首页 > 市场调查报告书 > 电子零件/半导体

半导体生产设备半导体製造设备

市场调查报告书

商品编码

1453848

2024-2028年全球高阶半导体封装市场

Global High End Semiconductor Packaging Market 2024-2028

出版日期: 2024年03月08日 | 出版商:

TechNavio | 英文 170 Pages | 订单完成后即时交付

价格

简介目录图表

2023-2028年高阶半导体封装市场预估为309.2亿美元，预测期内复合年增长率为14%。

该报告包括对高端半导体封装市场的整体分析、市场规模和预测、趋势、成长动力、挑战以及涵盖约 25 家供应商的供应商分析。

它提供了对当前市场状况、最新趋势和驱动因素以及整体市场环境的最新分析。该市场是由小型电子设备需求不断增长、高端半导体封装产品推出增加以及汽车半导体电子设备的快速采用所推动的。

市场范围
基准年	2024年
结束年份	2028年
预测期	2024-2028
成长动力	加速度
2024年与前一年同期比较	13.35%
复合年增长率	14%
增量	309.2亿美元

研究认为，5G 投资的增加是未来几年推动高端半导体封装市场成长的关键因素之一。此外，随着覆晶、SiP（系统级封装）和无铅封装解决方案的采用增加，半导体材料封装技术的进步将带来强劲的市场需求。

细分市场
比较：按技术
3D SoC：2023-2028 年市场规模与预测
3D堆迭记忆体：2023-2028年市场规模与预测
2.5D内插器：2023-2028 年市场规模与预测
UHD FO：2023-2028 年市场规模与预测
嵌入式硅桥：2023-2028 年市场规模与预测
市场机会：依技术分类

第八章客户状况

客户状况概览

第九章地区情势

区域细分
区域比较
亚太地区：2023-2028 年市场规模与预测
北美：2023-2028 年市场规模与预测
欧洲：2023-2028 年市场规模与预测
南美洲：2023-2028年市场规模与预测
中东和非洲：2023-2028 年市场规模与预测
中国：2023-2028年市场规模及预测
美国：2023-2028 年市场规模与预测
德国：2023-2028 年市场规模与预测
日本：2023-2028年市场规模与预测
加拿大：2023-2028 年市场规模与预测
市场机会：依地区状况

第 10 章驱动因素、挑战与趋势

市场驱动因素
市场挑战
驱动因素和挑战的影响
市场趋势

第十一章供应商情况

概述
供应商情况
混乱的情况
产业风险

第十二章供应商分析

交易厂商
供应商市场定位
Advanced Micro Devices Inc.
ASE Technology Holding Co. Ltd.
Amkor Technology Inc.
Analog Devices Inc.
ChipMOS TECHNOLOGIES INC.
Fujitsu Ltd.
Intel Corp.
Jiangsu Changdian Technology Co. Ltd.
King Yuan Electronics Co. Ltd.
Kyocera Corp.
Powertech Technology Inc.
Samsung Electronics Co. Ltd.
Taiwan Semiconductor Manufacturing Co. Ltd.
Texas Instruments Inc.
Tongfu Microelectronics Co. Ltd.

第十三章附录

简介目录图表

Product Code: IRTNTR77666

The high end semiconductor packaging market is forecasted to grow by USD 30.92 bn during 2023-2028, accelerating at a CAGR of 14% during the forecast period. The report on the high end semiconductor packaging market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by growing demand for compact electronic devices, increasing product launches in high end semiconductor packaging, and surge in adoption of semiconductor ics for automobiles.

Technavio's high end semiconductor packaging market is segmented as below:

Market Scope
Base Year	2024
End Year	2028
Series Year	2024-2028
Growth Momentum	Accelerate
YOY 2024	13.35%
CAGR	14%
Incremental Value	$30.92bn

By End-user

Consumer electronics
Telecom and datacom
Automotive
Others

By Technology

3D SoC
3D stacked memory
2.5D interposers
UHD FO
Embedded Si bridge

By Geographical Landscape

APAC
North America
Europe
South America
Middle East and Africa

This study identifies the increase in 5G investments as one of the prime reasons driving the high end semiconductor packaging market growth during the next few years. Also, rising adoption of flip-chip, sip, lead-free packaging solutions and advancements in semiconductor material packaging technologies will lead to sizable demand in the market.

