半导体抛光垫市场 - 2023-2028 年预测

预计2021年全球半导体抛光垫市场规模将达到9.83亿美元，年复合成长率为5.42%，2028年将达到14.23亿美元。

预计半导体抛光垫市场在预测期内将大幅增长。抛光垫是用于半导体材料化学机械平坦化（CMP）的消耗品。垫材料范围从金属氧化物到陶瓷再到聚氨酯。半导体抛光垫市场可以按类型、用途和地区进行细分。市场增长的主要促进因素是电子和汽车等多个增长行业对半导体的需求不断增长。

市场促进因素

电子设备的小型化

推动半导体抛光垫行业增长的主要要素是电子设备小型化趋势的日益增强。随着这一趋势的加剧，对先进封装的需求不断增长，从而实现器件小型化以及提高热效率和可靠性。由于先进半导体封装工艺需要抛光垫，由于电子设备的小型化，预计需求将与先进封装需求同步增长。

此外，由于私营公司和政府机构对研发的投资，电子行业正在不断增长。例如，根据印度品牌资产基金会的一项研究，印度电子产品生产行业的规模从2015年到2021年将增加一倍以上。对空调、电视和智能手机等家用电器的需求不断增长，其製造需要使用半导体来控制和管理电流。因此，随着家电需求的增长，半导体抛光垫的市场规模也会随之增长。

汽车行业对半导体的需求。

半导体还用于汽车工业等增长型行业，这是推动半导体抛光垫市场规模的要素。半导体广泛应用于现代车辆的 ADAS（高级驾驶辅助系统）技术以及自动驾驶和停车辅助等智能功能。例如，2021年至2022年美国生产的汽车数量将增加10%（根据国际汽车工业协会的数据）。因此，随着汽车产销量的增长，半导体晶圆CMP用半导体抛光垫的需求预计将持续稳定增长。

• 抑制因素
• 技术复杂性和半导体短缺

行业增长的一个主要课题是需要技术熟练且合格的劳动力来製造半导体抛光垫。专业操作人员的短缺是增长的障碍，而僱用技术纯熟劳工会增加产品的总体成本，使其更加难以承受。市场上还存在半导体芯片短缺的情况，冠状病毒和俄罗斯-乌克兰战争造成的供应链中断加剧了这种短缺。这影响了对抛光垫的需求，而抛光垫与半导体需求直接相关。

主要企业提供的产品

• 杜邦 Optivision Pro 系列提供用于化学机械平坦化的抛光垫，可促进高级抛光和设计改进。这是该公司的第三代 CMP 抛光垫，旨在降低客户的拥有成本。与传统产品系列相比，该产品功能支持端点选项，并提供更高的去除率、更长的使用寿命和更少的缺陷。
• 富士纺爱媛超精密抛光垫可实现半导体器件的精密抛光。它是充分利用公司的研发能力而开发的。 POLYPAS（晶圆系列）抛光垫可用于半导体晶圆的最终抛光，并有多种型号可供选择，以满足不同的需求。
• 3M 的 Trizact CMP 垫用于半导体製造，以实现 CMP 工艺的均匀性。该产品提供使用寿命稳定性并减少腐蚀，并使用微复製技术来精确控制一致的垫性能。

亚太地区半导体抛光垫市场。

亚太地区在半导体抛光垫行业中占有重要份额，预计在预测期内将继续保持类似的趋势。这一市场份额得益于中国和印度等该地区主要经济体的电子和汽车行业的增长，以及中国、韩国和日本等国家电子工业基础的增长。

中国和印度市场

中国拥有世界上最大的电子产品生产基地之一，被认为是全球最大的製造地之一。电子、医疗保健、国防和汽车等不断增长的行业将继续需要更多的半导体，从而促进半导体抛光垫市场规模的增长。在印度，通过专注于国内生产，各个领域的工业都在增长，对半导体的需求也相应增加。

世界其他地区的预测

北美和欧洲市场预计也将出现温和增长。在美国，随着3M和卡博特微电子等主要半导体製造商大力投资半导体业务和进一步研究，加上汽车和医疗保健等不断增长的行业对半导体的需求预计将激增。 。

主要趋势。

• 2021 年 7 月，三星电子与 F&S Tech 合作，宣布推出可重复使用的半导体晶圆抛光垫。该垫由聚氨酯製成，可用于通过化学和机械抛光来平坦化半导体晶片表面。利用该公司的专利技术，CMP垫可以通过分离、对磨损部件重新充电并重新固化来重复使用。
• 2023年1月，Amtek Systems宣布将以3500万美元收购美国公司Entrepix。此次收购预计将通过增加基板处理解决方案并利用两家公司基本客群的协同效应，增强 Amtech 在前端晶圆处理市场的市场份额。

