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市场调查报告书
商品编码
1521210

半导体晶圆抛光和研磨设备市场报告（按类型（半导体晶圆抛光设备、半导体晶圆研磨设备）、最终用户（代工厂、记忆体製造商、IDM 等）和地区 2024-2032

Semiconductor Wafer Polishing and Grinding Equipment Market Report by Type (Semiconductor Wafer Polishing Equipment, Semiconductor Wafer Grinding Equipment), End User (Foundries, Memory Manufacturers, IDMs, and Others), and Region 2024-2032
出版日期: | 出版商: IMARC | 英文 146 Pages | 商品交期: 2-3个工作天内

价格

IMARC Group年全球半导体晶圆抛光研磨设备市场规模达4.312亿美元。

抛光、研磨设备是指半导体晶圆製造过程中普遍使用的先进、不可或缺的零件。它们涉及沉积、光刻、离子注入、蚀刻和清洁，作为在金相工具、圆盘精加工和研磨机的帮助下执行的一些标准方法。半导体晶圆抛光和研磨设备有助于从薄膜中去除不需要的材料，并减薄和精炼产品，同时确保表面光滑且无损坏。由于这些特性，它们被代工厂和记忆体製造商广泛用于建构积体电路。

半导体晶圆抛光和研磨设备市场趋势：

随着电子产业的快速扩张，用于製造各种消费性电子产品（包括智慧型手机、笔记型电脑和桌上型电脑）的微机电系统（MEMS）、微晶片和积体电路的需求不断增加。这反过来又促进了先进的半导体晶圆研磨和抛光机械的广泛采用，以减薄和减轻晶圆损坏，这是目前推动市场成长的主要因素之一。与此一致的是，重大技术进步，例如采用金属氧化物半导体（MOS）和化学机械抛光（CMP）解决方案来在生产过程中保持晶圆表面轮廓，正在成为其他成长诱导因素。该市场还受到无线技术大规模整合的支持，包括物联网 (IoT) 和人工智慧 (AI)，帮助製造商设计智慧设备。此外，晶圆製造厂广泛使用抛光和研磨设备来製造系统单晶片（SoC）晶片，也促进了市场的成长。其他因素，例如对采用更薄晶圆的小型电子设备的需求不断增长、对研发(R&D) 活动的持续投资，以及主要参与者之间的战略合作以推出高性能晶圆抛光和研磨工具，都为该行业创造了积极的前景。

本报告回答的关键问题：

  • 迄今为止，全球半导体晶圆抛光和研磨设备市场表现如何，未来几年将如何表现？
  • COVID-19对全球半导体晶圆抛光和研磨设备市场有何影响？
  • 主要区域市场有哪些？
  • 依类型划分市场是怎么样的？
  • 基于最终用户的市场区隔是什么？
  • 产业价值链的各个阶段是什么？
  • 该行业的关键驱动因素和挑战是什么？
  • 全球半导体晶圆抛光研磨设备市场结构如何？
  • 产业竞争程度如何？

目录

第一章：前言

第 2 章：范围与方法

  • 研究目的
  • 利害关係人
  • 资料来源
    • 主要资源
    • 二手资料
  • 市场预测
    • 自下而上的方法
    • 自上而下的方法
  • 预测方法

第 3 章：执行摘要

第 4 章：简介

  • 概述
  • 主要行业趋势

第 5 章：全球半导体晶圆抛光与研磨设备市场

  • 市场概况
  • 市场业绩
  • COVID-19 的影响
  • 市场预测

第 6 章：市场区隔：按类型

  • 半导体晶圆抛光设备
    • 市场走向
    • 市场预测
  • 半导体晶圆研磨设备
    • 市场走向
    • 市场预测

第 7 章：市场区隔：按最终用户

  • 铸造厂
    • 市场走向
    • 市场预测
  • 记忆体製造商
    • 市场走向
    • 市场预测
  • IDM
    • 市场走向
    • 市场预测
  • 其他的
    • 市场走向
    • 市场预测