The report on the high end semiconductor packaging market covers the following areas:

High end semiconductor packaging market sizing
High end semiconductor packaging market forecast
High end semiconductor packaging market industry analysis

The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading high end semiconductor packaging market vendors that include Advanced Micro Devices Inc., ASE Technology Holding Co. Ltd., Amkor Technology Inc., Analog Devices Inc., Arm Ltd., Chipbond Technology Corp., ChipMOS TECHNOLOGIES INC., Fujitsu Ltd., Intel Corp., Jiangsu Changdian Technology Co. Ltd., King Yuan Electronics Co. Ltd., Kyocera Corp., Microchip Technology Inc., nepes Corp., Powertech Technology Inc., PTI Inspection Systems, Renesas Electronics Corp., Taiwan Semiconductor Manufacturing Co. Ltd., Texas Instruments Inc., Tongfu Microelectronics Co. Ltd., and Samsung Electronics Co. Ltd.. Also, the high end semiconductor packaging market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.

The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast the accurate market growth.

1 Executive Summary

1.1 Market overview

2 Market Landscape

2.1 Market ecosystem

3 Market Sizing

3.1 Market definition
3.2 Market segment analysis
3.3 Market size 2023
3.4 Market outlook: Forecast for 2023-2028

4 Historic Market Size

4.1 Global high end semiconductor packaging market 2018 - 2022
4.2 End-user Segment Analysis 2018 - 2022
4.3 Technology Segment Analysis 2018 - 2022
4.4 Geography Segment Analysis 2018 - 2022
4.5 Country Segment Analysis 2018 - 2022

5 Five Forces Analysis

5.1 Five forces summary
5.2 Bargaining power of buyers
5.3 Bargaining power of suppliers
5.4 Threat of new entrants
5.5 Threat of substitutes
5.6 Threat of rivalry
5.7 Market condition

6 Market Segmentation by End-user

6.1 Market segments
6.2 Comparison by End-user
6.3 Consumer electronics - Market size and forecast 2023-2028
6.4 Telecom and datacom - Market size and forecast 2023-2028
6.5 Automotive - Market size and forecast 2023-2028
6.6 Others - Market size and forecast 2023-2028
6.7 Market opportunity by End-user

7 Market Segmentation by Technology

7.1 Market segments
7.2 Comparison by Technology
7.3 3D SoC - Market size and forecast 2023-2028
7.4 3D stacked memory - Market size and forecast 2023-2028
7.5 2.5D interposers - Market size and forecast 2023-2028
7.6 UHD FO - Market size and forecast 2023-2028
7.7 Embedded Si bridge - Market size and forecast 2023-2028
7.8 Market opportunity by Technology

8 Customer Landscape

8.1 Customer landscape overview

9 Geographic Landscape

9.1 Geographic segmentation
9.2 Geographic comparison
9.3 APAC - Market size and forecast 2023-2028
9.4 North America - Market size and forecast 2023-2028
9.5 Europe - Market size and forecast 2023-2028
9.6 South America - Market size and forecast 2023-2028
9.7 Middle East and Africa - Market size and forecast 2023-2028
9.8 China - Market size and forecast 2023-2028
9.9 US - Market size and forecast 2023-2028
9.10 Germany - Market size and forecast 2023-2028
9.11 Japan - Market size and forecast 2023-2028
9.12 Canada - Market size and forecast 2023-2028
9.13 Market opportunity By Geographical Landscape

