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市场调查报告书
商品编码
1621334

半导体先进封装市场：按封装平台、应用划分 - 2025-2030 年全球预测

Semiconductor Advanced Packaging Market by Packaging Platform (2.5D & 3D IC Packaging, Embedded Die, Fan-In Wafer Level Packaging), Application (DCDC, IGBT, MOSFET) - Global Forecast 2025-2030
出版日期: | 出版商: 360iResearch | 英文 183 Pages | 商品交期: 最快1-2个工作天内

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2023年半导体先进封装市场价值为368.9亿美元，预计2024年将达到389.2亿美元，复合年增长率为5.89%，预计到2030年将达到551.1亿美元。

半导体先进封装的范围包括用于提高半导体装置的性能、密度和功能的製程和技术。 2.5D/3D 整合、扇出晶圆级封装 (FOWLP) 和系统级封装(SiP) 等先进封装技术对于小型化和高效能运算至关重要。这些都是必要的，因为摩尔定律在跟上小型化的需求方面存在极限，并且它们应用于家用电器、汽车电子、通讯和工业电子等许多领域。最终用途范围广泛，包括智慧型手机、平板电脑、游戏机、物联网设备，以及随着自动驾驶和电动车的兴起而日益增多的汽车技术。市场成长受到新兴电子产业的显着影响，该产业需要更复杂、更小、更有效率的元件，而人工智慧、5G 和物联网的趋势推动了创新。然而，市场参与企业面临初始投资成本高、供应链复杂、技术整合困难等挑战，特别是对于努力跟上技术快速进步的中小企业来说，这种趋势很强烈。机会存在于开发更环境永续的材料、增强温度控管解决方案和增加异质整合等领域。旨在提高互连密度、降低功耗和提高可靠性的创新研究可以提供竞争优势。产业参与者应考虑与高科技公司建立策略伙伴关係并投资研发，以利用量子运算和边缘人工智慧等快速成长的趋势。此外，市场呈现出动态的特点，其特点是技术快速发展和竞争压力。为了取得成功，公司必须具备敏捷性和远见，以适应不断发展的技术环境，同时克服限制市场准入的专利组合的排他性。专注于包装过程的永续性和效率可以增强您的市场地位，并突显在竞争激烈的市场环境中製定富有远见的策略的重要性。

主要市场统计
基准年[2023] 368.9亿美元
预计年份 [2024] 389.2亿美元
预测年份 [2030] 551.1亿美元
复合年增长率（%） 5.89%

市场动态：快速发展的半导体先进封装市场的关键市场洞察

供应和需求的动态相互作用正在改变半导体先进封装市场。透过了解这些不断变化的市场动态，公司可以准备好做出明智的投资决策、完善策略决策并抓住新的商机。全面了解这些趋势可以帮助企业降低政治、地理、技术、社会和经济领域的风险，同时也能帮助消费行为及其对製造业的影响。

  • 市场驱动因素
    • 汽车和家用电器中半导体装置的复杂性不断增加
    • 政府努力促进半导体製造和封装
    • 高效能运算和人工智慧应用的兴起
  • 市场限制因素
    • 设计和製造先进半导体封装的技术复杂性
  • 市场机会
    • 半导体先进封装方法的技术进步
    • 5G新进展及6G网路期待
  • 市场挑战
    • 先进半导体封装的环境与永续性议题

波特五力：驾驭半导体先进封装市场的策略工具

波特的五力框架是理解市场竞争格局的重要工具。波特的五力框架为评估公司的竞争地位和探索策略机会提供了清晰的方法。该框架可帮助公司评估市场动态并确定新业务的盈利。这些见解使公司能够利用自己的优势，解决弱点并避免潜在的挑战，从而确保更强大的市场地位。

PESTLE分析：了解半导体先进封装市场的外部影响

外部宏观环境因素在塑造半导体先进封装市场的表现动态方面发挥着至关重要的作用。对政治、经济、社会、技术、法律和环境因素的分析提供了应对这些影响所需的资讯。透过调查 PESTLE 因素，公司可以更了解潜在的风险和机会。这种分析可以帮助公司预测法规、消费者偏好和经济趋势的变化，并帮助他们做出积极主动的决策。