第 8 章：市场区隔：按地区

  • 北美洲
    • 美国
    • 加拿大
  • 亚太
    • 中国
    • 日本
    • 印度
    • 韩国
    • 澳洲
    • 印尼
    • 其他的
  • 欧洲
    • 德国
    • 法国
    • 英国
    • 义大利
    • 西班牙
    • 俄罗斯
    • 其他的
  • 拉丁美洲
    • 巴西
    • 墨西哥
    • 其他的
  • 中东和非洲
    • 市场走向
    • 市场细分：按国家/地区
    • 市场预测

第 9 章：SWOT 分析

  • 概述
  • 优势
  • 弱点
  • 机会
  • 威胁

第 10 章：价值链分析

第 11 章：波特五力分析

  • 概述
  • 买家的议价能力
  • 供应商的议价能力
  • 竞争程度
  • 新进入者的威胁
  • 替代品的威胁

第 12 章：价格分析

第13章：竞争格局

  • 市场结构
  • 关键参与者
  • 关键参与者简介
    • Accretech (Europe) Gmbh (Tokyo Seimitsu Co. Ltd.)
    • Amtech Systems Inc.
    • Axus Technology
    • BBS Kinmei Co Ltd
    • Disco Corporation
    • Dynavest Pte Ltd
    • Ebara Corporation
    • Gigamat Technologies Inc.
    • Lapmaster Wolters GmbH (Lapmaster International LLC)
    • Logitech Ltd.
    • Okamoto Machine Tool Works Ltd
    • Revasum Inc.
Product Code: SR112024A5866

The global semiconductor wafer polishing and grinding equipment market size reached US$ 431.2 Million in 2023. Looking forward, IMARC Group expects the market to reach US$ 647.8 Million by 2032, exhibiting a growth rate (CAGR) of 4.5% during 2024-2032.

Polishing and grinding equipment refer to advanced, indispensable components generally used while fabricating semiconductor wafers. They involve deposition, lithography, Ion implant, etching, and cleaning as some of the standard methods performed with the assistance of metallographic tools, disc finishing, and lapping machines. Semiconductor wafer polishing and grinding equipment aid in removing unwarranted material from a film and thinning and refining the product while ensuring a smooth and damage-free surface. On account of these properties, they are extensively utilized by foundries and memory manufacturers for composing integrated circuits.

Semiconductor Wafer Polishing and Grinding Equipment Market Trends:

With the rapid expansion in the electronics industry, there has been increasing demand for microelectromechanical systems (MEMS), microchips and integrated circuits for manufacturing various consumer electronic goods, including smartphones, laptops and desktops. This, in turn, has facilitated the widespread adoption of advanced semiconductor wafer grinding and polishing machinery for thinning and mitigating damage from wafers, which represents one of the prime factors currently driving the market growth. In line with this, significant technological advancements, such as the employment of metal-oxide-semiconductor (MOS) and chemical-mechanical-polishing (CMP) solutions to maintain the wafer surface profile during production processes, are acting as other growth-inducing factors. The market is also being supported by the large-scale integration of wireless technologies, including the Internet of Things (IoT) and artificial intelligence (AI), that help manufacturers engineer smart devices. Additionally, the extensive utilization of polishing and grinding equipment in wafer fabrication plants to manufacture a system on a chip (SoC) dice is contributing to the market growth. Other factors, such as the rising need for miniaturized electronic devices with thinner wafers, continuous investments in research and development (R&D) activities, and strategic collaborations amongst key players to introduce high-performance wafer polishing and grinding tools are creating a positive outlook for the market.

Key Market Segmentation:

IMARC Group provides an analysis of the key trends in each sub-segment of the global semiconductor wafer polishing and grinding equipment market report, along with forecasts at the global, regional and country level from 2024-2032. Our report has categorized the market based on type and end user.