10 Drivers, Challenges, and Trends

10.1 Market drivers
10.2 Market challenges
10.3 Impact of drivers and challenges
10.4 Market trends

11 Vendor Landscape

11.1 Overview
11.2 Vendor landscape
11.3 Landscape disruption
11.4 Industry risks

12 Vendor Analysis

12.1 Vendors covered
12.2 Market positioning of vendors
12.3 Advanced Micro Devices Inc.
12.4 ASE Technology Holding Co. Ltd.
12.5 Amkor Technology Inc.
12.6 Analog Devices Inc.
12.7 ChipMOS TECHNOLOGIES INC.
12.8 Fujitsu Ltd.
12.9 Intel Corp.
12.10 Jiangsu Changdian Technology Co. Ltd.
12.11 King Yuan Electronics Co. Ltd.
12.12 Kyocera Corp.
12.13 Powertech Technology Inc.
12.14 Samsung Electronics Co. Ltd.
12.15 Taiwan Semiconductor Manufacturing Co. Ltd.
12.16 Texas Instruments Inc.
12.17 Tongfu Microelectronics Co. Ltd.

13 Appendix

13.1 Scope of the report
13.2 Inclusions and exclusions checklist
13.3 Currency conversion rates for US$
13.4 Research methodology
13.5 List of abbreviations

简介目录图表

Exhibits:

Exhibits1: Executive Summary - Chart on Market Overview
Exhibits2: Executive Summary - Data Table on Market Overview
Exhibits3: Executive Summary - Chart on Global Market Characteristics
Exhibits4: Executive Summary - Chart on Market By Geographical Landscape
Exhibits5: Executive Summary - Chart on Market Segmentation by End-user
Exhibits6: Executive Summary - Chart on Market Segmentation by Technology
Exhibits7: Executive Summary - Chart on Incremental Growth
Exhibits8: Executive Summary - Data Table on Incremental Growth
Exhibits9: Executive Summary - Chart on Vendor Market Positioning
Exhibits10: Parent market
Exhibits11: Market Characteristics
Exhibits12: Offerings of vendors included in the market definition
Exhibits13: Market segments
Exhibits14: Chart on Global - Market size and forecast 2023-2028 ($ billion)
Exhibits15: Data Table on Global - Market size and forecast 2023-2028 ($ billion)
Exhibits16: Chart on Global Market: Year-over-year growth 2023-2028 (%)
Exhibits17: Data Table on Global Market: Year-over-year growth 2023-2028 (%)
Exhibits18: Historic Market Size - Data Table on global high end semiconductor packaging market 2018 - 2022 ($ billion)
Exhibits19: Historic Market Size - End-user Segment 2018 - 2022 ($ billion)
Exhibits20: Historic Market Size - Technology Segment 2018 - 2022 ($ billion)
Exhibits21: Historic Market Size - Geography Segment 2018 - 2022 ($ billion)
Exhibits22: Historic Market Size - Country Segment 2018 - 2022 ($ billion)
Exhibits23: Five forces analysis - Comparison between 2023 and 2028
Exhibits24: Chart on Bargaining power of buyers - Impact of key factors 2023 and 2028
Exhibits25: Bargaining power of suppliers - Impact of key factors in 2023 and 2028
Exhibits26: Threat of new entrants - Impact of key factors in 2023 and 2028
Exhibits27: Threat of substitutes - Impact of key factors in 2023 and 2028
Exhibits28: Threat of rivalry - Impact of key factors in 2023 and 2028
Exhibits29: Chart on Market condition - Five forces 2023 and 2028
Exhibits30: Chart on End-user - Market share 2023-2028 (%)
Exhibits31: Data Table on End-user - Market share 2023-2028 (%)
Exhibits32: Chart on Comparison by End-user
Exhibits33: Data Table on Comparison by End-user
Exhibits34: Chart on Consumer electronics - Market size and forecast 2023-2028 ($ billion)
Exhibits35: Data Table on Consumer electronics - Market size and forecast 2023-2028 ($ billion)
Exhibits36: Chart on Consumer electronics - Year-over-year growth 2023-2028 (%)
Exhibits37: Data Table on Consumer electronics - Year-over-year growth 2023-2028 (%)
Exhibits38: Chart on Telecom and datacom - Market size and forecast 2023-2028 ($ billion)
Exhibits39: Data Table on Telecom and datacom - Market size and forecast 2023-2028 ($ billion)
Exhibits40: Chart on Telecom and datacom - Year-over-year growth 2023-2028 (%)
Exhibits41: Data Table on Telecom and datacom - Year-over-year growth 2023-2028 (%)
Exhibits42: Chart on Automotive - Market size and forecast 2023-2028 ($ billion)
Exhibits43: Data Table on Automotive - Market size and forecast 2023-2028 ($ billion)
Exhibits44: Chart on Automotive - Year-over-year growth 2023-2028 (%)
Exhibits45: Data Table on Automotive - Year-over-year growth 2023-2028 (%)
Exhibits46: Chart on Others - Market size and forecast 2023-2028 ($ billion)
Exhibits47: Data Table on Others - Market size and forecast 2023-2028 ($ billion)
Exhibits48: Chart on Others - Year-over-year growth 2023-2028 (%)
Exhibits49: Data Table on Others - Year-over-year growth 2023-2028 (%)
Exhibits50: Market opportunity by End-user ($ billion)
Exhibits51: Data Table on Market opportunity by End-user ($ billion)
Exhibits52: Chart on Technology - Market share 2023-2028 (%)
Exhibits53: Data Table on Technology - Market share 2023-2028 (%)
Exhibits54: Chart on Comparison by Technology
Exhibits55: Data Table on Comparison by Technology
Exhibits56: Chart on 3D SoC - Market size and forecast 2023-2028 ($ billion)
Exhibits57: Data Table on 3D SoC - Market size and forecast 2023-2028 ($ billion)
Exhibits58: Chart on 3D SoC - Year-over-year growth 2023-2028 (%)
Exhibits59: Data Table on 3D SoC - Year-over-year growth 2023-2028 (%)
Exhibits60: Chart on 3D stacked memory - Market size and forecast 2023-2028 ($ billion)
Exhibits61: Data Table on 3D stacked memory - Market size and forecast 2023-2028 ($ billion)
Exhibits62: Chart on 3D stacked memory - Year-over-year growth 2023-2028 (%)