目录

第1章简介

• 市场概况
• 市场定义
• 调查范围
• 市场区隔
• 货币
• 先决条件
• 基准年和预测年时间表

第2章调查方法

• 调查资料
• 调查过程

第3章执行摘要

• 研究亮点

第4章市场动态

• 市场促进因素
• 市场抑制因素
• 波特五力分析
• 行业价值链分析

第5章半导体抛光垫市场：按类型

• 介绍
• 硬质 CMP 垫
• 软质 CMP 垫

第6章半导体抛光垫市场：按用途

• 介绍
• 300毫米晶圆
• 200毫米晶圆
• 其他的

第7章半导体抛光垫市场：按地区

• 介绍
• 北美
  • 美国
  • 加拿大
  • 墨西哥
• 南美洲
  • 巴西
  • 阿根廷
  • 其他的
• 欧洲
  • 德国
  • 法国
  • 英国
  • 西班牙
  • 其他的
• 中东/非洲
  • 沙特阿拉伯
  • 阿拉伯联合酋长国
  • 以色列
  • 其他的
• 亚太地区
  • 中国
  • 日本
  • 印度
  • 韩国
  • 印尼
  • 台湾
  • 其他的

第8章竞争环境及分析

• 主要企业及战略分析
• 新兴企业和市场盈利能力
• 合併、收购、协议与合作
• 供应商竞争力矩阵

第9章公司简介

• DuPont
• Logitech LTD
• FOJIBO
• Pureon
• 3M
• FNS POWER TECHNOLOGY INC.
• Kemet International Limited
• SKC Inc.

The global semiconductor polishing pads market was valued at US$0.983 billion in 2021 and is expected to grow at a CAGR of 5.42% to reach US$1.423 billion by 2028.

The semiconductor polishing pads market is projected to grow at a considerable pace during the forecast period. These pads refer to consumable products used in the chemical-mechanical planarization (CMP) of semiconductor materials. They are vital in determining the performance and quality level of the process and are made from several materials such as metal oxide, ceramic, polyurethane, etc. The semiconductor polishing pads market can be classified in the following ways: by type, application, and geographic region. The major drivers for the growth of this market include increased demand for semiconductors in several booming industries, such as electronics and automotive.

Market Drivers:

Miniaturization of electronic devices

A major factor driving the growth of the semiconductor polishing pads industry is the rising trend of miniaturization of electronic devices. As this trend grows, the need for advanced packaging will also increase as it improves thermal efficiency and provides better reliability, in addition to helping in reducing device sizes. Polishing pads are necessary for the advanced semiconductor packaging process, and, therefore, their demand will grow in tandem with the need for advanced packaging due to the miniaturization of electronic devices.

Further, the electronics industry has been experiencing growth due to investments by private players and government institutions in research and development efforts. For instance, the electronics production industry in India has grown by over double in size from 2015 to 2021, as per research from the India Brand Equity Foundation. The demand for consumer electronics such as air conditioners, televisions, and smartphones is growing, and their manufacturing involves using semiconductors to control and manage the flow of electric current. Therefore, as the demand for consumer electronics grows, the semiconductor polishing pads market size will increase too.

Demand for semiconductors by the automotive industry.

Semiconductors also find uses in growing industries such as automotive, which helps further boost the semiconductor polishing pads industry size. Semiconductors are used extensively in modern automobiles for advanced driver assistance system technologies and other smart features such as autopilot driving and parking assistance. For instance, the production of motor vehicles in the U.S. has grown by 10% from 2021 to 2022, as per the International Organization for Motor Vehicle Manufacturers. Therefore, as the production and sale of automobiles grow, the demand for semiconductor polishing pads for CMP of semiconductor wafers will continue to grow steadily.

• Restraints to the industry's expansion.

• Technical complexities and semiconductor shortage.

Key challenge to the industry's growth is the need for technically skilled and competent labor to manufacture semiconductor polishing pads. The lack of professional operators can act as a barrier to growth, and hiring skilled labor adds to the overall cost of the product, further reducing its affordability. There is also a shortage of semiconductor chips in the market due, which is further aggravated by supply chain disruptions due to the coronavirus and the Russia-Ukraine war. This impacts the demand for polishing pads directly related to the need for semiconductors.

Products Offered by key players.

• DuPont's Optivision Pro range offers polishing pads for chemical mechanical planarization by facilitating advanced polishing and design improvements. This is the company's third generation of CMP pads manufactured to ease customers' ownership costs. The product features enable endpointing options and offer increased removal rates, improved lifetimes, and reduced defectivity compared to previous ranges of its products.
• Fujibo's Ehime ultra-high precision polishing pads allow for the precise polishing of semiconductor devices. Developed with the help of the research and development capabilities of the company, the products are designed to meet the needs of the customers. The POLYPAS (Suede series) polishing pads help in the final polishing of semiconductor wafers and are available in different variants for multiple needs.
• 3M's Trizact CMP Pads are used in semiconductor fabrication to provide uniformity in the CMP process. The product offers stability through its usable life and reduced erosion and uses microreplication technology to provide precise control for consistent pad performance.

The Asia-Pacific region semiconductor polishing pads market.

Asia Pacific is expected to constitute a significant share of the semiconductor polishing pads industry, and similar trends are expected to be followed in the forecast period. This market share is owed to the growth in electronics and automotive sectors in the region's major economies, such as China and India, as well as the growing electronics industry bases in countries like China, South Korea, and Japan.