Breakup by Type:

Semiconductor Wafer Polishing Equipment

Semiconductor Wafer Grinding Equipment

Breakup by End User:

Foundries

Memory Manufacturers

IDMs

Others

Breakup by Region:

North America

United States

Canada

Asia-Pacific

China

Japan

India

South Korea

Australia

Indonesia

Others

Europe

Germany

France

United Kingdom

Italy

Spain

Russia

Others

Latin America

Brazil

Mexico

Others

Middle East and Africa

Competitive Landscape:

The competitive landscape of the industry has also been examined along with the profiles of the key players being Accretech (Europe) Gmbh (Tokyo Seimitsu Co. Ltd.), Amtech Systems Inc., Axus Technology, BBS Kinmei Co Ltd, Disco Corporation, Dynavest Pte Ltd, Ebara Corporation, Gigamat Technologies Inc., Lapmaster Wolters GmbH (Lapmaster International LLC), Logitech Ltd., Okamoto Machine Tool Works Ltd and Revasum Inc.

Key Questions Answered in This Report:

  • How has the global semiconductor wafer polishing and grinding equipment market performed so far and how will it perform in the coming years?
  • What has been the impact of COVID-19 on the global semiconductor wafer polishing and grinding equipment market?
  • What are the key regional markets?
  • What is the breakup of the market based on the type?
  • What is the breakup of the market based on the end user?
  • What are the various stages in the value chain of the industry?
  • What are the key driving factors and challenges in the industry?
  • What is the structure of the global semiconductor wafer polishing and grinding equipment market and who are the key players?
  • What is the degree of competition in the industry?

Table of Contents

1 Preface

2 Scope and Methodology

  • 2.1 Objectives of the Study
  • 2.2 Stakeholders
  • 2.3 Data Sources
    • 2.3.1 Primary Sources
    • 2.3.2 Secondary Sources
  • 2.4 Market Estimation
    • 2.4.1 Bottom-Up Approach
    • 2.4.2 Top-Down Approach
  • 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

  • 4.1 Overview
  • 4.2 Key Industry Trends

5 Global Semiconductor Wafer Polishing and Grinding Equipment Market

  • 5.1 Market Overview
  • 5.2 Market Performance
  • 5.3 Impact of COVID-19
  • 5.4 Market Forecast

6 Market Breakup by Type

  • 6.1 Semiconductor Wafer Polishing Equipment
    • 6.1.1 Market Trends
    • 6.1.2 Market Forecast
  • 6.2 Semiconductor Wafer Grinding Equipment
    • 6.2.1 Market Trends
    • 6.2.2 Market Forecast

7 Market Breakup by End User

  • 7.1 Foundries
    • 7.1.1 Market Trends
    • 7.1.2 Market Forecast
  • 7.2 Memory Manufacturers
    • 7.2.1 Market Trends
    • 7.2.2 Market Forecast
  • 7.3 IDMs
    • 7.3.1 Market Trends
    • 7.3.2 Market Forecast
  • 7.4 Others
    • 7.4.1 Market Trends
    • 7.4.2 Market Forecast

