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半导体工厂自动化:技术的问题与市场预测
市场调查报告书
商品编码
1266891

半导体工厂自动化:技术的问题与市场预测

Semiconductor Factory Automation: Technology Issues and Market Forecasts
出版日期: | 出版商: Information Network | 英文 | 商品交期: 2-3个工作天内

价格

本报告提供半导体工厂自动化产业调查分析，主要企业和促进因素等资讯。

目录

第1章 简介

第2章 摘要整理

第3章 促进因素

  • 简介
  • 300/450mm晶圆的趋势
  • 开发费
  • 单一晶圆处理
  • 处理工具趋势
  • 自动化趋势
  • 自动晶圆处理的优点

第4章 软体

  • 简介
  • CIM的演进
  • 产业的MES
    • MES的功能
    • MES的产品
  • 通讯规格
  • Sematech CIM组成架构

第5章 硬体设备

  • 简介
  • 自动化的要素
    • 工具的自动化
    • Intrabay自动化
    • Interbay自动化
    • 材料管理系统
  • 弹性自动化
  • 可靠性
  • 工具的问题和趋势
    • 弹性工具介面
    • 真空机器人
    • 自动导引运输车
    • 机器人控制系统
    • 300mm晶圆搬运
    • 迷你环境和无尘室的问题
  • E-製造业

第6章 市场分析

  • 市场力量
  • 市场预测的前提条件
  • 市场预测
    • 自动传输工具市场
    • carrier搬运市场
    • MES软体市场

第7章 用户的问题

  • 目前自动化的想法
  • 新工厂的范例
  • 运作中的新工厂
  • 投资报酬率相关的考虑事项
  • 旧范例的8个症状
  • 使新范例发挥作用

Clean processing has driven the proliferation of wafer-handling automation within process tools. Wafer-handling robot arms in vacuum and atmospheric tools are standard today. Meanwhile, Moore's Law played the primary role in wafer size increases and the automation that is present outside of the process tools.

This report addresses these technical issues, presenting an analysis of the semiconductor factory automation industry, the key players, and the driving forces directing semiconductor factory automation.

Markets are segmented as:

  • 1. Automated transfer tools (robots, elevators, platforms, etc.),
  • 2. Carrier transport (monorail, AGV, AS/RS, etc.),
  • 3. Manufacturing execution systems (MES) software.

With the move to 450mm wafers - changes in wafer size, weight, fragility, risk of damage or creation of damaging particles - existing wafer handling robots and the drives, motors, linear components and controls that automate these wafer handling tools will need a new generation of components to satisfy the requirements of 450mm wafer handling. The vacuum and atmospheric robotic market is forecast and market shares of vendors presented.

Table of Contents

Chapter 1. Introduction

Chapter 2. Executive Summary

  • 2.1. Summary of Major Issues
  • 2.2. Summary of Market Forecasts

Chapter 3. Driving Forces

  • 3.1. Introduction
  • 3.2. Trend to 300/450mm Wafers
  • 3.3. Development Costs
  • 3.4. Single-Wafer Processing
  • 3.5. Trends in Processing Tools
  • 3.6. Automation Trends
  • 3.7. Benefits of Automated Wafer Handling

Chapter 4. Software

  • 4.1. Introduction
  • 4.2. The Evolution of CIM
  • 4.3. MES in Industry
    • 4.3.1. MES Functionalities
    • 4.3.2. MES Products
  • 4.4. Communication Standards
  • 4.5. Sematech CIM Framework

Chapter 5. Hardware

  • 5.1. Introduction
  • 5.2. Elements of Automation
    • 5.2.1. Tool Automation
    • 5.2.2. Intrabay Automation
    • 5.2.3. Interbay Automation
    • 5.2.4. Material-Control System
  • 5.3. Flexible Automation
  • 5.4. Reliability
  • 5.5. Tool Issues and Trends
    • 5.5.1. Flexible Tool Interface
    • 5.5.2. Vacuum Robotics
    • 5.5.3. AGV
    • 5.5.4. Robot Control Systems
    • 5.5.5. 300-mm Wafer Transport
    • 5.5.6. Mini-Environments and Cleanroom Issues
  • 5.6. E-Manufacturing

Chapter 6. Market Analysis

  • 6.1. Market Forces
  • 6.2. Market Forecast Assumptions
  • 6.3. Market Forecast
    • 6.3.1. Automated Transfer Tool Market
    • 6.3.2. Carrier Transport Market
    • 6.3.3. MES Software Market

Chapter 7. User Issues

  • 7.1. Current Automation Thinking
  • 7.2. The New Factory Paradigm
  • 7.3. The New Factory in Action
  • 7.4. Return on Investment Considerations
  • 7.5. Eight Symptoms of the Old Paradigm
  • 7.6. Putting the New Paradigm to Work

List of Figures

  • 1.1. Advanced CIM System
  • 3.1. Automated Materials Handling System (AMHS) Framework
  • 4.1. Evolution of CIM
  • 4.2. Computer Integrated Fab Environment
  • 4.3. Message Integration in CIM
  • 4.4. Sematech CIM Framework Scope
  • 5.1. Material-Control System
  • 5.2. Traditional and Flexible Automated Material Handling System
  • 5.3. Overhead Monorail Delivery - Cassette in Box, Cassette in SMIF Pod
  • 5.4. Stocker Design and Interfaces
  • 5.5. Layout Of a 45nm 300mm Fab
  • 5.6. Interfaces To Factory Automation Systems
  • 6.1. Semiconductor Equipment Utilization
  • 6.2. Revenue Losses from Wafer Defects
  • 6.3. Market Shares of Atmospheric Robot Suppliers
  • 6.4. Market Shares of Vacuum Robot Suppliers
  • 6.6. Worldwide Market Shares of Carrier Transport Suppliers
  • 6.7. Worldwide Market of Shares MES Software Suppliers

List of Tables

  • 5.1. Evolution Of Factory Metrics
  • 6.1. Three-Year Savings for Automation
  • 6.2. Cost of Alternative Automated Systems
  • 6.3. Three-year Costs for Alternative Automated Systems
  • 6.4. Worldwide Forecast of Automated Transfer Tools
  • 6.5. Bill Of Materials For Atmospheric Automation Tool
  • 6.6. Bill Of Materials For PVD Vacuum Tool
  • 6.7. Process Tool Automation For 300mm Fabs
  • 6.8. Worldwide Forecast of Carrier Transport Market
  • 6.9. 300mm Fab Construction Plans
  • 6.10. Worldwide Forecast of MES Software