Exhibits63: Data Table on 3D stacked memory - Year-over-year growth 2023-2028 (%)
Exhibits64: Chart on 2.5D interposers - Market size and forecast 2023-2028 ($ billion)
Exhibits65: Data Table on 2.5D interposers - Market size and forecast 2023-2028 ($ billion)
Exhibits66: Chart on 2.5D interposers - Year-over-year growth 2023-2028 (%)
Exhibits67: Data Table on 2.5D interposers - Year-over-year growth 2023-2028 (%)
Exhibits68: Chart on UHD FO - Market size and forecast 2023-2028 ($ billion)
Exhibits69: Data Table on UHD FO - Market size and forecast 2023-2028 ($ billion)
Exhibits70: Chart on UHD FO - Year-over-year growth 2023-2028 (%)
Exhibits71: Data Table on UHD FO - Year-over-year growth 2023-2028 (%)
Exhibits72: Chart on Embedded Si bridge - Market size and forecast 2023-2028 ($ billion)
Exhibits73: Data Table on Embedded Si bridge - Market size and forecast 2023-2028 ($ billion)
Exhibits74: Chart on Embedded Si bridge - Year-over-year growth 2023-2028 (%)
Exhibits75: Data Table on Embedded Si bridge - Year-over-year growth 2023-2028 (%)
Exhibits76: Market opportunity by Technology ($ billion)
Exhibits77: Data Table on Market opportunity by Technology ($ billion)
Exhibits78: Analysis of price sensitivity, lifecycle, customer purchase basket, adoption rates, and purchase criteria
Exhibits79: Chart on Market share By Geographical Landscape 2023-2028 (%)
Exhibits80: Data Table on Market share By Geographical Landscape 2023-2028 (%)
Exhibits81: Chart on Geographic comparison
Exhibits82: Data Table on Geographic comparison
Exhibits83: Chart on APAC - Market size and forecast 2023-2028 ($ billion)
Exhibits84: Data Table on APAC - Market size and forecast 2023-2028 ($ billion)
Exhibits85: Chart on APAC - Year-over-year growth 2023-2028 (%)
Exhibits86: Data Table on APAC - Year-over-year growth 2023-2028 (%)
Exhibits87: Chart on North America - Market size and forecast 2023-2028 ($ billion)
Exhibits88: Data Table on North America - Market size and forecast 2023-2028 ($ billion)
Exhibits89: Chart on North America - Year-over-year growth 2023-2028 (%)
Exhibits90: Data Table on North America - Year-over-year growth 2023-2028 (%)
Exhibits91: Chart on Europe - Market size and forecast 2023-2028 ($ billion)
Exhibits92: Data Table on Europe - Market size and forecast 2023-2028 ($ billion)
Exhibits93: Chart on Europe - Year-over-year growth 2023-2028 (%)
Exhibits94: Data Table on Europe - Year-over-year growth 2023-2028 (%)
Exhibits95: Chart on South America - Market size and forecast 2023-2028 ($ billion)
Exhibits96: Data Table on South America - Market size and forecast 2023-2028 ($ billion)
Exhibits97: Chart on South America - Year-over-year growth 2023-2028 (%)
Exhibits98: Data Table on South America - Year-over-year growth 2023-2028 (%)
Exhibits99: Chart on Middle East and Africa - Market size and forecast 2023-2028 ($ billion)
Exhibits100: Data Table on Middle East and Africa - Market size and forecast 2023-2028 ($ billion)
Exhibits101: Chart on Middle East and Africa - Year-over-year growth 2023-2028 (%)
Exhibits102: Data Table on Middle East and Africa - Year-over-year growth 2023-2028 (%)
Exhibits103: Chart on China - Market size and forecast 2023-2028 ($ billion)
Exhibits104: Data Table on China - Market size and forecast 2023-2028 ($ billion)
Exhibits105: Chart on China - Year-over-year growth 2023-2028 (%)
Exhibits106: Data Table on China - Year-over-year growth 2023-2028 (%)
Exhibits107: Chart on US - Market size and forecast 2023-2028 ($ billion)
Exhibits108: Data Table on US - Market size and forecast 2023-2028 ($ billion)
Exhibits109: Chart on US - Year-over-year growth 2023-2028 (%)
Exhibits110: Data Table on US - Year-over-year growth 2023-2028 (%)
Exhibits111: Chart on Germany - Market size and forecast 2023-2028 ($ billion)
Exhibits112: Data Table on Germany - Market size and forecast 2023-2028 ($ billion)
Exhibits113: Chart on Germany - Year-over-year growth 2023-2028 (%)
Exhibits114: Data Table on Germany - Year-over-year growth 2023-2028 (%)
Exhibits115: Chart on Japan - Market size and forecast 2023-2028 ($ billion)
Exhibits116: Data Table on Japan - Market size and forecast 2023-2028 ($ billion)
Exhibits117: Chart on Japan - Year-over-year growth 2023-2028 (%)
Exhibits118: Data Table on Japan - Year-over-year growth 2023-2028 (%)
Exhibits119: Chart on Canada - Market size and forecast 2023-2028 ($ billion)
