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市场调查报告书
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1532912

半导体封装市场 - 2024 年至 2029 年预测

Semiconductor Packaging Market - Forecasts from 2024 to 2029
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 140 Pages | 商品交期: 最快1-2个工作天内

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简介目录

预测期内，半导体封装市场预计将以 7.33% 的复合年增长率成长，从 2024 年的 489.66 亿美元增至 2029 年的 697.33 亿美元。

半导体是关键部件，广泛应用于汽车、通讯、消费性电子、医疗保健和航太等多个行业。半导体具有积体电路、电子分离式元件、电晶体等多种特性。半导体是精密部件，在运送给各个最终用户之前需要保护性包装。半导体封装提供保护层，保护半导体免受灰尘、刮伤以及其他物理和环境损害。

随着全球市场对半导体的需求不断增加，半导体封装的需求也预计会成长。半导体是全球市场汽车的重要组成部分。半导体提供多种功能，例如支援汽车中的娱乐系统和网路连线选项。半导体还整合到汽车的各种安全系统中，例如 ADAS 系统和紧急煞车系统。根据国际工业协会（OICA）公布的数据，2023年全球汽车产量达到约93,546,000辆。该组织还表示，在全球生产的汽车总数中，约55,115,000辆是在亚太地区生产的，其中包括中国和印度。

由于消费性电子产品需求的增加、小型化需求的成长以及5G等新兴技术的采用增加，半导体封装市场预计将以温和的速度成长。此外，物联网（IoT）不断增长的需求也对半导体封装市场产生正面影响。消费者对智慧型手錶和穿戴式装置等小型电子设备的需求日益增长。随着製造商寻求将所有东西都装入有限空间的解决方案，对半导体封装的需求正在迅速增长。因此，上述因素预计将在预测期内推动半导体封装市场的发展。

半导体封装市场的驱动因素

  • 全球半导体需求的增加预计将推动市场成长。

半导体是电气设备中最常用的元件之一。半导体支援通讯的使用并提供更好的计算体验。半导体广泛应用于各种产业，包括医疗保健、航太、汽车和消费性电子产品。半导体需求的不断增长预计将推动全球半导体封装市场规模的成长。

全球半导体产业的需求大幅成长，主要得益于其多产业应用。根据半导体产业协会的数据，2023年4月至2024年全球半导体需求成长约15.8%。该协会预测2024年成长率将在16%左右。 2024 年 4 月的半导体销售额预计约为 464 亿美元，高于 2023 年 4 月的 401 亿美元。 2024年，美洲地区的成长率最高，约32.4%，其次是中国，约23.4%。全部区域的成长率为 11.1%。

半导体封装市场的地理展望

  • 预计亚太地区市场将会成长。

中国的半导体产业是世界上最大的产业之一。该国对半导体抱有很高的雄心，正在发展其积体电路产业以生产更多的晶片。该国正在推动其半导体生态系统，包括代工厂、封装设备和研究机构。

此外，中国政府正在采取一切必要措施促进国内半导体产业的发展。例如，根据半导体产业协会（SIA）的数据，政府正在认真努力减少半导体产业的差距，从 2014 年到 2030 年将投资约 1,500 亿美元。因此，政府为促进半导体生产的积极投资预计将对半导体封装市场产生积极影响。

此外，2023年9月，中国宣布将投资400亿美元建造新的国家半导体产业基地。该倡议是中国与美国等国家竞争的更广泛战略的一部分。

中国是消费性电子产品和其他半导体相关材料的最大出口国之一。根据经济复杂性观察站的数据，该国出口了价值 2,720 亿美元的广播设备、价值 1,810 亿美元的电脑、价值 1,110 亿美元的商用机器零件和价值 702 亿美元的半导体设备。这些产品的主要出口国家是美国、香港、德国和韩国。

半导体封装的主要市场开拓：

  • 2023年，领先的半导体封装和测试服务公司Amkor Technology宣布计划在美国亚利桑那州建立先进的封装和测试设施。该设施将有助于建立一个有弹性的半导体封装供应链。

