restraints
  • 5.3 Key Market Opportunities
  • 5.4 Future Trends
  • 5.5 Impact Analysis of Drivers and Restraints

6. 3D Stacking Market - Global Market Analysis

  • 6.1 3D Stacking - Global Market Overview
  • 6.2 3D Stacking - Global Market and Forecast to 2031

7. 3D Stacking Market - Revenue Analysis (USD Million) - By Interconnecting Technology, 2020-2030

  • 7.1 Overview
  • 7.2 Through-Silicon Via
  • 7.3 Monolithic 3D Integration
  • 7.4 3D Hybrid Bonding

8. 3D Stacking Market - Revenue Analysis (USD Million) - By Device Type, 2020-2030

  • 8.1 Overview
  • 8.2 Memory Devices
  • 8.3 MEMS/Sensors
  • 8.4 LEDs
  • 8.5 Imaging and Optoelectronics
  • 8.6 Others

9. 3D Stacking Market - Revenue Analysis (USD Million) - By End User, 2020-2030

  • 9.1 Overview
  • 9.2 Consumer Electronics
  • 9.3 Telecommunication
  • 9.4 Automotive
  • 9.5 Manufacturing
  • 9.6 Healthcare
  • 9.7 Others

10. 3D Stacking Market - Revenue Analysis (USD Million), 2020-2030 - Geographical Analysis

  • 10.1 North America
    • 10.1.1 North America 3D Stacking Market Overview
    • 10.1.2 North America 3D Stacking Market Revenue and Forecasts to 2031
    • 10.1.3 North America 3D Stacking Market Revenue and Forecasts and Analysis - By Interconnecting Technology
    • 10.1.4 North America 3D Stacking Market Revenue and Forecasts and Analysis - By Device Type
    • 10.1.5 North America 3D Stacking Market Revenue and Forecasts and Analysis - By End User
    • 10.1.6 North America 3D Stacking Market Revenue and Forecasts and Analysis - By Countries
      • 10.1.6.1 United States 3D Stacking Market
        • 10.1.6.1.1 United States 3D Stacking Market, by Interconnecting Technology
        • 10.1.6.1.2 United States 3D Stacking Market, by Device Type
        • 10.1.6.1.3 United States 3D Stacking Market, by End User
      • 10.1.6.2 Canada 3D Stacking Market
        • 10.1.6.2.1 Canada 3D Stacking Market, by Interconnecting Technology
        • 10.1.6.2.2 Canada 3D Stacking Market, by Device Type
        • 10.1.6.2.3 Canada 3D Stacking Market, by End User
      • 10.1.6.3 Mexico 3D Stacking Market
        • 10.1.6.3.1 Mexico 3D Stacking Market, by Interconnecting Technology
        • 10.1.6.3.2 Mexico 3D Stacking Market, by Device Type
        • 10.1.6.3.3 Mexico 3D Stacking Market, by End User

Note - Similar analysis would be provided for below mentioned regions/countries

  • 10.2 Europe
    • 10.2.1 Germany
    • 10.2.2 France
    • 10.2.3 Italy
    • 10.2.4 United Kingdom
    • 10.2.5 Russia
    • 10.2.6 Rest of Europe
  • 10.3 Asia-Pacific
    • 10.3.1 Australia
    • 10.3.2 China
    • 10.3.3 India
    • 10.3.4 Japan
    • 10.3.5 South Korea
    • 10.3.6 Taiwan
    • 10.3.7 Rest of Asia-Pacific
  • 10.4 Middle East and Africa
    • 10.4.1 South Africa
    • 10.4.2 Saudi Arabia
    • 10.4.3 U.A.E
    • 10.4.4 Rest of Middle East and Africa
  • 10.5 South and Central America
    • 10.5.1 Brazil
    • 10.5.2 Argentina
    • 10.5.3 Rest of South and Central America

11. Industry Landscape

  • 11.1 Mergers and Acquisitions
  • 11.2 Agreements, Collaborations, Joint Ventures
  • 11.3 New Product Launches
  • 11.4 Expansions and Other Strategic Developments

12. Competitive Landscape

  • 12.1 Heat Map Analysis by Key Players
  • 12.2 Company Positioning and Concentration

13. 3D Stacking Market - Key Company Profiles

  • 13.1 Taiwan Semiconductor Manufacturing Company Limited
    • 13.1.1 Key Facts
    • 13.1.2 Business Description
    • 13.1.3 Products and Services
    • 13.1.4 Financial Overview
    • 13.1.5 SWOT Analysis
    • 13.1.6 Key Developments

Note - Similar information would be provided for below list of companies

  • 13.2 Intel Corporation
  • 13.3 Advanced Micro Devices
  • 13.4 NXP Semiconductors
  • 13.5 Broadcom Inc.
  • 13.6 ASE Technology
  • 13.7 Texas Instruments Incorporated
  • 13.8 MediaTek Inc.
  • 13.9 Amkor Technology
  • 13.10 Samsung Semiconductor, Inc.

14. Appendix

  • 14.1 Glossary
  • 14.2 About The Insight Partners
  • 14.3 Market Intelligence Cloud