Exhibits120: Data Table on Canada - Market size and forecast 2023-2028 ($ billion)
Exhibits121: Chart on Canada - Year-over-year growth 2023-2028 (%)
Exhibits122: Data Table on Canada - Year-over-year growth 2023-2028 (%)
Exhibits123: Market opportunity By Geographical Landscape ($ billion)
Exhibits124: Data Tables on Market opportunity By Geographical Landscape ($ billion)
Exhibits125: Impact of drivers and challenges in 2023 and 2028
Exhibits126: Overview on Criticality of inputs and Factors of differentiation
Exhibits127: Overview on factors of disruption
Exhibits128: Impact of key risks on business
Exhibits129: Vendors covered
Exhibits130: Matrix on vendor position and classification
Exhibits131: Advanced Micro Devices Inc. - Overview
Exhibits132: Advanced Micro Devices Inc. - Business segments
Exhibits133: Advanced Micro Devices Inc. - Key news
Exhibits134: Advanced Micro Devices Inc. - Key offerings
Exhibits135: Advanced Micro Devices Inc. - Segment focus
Exhibits136: ASE Technology Holding Co. Ltd. - Overview
Exhibits137: ASE Technology Holding Co. Ltd. - Business segments
Exhibits138: ASE Technology Holding Co. Ltd. - Key offerings
Exhibits139: ASE Technology Holding Co. Ltd. - Segment focus
Exhibits140: Amkor Technology Inc. - Overview
Exhibits141: Amkor Technology Inc. - Business segments
Exhibits142: Amkor Technology Inc. - Key offerings
Exhibits143: Amkor Technology Inc. - Segment focus
Exhibits144: Analog Devices Inc. - Overview
Exhibits145: Analog Devices Inc. - Business segments
Exhibits146: Analog Devices Inc. - Key news
Exhibits147: Analog Devices Inc. - Key offerings
Exhibits148: Analog Devices Inc. - Segment focus
Exhibits149: ChipMOS TECHNOLOGIES INC. - Overview
Exhibits150: ChipMOS TECHNOLOGIES INC. - Business segments
Exhibits151: ChipMOS TECHNOLOGIES INC. - Key offerings
Exhibits152: ChipMOS TECHNOLOGIES INC. - Segment focus
Exhibits153: Fujitsu Ltd. - Overview
Exhibits154: Fujitsu Ltd. - Business segments
Exhibits155: Fujitsu Ltd. - Key news
Exhibits156: Fujitsu Ltd. - Key offerings
Exhibits157: Fujitsu Ltd. - Segment focus
Exhibits158: Intel Corp. - Overview
Exhibits159: Intel Corp. - Business segments
Exhibits160: Intel Corp. - Key news
Exhibits161: Intel Corp. - Key offerings
Exhibits162: Intel Corp. - Segment focus
Exhibits163: Jiangsu Changdian Technology Co. Ltd. - Overview
Exhibits164: Jiangsu Changdian Technology Co. Ltd. - Product / Service
Exhibits165: Jiangsu Changdian Technology Co. Ltd. - Key offerings
Exhibits166: King Yuan Electronics Co. Ltd. - Overview
Exhibits167: King Yuan Electronics Co. Ltd. - Business segments
Exhibits168: King Yuan Electronics Co. Ltd. - Key offerings
Exhibits169: King Yuan Electronics Co. Ltd. - Segment focus
Exhibits170: Kyocera Corp. - Overview
Exhibits171: Kyocera Corp. - Key offerings
Exhibits172: Powertech Technology Inc. - Overview
Exhibits173: Powertech Technology Inc. - Business segments
Exhibits174: Powertech Technology Inc. - Key offerings
Exhibits175: Powertech Technology Inc. - Segment focus
Exhibits176: Samsung Electronics Co. Ltd. - Overview
Exhibits177: Samsung Electronics Co. Ltd. - Business segments
Exhibits178: Samsung Electronics Co. Ltd. - Key news
Exhibits179: Samsung Electronics Co. Ltd. - Key offerings
Exhibits180: Samsung Electronics Co. Ltd. - Segment focus
Exhibits181: Taiwan Semiconductor Manufacturing Co. Ltd. - Overview
Exhibits182: Taiwan Semiconductor Manufacturing Co. Ltd. - Product / Service
Exhibits183: Taiwan Semiconductor Manufacturing Co. Ltd. - Key offerings
Exhibits184: Texas Instruments Inc. - Overview
Exhibits185: Texas Instruments Inc. - Business segments
Exhibits186: Texas Instruments Inc. - Key news
Exhibits187: Texas Instruments Inc. - Key offerings
Exhibits188: Texas Instruments Inc. - Segment focus
Exhibits189: Tongfu Microelectronics Co. Ltd. - Overview
Exhibits190: Tongfu Microelectronics Co. Ltd. - Product / Service
Exhibits191: Tongfu Microelectronics Co. Ltd. - Key offerings
Exhibits192: Inclusions checklist
Exhibits193: Exclusions checklist
Exhibits194: Currency conversion rates for US$
Exhibits195: Research methodology
Exhibits196: Validation techniques employed for market sizing
Exhibits197: Information sources
Exhibits198: List of abbreviations

02-2729-4219

+886-2-2729-4219

License/价格

2024-2028年全球高阶半导体封装市场

Global High End Semiconductor Packaging Market 2024-2028