市场占有率分析 了解半导体先进封装市场的竞争状况

对半导体先进封装市场的详细市场占有率分析可以对供应商绩效进行全面评估。公司可以透过比较收益、客户群和成长率等关键指标来揭示其竞争地位。该分析揭示了市场集中、分散和整合的趋势，为供应商提供了製定策略决策所需的洞察力，使他们能够在日益激烈的竞争中占有一席之地。

FPNV 定位矩阵供应商在半导体先进封装市场的绩效评估

FPNV定位矩阵是评估半导体先进封装市场供应商的重要工具。此矩阵允许业务组织根据商务策略和产品满意度评估供应商，从而做出与其目标相符的明智决策。这四个象限使您能够清晰、准确地划分供应商，并确定最能满足您的策略目标的合作伙伴和解决方案。

策略分析和建议绘製半导体先进封装市场的成功之路

对于旨在加强其在全球市场的影响力的公司来说，对半导体先进封装市场的策略分析至关重要。透过审查关键资源、能力和绩效指标，公司可以识别成长机会并努力改进。这种方法使您能够克服竞争环境中的挑战，利用新的商机并取得长期成功。

本报告对市场进行了全面分析，涵盖关键重点领域：

1. 市场渗透率：对当前市场环境的详细审查、主要企业的广泛资料、对其在市场中的影响力和整体影响力的评估。

2. 市场开发：辨识新兴市场的成长机会，评估现有领域的扩张潜力，并提供未来成长的策略蓝图。

3. 市场多元化：分析近期产品发布、未开发地区、关键产业进展、塑造市场的策略投资。

4. 竞争评估与情报：全面分析竞争格局，检验市场占有率、业务策略、产品系列、认证、监管核准、专利趋势、主要企业的技术进步等。

5. 产品开发与创新：重点在于有望推动未来市场成长的最尖端科技、研发活动和产品创新。

我们也回答重要问题，帮助相关人员做出明智的决策：

1.目前的市场规模和未来的成长预测是多少？

2. 哪些产品、区隔市场和地区提供最佳投资机会？

3.塑造市场的主要技术趋势和监管影响是什么？

4.主要厂商的市场占有率和竞争地位如何？

5. 推动供应商市场进入和退出策略的收益来源和策略机会是什么？

目录

第一章 前言

第二章调查方法

第三章执行摘要

第四章市场概况

第五章市场洞察

  • 市场动态
    • 促进因素
      • 汽车和家用电器中半导体装置的复杂性不断增加
      • 政府努力促进半导体生产和封装
      • 高效能运算和人工智慧应用的兴起
    • 抑制因素
      • 设计和製造先进半导体封装的技术复杂性
    • 机会
      • 先进半导体封装方法的技术进步
      • 对5G部署和6G网路的期望
    • 任务
      • 先进半导体封装的环境与永续性议题
  • 市场区隔分析
    • 封装平台：嵌入式晶片封装技术在穿戴式科技、智慧型手机和医疗设备中越来越受欢迎。
    • 应用：实现耐用性和高功率效率的先进半导体封装扩大IGBT模组的应用范围
  • 波特五力分析
  • PESTEL分析
    • 政治的
    • 经济
    • 社群
    • 技术的
    • 合法地
    • 环境

第六章 半导体先进封装市场封装平台

  • 2.5D 和 3D IC封装
  • 嵌入式晶粒
  • 扇入式晶圆层次电子构装
  • 扇出晶圆层次电子构装
  • 覆晶

第七章半导体先进封装市场：依应用分类

  • DCDC
  • IGBT
  • MOSFET
  • 电源模组
  • 监管机构

第8章：北美和南美洲先进半导体封装市场

  • 阿根廷
  • 巴西
  • 加拿大
  • 墨西哥
  • 美国

第9章：亚太半导体先进封装市场

  • 澳洲
  • 中国
  • 印度
  • 印尼
  • 日本
  • 马来西亚
  • 菲律宾
  • 新加坡
  • 韩国
  • 台湾
  • 泰国
  • 越南

第10章：欧洲、中东和非洲的先进半导体封装市场

  • 丹麦
  • 埃及
  • 芬兰
  • 法国
  • 德国
  • 以色列
  • 义大利
  • 荷兰
  • 奈及利亚
  • 挪威
  • 波兰
  • 卡达
  • 俄罗斯
  • 沙乌地阿拉伯
  • 南非
  • 西班牙
  • 瑞典
  • 瑞士
  • 土耳其
  • 阿拉伯聯合大公国
  • 英国