8 Market Breakup by Region

  • 8.1 North America
    • 8.1.1 United States
      • 8.1.1.1 Market Trends
      • 8.1.1.2 Market Forecast
    • 8.1.2 Canada
      • 8.1.2.1 Market Trends
      • 8.1.2.2 Market Forecast
  • 8.2 Asia-Pacific
    • 8.2.1 China
      • 8.2.1.1 Market Trends
      • 8.2.1.2 Market Forecast
    • 8.2.2 Japan
      • 8.2.2.1 Market Trends
      • 8.2.2.2 Market Forecast
    • 8.2.3 India
      • 8.2.3.1 Market Trends
      • 8.2.3.2 Market Forecast
    • 8.2.4 South Korea
      • 8.2.4.1 Market Trends
      • 8.2.4.2 Market Forecast
    • 8.2.5 Australia
      • 8.2.5.1 Market Trends
      • 8.2.5.2 Market Forecast
    • 8.2.6 Indonesia
      • 8.2.6.1 Market Trends
      • 8.2.6.2 Market Forecast
    • 8.2.7 Others
      • 8.2.7.1 Market Trends
      • 8.2.7.2 Market Forecast
  • 8.3 Europe
    • 8.3.1 Germany
      • 8.3.1.1 Market Trends
      • 8.3.1.2 Market Forecast
    • 8.3.2 France
      • 8.3.2.1 Market Trends
      • 8.3.2.2 Market Forecast
    • 8.3.3 United Kingdom
      • 8.3.3.1 Market Trends
      • 8.3.3.2 Market Forecast
    • 8.3.4 Italy
      • 8.3.4.1 Market Trends
      • 8.3.4.2 Market Forecast
    • 8.3.5 Spain
      • 8.3.5.1 Market Trends
      • 8.3.5.2 Market Forecast
    • 8.3.6 Russia
      • 8.3.6.1 Market Trends
      • 8.3.6.2 Market Forecast
    • 8.3.7 Others
      • 8.3.7.1 Market Trends
      • 8.3.7.2 Market Forecast
  • 8.4 Latin America
    • 8.4.1 Brazil
      • 8.4.1.1 Market Trends
      • 8.4.1.2 Market Forecast
    • 8.4.2 Mexico
      • 8.4.2.1 Market Trends
      • 8.4.2.2 Market Forecast
    • 8.4.3 Others
      • 8.4.3.1 Market Trends
      • 8.4.3.2 Market Forecast
  • 8.5 Middle East and Africa
    • 8.5.1 Market Trends
    • 8.5.2 Market Breakup by Country
    • 8.5.3 Market Forecast

9 SWOT Analysis

  • 9.1 Overview
  • 9.2 Strengths
  • 9.3 Weaknesses
  • 9.4 Opportunities
  • 9.5 Threats

10 Value Chain Analysis

11 Porters Five Forces Analysis

  • 11.1 Overview
  • 11.2 Bargaining Power of Buyers
  • 11.3 Bargaining Power of Suppliers
  • 11.4 Degree of Competition
  • 11.5 Threat of New Entrants
  • 11.6 Threat of Substitutes

12 Price Analysis

13 Competitive Landscape

  • 13.1 Market Structure
  • 13.2 Key Players
  • 13.3 Profiles of Key Players
    • 13.3.1 Accretech (Europe) Gmbh (Tokyo Seimitsu Co. Ltd.)
      • 13.3.1.1 Company Overview
      • 13.3.1.2 Product Portfolio
    • 13.3.2 Amtech Systems Inc.
      • 13.3.2.1 Company Overview
      • 13.3.2.2 Product Portfolio
      • 13.3.2.3 Financials
    • 13.3.3 Axus Technology
      • 13.3.3.1 Company Overview
      • 13.3.3.2 Product Portfolio
    • 13.3.4 BBS Kinmei Co Ltd
      • 13.3.4.1 Company Overview
      • 13.3.4.2 Product Portfolio
    • 13.3.5 Disco Corporation
      • 13.3.5.1 Company Overview
      • 13.3.5.2 Product Portfolio
      • 13.3.5.3 Financials
    • 13.3.6 Dynavest Pte Ltd
      • 13.3.6.1 Company Overview
      • 13.3.6.2 Product Portfolio
    • 13.3.7 Ebara Corporation
      • 13.3.7.1 Company Overview
      • 13.3.7.2 Product Portfolio
      • 13.3.7.3 Financials
      • 13.3.7.4 SWOT Analysis
    • 13.3.8 Gigamat Technologies Inc.
      • 13.3.8.1 Company Overview
      • 13.3.8.2 Product Portfolio
    • 13.3.9 Lapmaster Wolters GmbH (Lapmaster International LLC)
      • 13.3.9.1 Company Overview
      • 13.3.9.2 Product Portfolio
    • 13.3.10 Logitech Ltd.
      • 13.3.10.1 Company Overview
      • 13.3.10.2 Product Portfolio
    • 13.3.11 Okamoto Machine Tool Works Ltd
      • 13.3.11.1 Company Overview
      • 13.3.11.2 Product Portfolio
      • 13.3.11.3 Financials
    • 13.3.12 Revasum Inc.
      • 13.3.12.1 Company Overview
      • 13.3.12.2 Product Portfolio
      • 13.3.12.3 Financials