Chinese and Indian markets.

China holds one of the largest electronics production bases in the world and is also considered one of the largest manufacturing hubs globally. These are two key factors that will continue to increase the demand for semiconductors in Chinese markets as growing industries such as electronics, healthcare, defense, automotive, etc., will continue to demand more semiconductors which will help in the growth of semiconductor polishing pads market size. In India, the focus on domestic production has led to increased industrial growth in all sectors, which is proportionately driving the demand for semiconductors.

Forecast for the Rest of the World.

It is anticipated that North American and European markets will experience moderate growth too. The market for semiconductor polishing pads in the United States is expected to see a surge in demand due to the presence of large semiconductor manufacturers such as 3M, Cabot Microelectronics, etc., that are heavily investing in the semiconductor business and its further research, as well as demand from growing industries such as automotive, healthcare, etc. for semiconductors.

Key Developments.

• In July 2021, in collaboration with F&S Tech, Samsung Electronics announced the launch of reusable pads for semiconductor wafer polishing. These pads are made of polyurethane and allow for the flattening of semiconductor wafer surfaces by chemical and mechanical polishing. The CMP pads are reused by separating them, recharging the worn-out parts, and re-hardening them using their patented technology.
• In January 2023, Amtech Systems announced the acquisition of Entrepix, Inc. for US$35 million. The acquisition is expected to enhance Amtech's market share in the front-end wafer processing market by adding substrate processing solutions and utilizing the synergies between both companies' customer bases.

Market Segmentation:

By Type

• Hard CMP Pads
• Soft CMP Pads

By Application

• 300m Wafer
• 200mm Wafer
• Others

By Geography

• North America
• USA
• Canada
• Mexico
• South America
• Brazil
• Argentina
• Others
• Europe
• Germany
• France
• United Kingdom
• Spain
• Others
• Middle East and Africa
• Saudi Arabia
• UAE
• Israel
• Others
• Asia Pacific
• China
• Japan
• India
• South Korea
• Indonesia
• Taiwan
• Others

TABLE OF CONTENTS

1. INTRODUCTION

• 1.1. Market Overview
• 1.2. Market Definition
• 1.3. Scope of the Study
• 1.4. Market Segmentation
• 1.5. Currency
• 1.6. Assumptions
• 1.7. Base, and Forecast Years Timeline

2. RESEARCH METHODOLOGY

• 2.1. Research Data
• 2.2. Research Process

3. EXECUTIVE SUMMARY

• 3.1. Research Highlights

4. MARKET DYNAMICS

• 4.1. Market Drivers
• 4.2. Market Restraints
• 4.3. Porter's Five Force Analysis
  • 4.3.1. Bargaining Power of Suppliers
  • 4.3.2. Bargaining Power of Buyers
  • 4.3.3. Threat of New Entrants
  • 4.3.4. Threat of Substitutes
  • 4.3.5. Competitive Rivalry in the Industry
• 4.4. Industry Value Chain Analysis

5. SEMICONDUCTOR POLISHING PADS MARKET BY TYPE

• 5.1. Introduction
• 5.2. Hard CMP Pads
• 5.3. Soft CMP Pads

6. SEMICONDUCTOR POLISHING PADS MARKET BY APPLICATION

• 6.1. Introduction
• 6.2. 300mm Wafer
• 6.3. 200mm Wafer
• 6.4. Others

7. SEMICONDUCTOR POLISHING PADS MARKET BY GEOGRAPHY

• 7.1. Introduction
• 7.2. North America
  • 7.2.1. USA
  • 7.2.2. Canada
  • 7.2.3. Mexico
• 7.3. South America
  • 7.3.1. Brazil
  • 7.3.2. Argentina
  • 7.3.3. Others
• 7.4. Europe
  • 7.4.1. Germany
  • 7.4.2. France
  • 7.4.3. United Kingdom
  • 7.4.4. Spain
  • 7.4.5. Others
• 7.5. Middle East And Africa
  • 7.5.1. Saudi Arabia
  • 7.5.2. UAE
  • 7.5.3. Israel
  • 7.5.4. Others
• 7.6. Asia Pacific
  • 7.6.1. China
  • 7.6.2. Japan
  • 7.6.3. India
  • 7.6.4. South Korea
  • 7.6.5. Indonesia
  • 7.6.6. Taiwan
  • 7.6.7. Others

8. COMPETITIVE ENVIRONMENT AND ANALYSIS

• 8.1. Major Players and Strategy Analysis
• 8.2. Emerging Players and Market Lucrativeness
• 8.3. Mergers, Acquisitions, Agreements, and Collaborations
• 8.4. Vendor Competitiveness Matrix

9. COMPANY PROFILES

• 9.1. DuPont
• 9.2. Logitech LTD
• 9.3. FOJIBO
• 9.4. Pureon
• 9.5. 3M
• 9.6. FNS POWER TECHNOLOGY INC.
• 9.7. Kemet International Limited
• 9.8. SKC Inc.