第十一章竞争格局

  • 2023 年市场占有率分析
  • FPNV 定位矩阵，2023
  • 竞争情境分析
    • 群创光电将于2024年下半年开始量产先进半导体封装
    • 美国推出30亿美元计画推广先进晶片封装
    • 国防部拨款 4,900 万美元用于提高先进半导体封装能力
  • 战略分析和建议

公司名单

  • Amkor Technology, Inc.
  • ASE Group
  • AT&S Company
  • Camtek Ltd.
  • ChipMOS Technologies Inc.
  • Evatec AG
  • FlipChip International LLC
  • HANA Micron Inc.
  • Infineon Technologies AG
  • Intel Corporation
  • ISI Interconnect Systems by Molex company
  • JCET Group
  • King Yuan Electronics Co., Ltd.
  • Microsemi Corporation
  • NXP Semiconductors NV
  • Plan Optik AG
  • Powertech Technology Inc.
  • Samsung Electronics Co., Ltd.
  • Schweizer Electronic AG
  • Shinko Electric Industries Co. Ltd
  • Signetics Corporation
  • Taiwan Semiconductor Manufacturing Company Limited
  • TDK Corporation
  • Teledyne DALSA
  • Veeco Instruments Inc.
Product Code: MRR-02026C4C8DF2

The Semiconductor Advanced Packaging Market was valued at USD 36.89 billion in 2023, expected to reach USD 38.92 billion in 2024, and is projected to grow at a CAGR of 5.89%, to USD 55.11 billion by 2030.

The scope of semiconductor advanced packaging encompasses the processes and technologies used to enhance the performance, density, and functionality of semiconductor devices. Advanced packaging techniques, such as 2.5D/3D integration, fan-out wafer level packaging (FOWLP), and system-in-package (SiP), are integral for miniaturization and high-performance computing. These are necessary due to the limitations of Moore's Law in keeping pace with miniaturization demands and are applied in numerous sectors, including consumer electronics, automotive electronics, telecommunication, and industrial electronics. The end-use scope is broad, with significant applications in smartphones, tablets, gaming consoles, IoT devices, and increasingly in automotive technology, driven by the rise of autonomous vehicles and electric cars. Market growth is notably influenced by the burgeoning electronics sector demanding more sophisticated, smaller, and efficient components, along with trends in AI, 5G, and IoT driving innovation. However, market participants face challenges such as high initial investment costs, complex supply chains, and technical difficulties in integration, particularly for smaller firms striving to keep pace with rapid technological advancements. Opportunities reside in areas such as development of more environmentally sustainable materials, enhancing thermal management solutions, and advancing heterogeneous integration. Innovative research targeting the enhancement of interconnect density, reducing power consumption, and increasing reliability can provide competitive advantages. Industry players should consider strategic partnerships with tech companies and investing in R&D to capitalize on burgeoning trends like quantum computing and edge AI. Moreover, the market exhibits a dynamic nature characterized by rapid technological evolution and competitive pressures. To thrive, businesses need agility and foresight to adapt to continuously evolving technology landscapes while overcoming the exclusivity of patent portfolios that can limit market entry. Emphasizing sustainability and efficiency in packaging processes can elevate market positions, highlighting the significance of forward-thinking strategies in a competitive market landscape.

KEY MARKET STATISTICS
Base Year [2023] USD 36.89 billion
Estimated Year [2024] USD 38.92 billion
Forecast Year [2030] USD 55.11 billion
CAGR (%) 5.89%

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Semiconductor Advanced Packaging Market

The Semiconductor Advanced Packaging Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

  • Market Drivers
    • Increasing complexity of semiconductor devices in automotive and consumer electronics
    • Government initiatives promoting semiconductor production and packaging
    • Rise of high-performance computing and artificial intelligence applications
  • Market Restraints
    • Technical complexity of design and manufacturing of advanced semiconductor packages
  • Market Opportunities
    • Technological advancements in semiconductor advanced packaging methods
    • Emerging rollout of 5G and the anticipation of a 6G network
  • Market Challenges
    • Environmental and sustainability concerns of advanced semiconductor packages