List of Figures

  • Figure 1: Global: Semiconductor Wafer Polishing and Grinding Equipment Market: Major Drivers and Challenges
  • Figure 2: Global: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018-2023
  • Figure 3: Global: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 4: Global: Semiconductor Wafer Polishing and Grinding Equipment Market: Breakup by Type (in %), 2023
  • Figure 5: Global: Semiconductor Wafer Polishing and Grinding Equipment Market: Breakup by End User (in %), 2023
  • Figure 6: Global: Semiconductor Wafer Polishing and Grinding Equipment Market: Breakup by Region (in %), 2023
  • Figure 7: Global: Semiconductor Wafer Polishing and Grinding Equipment (Semiconductor Wafer Polishing Equipment) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 8: Global: Semiconductor Wafer Polishing and Grinding Equipment (Semiconductor Wafer Polishing Equipment) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 9: Global: Semiconductor Wafer Polishing and Grinding Equipment (Semiconductor Wafer Grinding Equipment) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 10: Global: Semiconductor Wafer Polishing and Grinding Equipment (Semiconductor Wafer Grinding Equipment) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 11: Global: Semiconductor Wafer Polishing and Grinding Equipment (Foundries) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 12: Global: Semiconductor Wafer Polishing and Grinding Equipment (Foundries) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 13: Global: Semiconductor Wafer Polishing and Grinding Equipment (Memory Manufacturers) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 14: Global: Semiconductor Wafer Polishing and Grinding Equipment (Memory Manufacturers) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 15: Global: Semiconductor Wafer Polishing and Grinding Equipment (IDMs) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 16: Global: Semiconductor Wafer Polishing and Grinding Equipment (IDMs) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 17: Global: Semiconductor Wafer Polishing and Grinding Equipment (Other End Users) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 18: Global: Semiconductor Wafer Polishing and Grinding Equipment (Other End Users) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 19: North America: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 20: North America: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 21: United States: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 22: United States: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 23: Canada: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 24: Canada: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 25: Asia-Pacific: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 26: Asia-Pacific: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 27: China: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 28: China: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 29: Japan: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 30: Japan: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 31: India: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 32: India: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 33: South Korea: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 34: South Korea: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 35: Australia: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 36: Australia: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 37: Indonesia: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 38: Indonesia: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 39: Others: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 40: Others: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 41: Europe: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 42: Europe: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 43: Germany: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 44: Germany: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 45: France: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 46: France: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 47: United Kingdom: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 48: United Kingdom: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 49: Italy: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 50: Italy: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 51: Spain: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 52: Spain: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 53: Russia: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 54: Russia: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 55: Others: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 56: Others: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 57: Latin America: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 58: Latin America: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 59: Brazil: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 60: Brazil: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 61: Mexico: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 62: Mexico: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 63: Others: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 64: Others: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 65: Middle East and Africa: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 66: Middle East and Africa: Semiconductor Wafer Polishing and Grinding Equipment Market: Breakup by Country (in %), 2023
  • Figure 67: Middle East and Africa: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 68: Global: Semiconductor Wafer Polishing and Grinding Equipment Industry: SWOT Analysis
  • Figure 69: Global: Semiconductor Wafer Polishing and Grinding Equipment Industry: Value Chain Analysis
  • Figure 70: Global: Semiconductor Wafer Polishing and Grinding Equipment Industry: Porter's Five Forces Analysis

List of Tables

  • Table 1: Global: Semiconductor Wafer Polishing and Grinding Equipment Market: Key Industry Highlights, 2023 and 2032
  • Table 2: Global: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Breakup by Type (in Million US$), 2024-2032
  • Table 3: Global: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Breakup by End User (in Million US$), 2024-2032
  • Table 4: Global: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Breakup by Region (in Million US$), 2024-2032
  • Table 5: Global: Semiconductor Wafer Polishing and Grinding Equipment Market: Competitive Structure
  • Table 6: Global: Semiconductor Wafer Polishing and Grinding Equipment Market: Key Players