Porter's Five Forces: A Strategic Tool for Navigating the Semiconductor Advanced Packaging Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Semiconductor Advanced Packaging Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Semiconductor Advanced Packaging Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Semiconductor Advanced Packaging Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Semiconductor Advanced Packaging Market

A detailed market share analysis in the Semiconductor Advanced Packaging Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Semiconductor Advanced Packaging Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Semiconductor Advanced Packaging Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the Semiconductor Advanced Packaging Market

A strategic analysis of the Semiconductor Advanced Packaging Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the Semiconductor Advanced Packaging Market, highlighting leading vendors and their innovative profiles. These include Amkor Technology, Inc., ASE Group, AT&S Company, Camtek Ltd., ChipMOS Technologies Inc., Evatec AG, FlipChip International LLC, HANA Micron Inc., Infineon Technologies AG, Intel Corporation, ISI Interconnect Systems by Molex company, JCET Group, King Yuan Electronics Co., Ltd., Microsemi Corporation, NXP Semiconductors N.V., Plan Optik AG, Powertech Technology Inc., Samsung Electronics Co., Ltd., Schweizer Electronic AG, Shinko Electric Industries Co. Ltd, Signetics Corporation, Taiwan Semiconductor Manufacturing Company Limited, TDK Corporation, Teledyne DALSA, and Veeco Instruments Inc..

Market Segmentation & Coverage

This research report categorizes the Semiconductor Advanced Packaging Market to forecast the revenues and analyze trends in each of the following sub-markets:

  • Based on Packaging Platform, market is studied across 2.5D & 3D IC Packaging, Embedded Die, Fan-In Wafer Level Packaging, Fan-Out Wafer Level Packaging, and Flip-Chip.
  • Based on Application, market is studied across DCDC, IGBT, MOSFET, Power Modules, and Regulator.
  • Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

  • 1.1. Objectives of the Study
  • 1.2. Market Segmentation & Coverage
  • 1.3. Years Considered for the Study
  • 1.4. Currency & Pricing
  • 1.5. Language
  • 1.6. Stakeholders

2. Research Methodology

  • 2.1. Define: Research Objective
  • 2.2. Determine: Research Design
  • 2.3. Prepare: Research Instrument
  • 2.4. Collect: Data Source
  • 2.5. Analyze: Data Interpretation
  • 2.6. Formulate: Data Verification
  • 2.7. Publish: Research Report
  • 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

  • 5.1. Market Dynamics
    • 5.1.1. Drivers
      • 5.1.1.1. Increasing complexity of semiconductor devices in automotive and consumer electronics
      • 5.1.1.2. Government initiatives promoting semiconductor production and packaging
      • 5.1.1.3. Rise of high-performance computing and artificial intelligence applications
    • 5.1.2. Restraints
      • 5.1.2.1. Technical complexity of design and manufacturing of advanced semiconductor packages
    • 5.1.3. Opportunities
      • 5.1.3.1. Technological advancements in semiconductor advanced packaging methods
      • 5.1.3.2. Emerging rollout of 5G and the anticipation of a 6G network
    • 5.1.4. Challenges
      • 5.1.4.1. Environmental and sustainability concerns of advanced semiconductor packages
  • 5.2. Market Segmentation Analysis
    • 5.2.1. Packaging Platform: Increasing preference for embedded die packaging technology in wearable technology, smartphones, and medical devices
    • 5.2.2. Application: Expanding application of semiconductor advanced packaging IGBT modules for durability, and high power efficiency
  • 5.3. Porter's Five Forces Analysis
    • 5.3.1. Threat of New Entrants
    • 5.3.2. Threat of Substitutes
    • 5.3.3. Bargaining Power of Customers
    • 5.3.4. Bargaining Power of Suppliers
    • 5.3.5. Industry Rivalry
  • 5.4. PESTLE Analysis
    • 5.4.1. Political
    • 5.4.2. Economic
    • 5.4.3. Social
    • 5.4.4. Technological
    • 5.4.5. Legal
    • 5.4.6. Environmental

6. Semiconductor Advanced Packaging Market, by Packaging Platform

  • 6.1. Introduction
  • 6.2. 2.5D & 3D IC Packaging
  • 6.3. Embedded Die
  • 6.4. Fan-In Wafer Level Packaging
  • 6.5. Fan-Out Wafer Level Packaging
  • 6.6. Flip-Chip

7. Semiconductor Advanced Packaging Market, by Application

  • 7.1. Introduction
  • 7.2. DCDC
  • 7.3. IGBT
  • 7.4. MOSFET
  • 7.5. Power Modules
  • 7.6. Regulator

8. Americas Semiconductor Advanced Packaging Market

  • 8.1. Introduction
  • 8.2. Argentina
  • 8.3. Brazil
  • 8.4. Canada
  • 8.5. Mexico
  • 8.6. United States

9. Asia-Pacific Semiconductor Advanced Packaging Market

  • 9.1. Introduction
  • 9.2. Australia
  • 9.3. China
  • 9.4. India
  • 9.5. Indonesia
  • 9.6. Japan
  • 9.7. Malaysia
  • 9.8. Philippines
  • 9.9. Singapore
  • 9.10. South Korea
  • 9.11. Taiwan
  • 9.12. Thailand
  • 9.13. Vietnam

10. Europe, Middle East & Africa Semiconductor Advanced Packaging Market

  • 10.1. Introduction
  • 10.2. Denmark
  • 10.3. Egypt
  • 10.4. Finland
  • 10.5. France
  • 10.6. Germany
  • 10.7. Israel
  • 10.8. Italy
  • 10.9. Netherlands
  • 10.10. Nigeria
  • 10.11. Norway
  • 10.12. Poland
  • 10.13. Qatar
  • 10.14. Russia
  • 10.15. Saudi Arabia
  • 10.16. South Africa
  • 10.17. Spain
  • 10.18. Sweden
  • 10.19. Switzerland
  • 10.20. Turkey
  • 10.21. United Arab Emirates
  • 10.22. United Kingdom

11. Competitive Landscape

  • 11.1. Market Share Analysis, 2023
  • 11.2. FPNV Positioning Matrix, 2023
  • 11.3. Competitive Scenario Analysis
    • 11.3.1. Innolux to launch semiconductor advanced packaging mass-production 2H24
    • 11.3.2. US Launches USD 3 Billion Effort to Boost Advanced Chip Packaging
    • 11.3.3. DOD Awards USD 49 Million to Improve Advanced Semiconductor Packaging Capabilities
  • 11.4. Strategy Analysis & Recommendation

Companies Mentioned

  • 1. Amkor Technology, Inc.
  • 2. ASE Group
  • 3. AT&S Company
  • 4. Camtek Ltd.
  • 5. ChipMOS Technologies Inc.
  • 6. Evatec AG
  • 7. FlipChip International LLC
  • 8. HANA Micron Inc.
  • 9. Infineon Technologies AG
  • 10. Intel Corporation
  • 11. ISI Interconnect Systems by Molex company
  • 12. JCET Group
  • 13. King Yuan Electronics Co., Ltd.
  • 14. Microsemi Corporation
  • 15. NXP Semiconductors N.V.
  • 16. Plan Optik AG
  • 17. Powertech Technology Inc.
  • 18. Samsung Electronics Co., Ltd.
  • 19. Schweizer Electronic AG
  • 20. Shinko Electric Industries Co. Ltd
  • 21. Signetics Corporation
  • 22. Taiwan Semiconductor Manufacturing Company Limited
  • 23. TDK Corporation
  • 24. Teledyne DALSA
  • 25. Veeco Instruments Inc.

LIST OF FIGURES

  • FIGURE 1. SEMICONDUCTOR ADVANCED PACKAGING MARKET RESEARCH PROCESS
  • FIGURE 2. SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, 2023 VS 2030
  • FIGURE 3. GLOBAL SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, 2018-2030 (USD MILLION)
  • FIGURE 4. GLOBAL SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 5. GLOBAL SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 6. GLOBAL SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2023 VS 2030 (%)
  • FIGURE 7. GLOBAL SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 8. GLOBAL SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2023 VS 2030 (%)
  • FIGURE 9. GLOBAL SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 10. AMERICAS SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 11. AMERICAS SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 12. UNITED STATES SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY STATE, 2023 VS 2030 (%)
  • FIGURE 13. UNITED STATES SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 14. ASIA-PACIFIC SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 15. ASIA-PACIFIC SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 16. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
  • FIGURE 17. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
  • FIGURE 18. SEMICONDUCTOR ADVANCED PACKAGING MARKET SHARE, BY KEY PLAYER, 2023
  • FIGURE 19. SEMICONDUCTOR ADVANCED PACKAGING MARKET, FPNV POSITIONING MATRIX, 2023

LIST OF TABLES

  • TABLE 1. SEMICONDUCTOR ADVANCED PACKAGING MARKET SEGMENTATION & COVERAGE
  • TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
  • TABLE 3. GLOBAL SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, 2018-2030 (USD MILLION)
  • TABLE 4. GLOBAL SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 5. GLOBAL SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 6. SEMICONDUCTOR ADVANCED PACKAGING MARKET DYNAMICS
  • TABLE 7. GLOBAL SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 8. GLOBAL SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY 2.5D & 3D IC PACKAGING, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 9. GLOBAL SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY EMBEDDED DIE, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 10. GLOBAL SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY FAN-IN WAFER LEVEL PACKAGING, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 11. GLOBAL SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY FAN-OUT WAFER LEVEL PACKAGING, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 12. GLOBAL SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY FLIP-CHIP, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 13. GLOBAL SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 14. GLOBAL SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY DCDC, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 15. GLOBAL SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY IGBT, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 16. GLOBAL SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY MOSFET, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 17. GLOBAL SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY POWER MODULES, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 18. GLOBAL SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY REGULATOR, BY REGION, 2018-2030 (USD MILLION)
  • TABLE 19. AMERICAS SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 20. AMERICAS SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 21. AMERICAS SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 22. ARGENTINA SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 23. ARGENTINA SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 24. BRAZIL SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 25. BRAZIL SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 26. CANADA SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 27. CANADA SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 28. MEXICO SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 29. MEXICO SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 30. UNITED STATES SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 31. UNITED STATES SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 32. UNITED STATES SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
  • TABLE 33. ASIA-PACIFIC SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 34. ASIA-PACIFIC SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 35. ASIA-PACIFIC SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 36. AUSTRALIA SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 37. AUSTRALIA SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 38. CHINA SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 39. CHINA SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 40. INDIA SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 41. INDIA SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 42. INDONESIA SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 43. INDONESIA SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 44. JAPAN SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 45. JAPAN SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 46. MALAYSIA SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 47. MALAYSIA SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 48. PHILIPPINES SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 49. PHILIPPINES SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 50. SINGAPORE SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 51. SINGAPORE SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 52. SOUTH KOREA SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 53. SOUTH KOREA SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 54. TAIWAN SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 55. TAIWAN SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 56. THAILAND SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 57. THAILAND SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 58. VIETNAM SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 59. VIETNAM SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 60. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 61. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 62. EUROPE, MIDDLE EAST & AFRICA SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
  • TABLE 63. DENMARK SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 64. DENMARK SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 65. EGYPT SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 66. EGYPT SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 67. FINLAND SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 68. FINLAND SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 69. FRANCE SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 70. FRANCE SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 71. GERMANY SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 72. GERMANY SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 73. ISRAEL SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 74. ISRAEL SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 75. ITALY SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 76. ITALY SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 77. NETHERLANDS SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 78. NETHERLANDS SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 79. NIGERIA SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 80. NIGERIA SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 81. NORWAY SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 82. NORWAY SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 83. POLAND SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 84. POLAND SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 85. QATAR SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 86. QATAR SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 87. RUSSIA SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 88. RUSSIA SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 89. SAUDI ARABIA SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 90. SAUDI ARABIA SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 91. SOUTH AFRICA SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 92. SOUTH AFRICA SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 93. SPAIN SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 94. SPAIN SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 95. SWEDEN SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 96. SWEDEN SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 97. SWITZERLAND SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 98. SWITZERLAND SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 99. TURKEY SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 100. TURKEY SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 101. UNITED ARAB EMIRATES SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 102. UNITED ARAB EMIRATES SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 103. UNITED KINGDOM SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY PACKAGING PLATFORM, 2018-2030 (USD MILLION)
  • TABLE 104. UNITED KINGDOM SEMICONDUCTOR ADVANCED PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
  • TABLE 105. SEMICONDUCTOR ADVANCED PACKAGING MARKET SHARE, BY KEY PLAYER, 2023
  • TABLE 106. SEMICONDUCTOR ADVANCED PACKAGING MARKET, FPNV POSITIONING MATRIX, 2023