半导体封装市场的主要企业：

  • Amkor Technology 总部位于美国亚利桑那州坦佩，于 1968 年在韩国开始运营，是半导体组装和测试外包 (OSAT) 行业的领导者。此外，该公司还以其外包半导体设计、封装和测试（OSAT）服务而闻名。
  • 富士通半导体有限公司专注于LSI製造，并为需要LSI的各种客户提供量身定制的高可靠性解决方案，例如FeRAM（铁电RAM）。该公司的目标是透过创新打造永续的新产品，让世界变得更美好。
  • 英特尔公司是领先的製程技术开发商之一，也是领先的半导体製造商之一。公司的使命是塑造科技的未来，帮助创造更美好的未来。英特尔(R) Evo(TM) 笔记型电脑、英特尔博锐(R) 商用、游戏系统、英特尔(R) Arc(TM) 独立显示卡、英特尔(R) Wi-Fi 产品、Thunderbolt(TM) 技术、英特尔( R) Unison(TM) 软体和晶片组。

半导体封装市场区隔分析如下：

按包装类型

  • 先进封装
  • 覆晶
  • 嵌入式晶粒
  • 扇出级封装 (FO-WLP)
  • 扇入级封装 (FI-WLP)

按包装材料分

  • 有机基板
  • 导线架
  • 陶瓷封装
  • 接合线
  • 其他的

按最终用户

  • 消费性电子产品
  • 航太/国防
  • 医疗设备
  • 通讯/电讯
  • 其他的

按地区

  • 北美洲
  • 美国
  • 加拿大
  • 墨西哥
  • 南美洲
  • 巴西
  • 阿根廷
  • 其他的
  • 欧洲
  • 英国
  • 德国
  • 法国
  • 义大利
  • 其他的
  • 中东/非洲
  • 沙乌地阿拉伯
  • UAE
  • 其他的
  • 亚太地区
  • 中国
  • 日本
  • 印度
  • 韩国
  • 泰国
  • 印尼
  • 其他的

目录

第一章简介

  • 市场概况
  • 市场定义
  • 调查范围
  • 市场区隔
  • 货币
  • 先决条件
  • 基准年和预测年时间表
  • 相关人员的主要利益

第二章调查方法

  • 研究设计
  • 调查过程

第三章执行摘要

  • 主要发现

第四章市场动态

  • 市场驱动因素
  • 市场限制因素
  • 波特五力分析
  • 产业价值链分析
  • 分析师观点

第五章半导体封装市场：依封装类型

  • 介绍
  • 先进封装
  • 覆晶
  • 嵌入式晶粒
  • 扇出级封装 (FO-WLP)
  • 扇入级封装 (FI-WLP)

第六章半导体封装市场：依封装材料分类

  • 介绍
  • 有机基材
  • 导线架
  • 陶瓷包装
  • 键合线
  • 其他的

第七章 半导体封装市场：依最终使用者分类

  • 介绍
  • 消费性电子产品
  • 航太/国防
  • 医疗设备
  • 通讯/电讯
  • 其他的

第八章半导体封装市场：依地区

  • 介绍
  • 北美洲
    • 按包装类型
    • 按包装材料分
    • 按最终用户
    • 按国家/地区
  • 南美洲
    • 按包装类型
    • 按包装材料分
    • 按最终用户
    • 按国家/地区
  • 欧洲
    • 按包装类型
    • 按包装材料分
    • 按最终用户
    • 按国家/地区
  • 中东/非洲
    • 按包装类型
    • 按包装材料分
    • 按最终用户
    • 按国家/地区
  • 亚太地区
    • 按包装类型
    • 按包装材料分
    • 按最终用户
    • 按国家/地区

第九章竞争环境及分析

  • 主要企业及策略分析
  • 市场占有率分析
  • 合併、收购、协议和合作
  • 竞争对手仪表板

第十章 公司简介

  • ASE
  • Amkor Technology
  • Powertech Technology Inc.
  • Fujitsu Semiconductor Limited
  • ChipMOS TECHNOLOGIES INC.
  • Intel Corporation
  • Samsung Electronics Co. Ltd
  • Unisem（M）Berhad
  • ISI-Interconnect Systems
  • Jiangsu Changjiang Electronics Technology Co. Ltd（JCET）
简介目录
Product Code: KSI061616099

The Semiconductor packaging market is projected to grow at a CAGR of 7.33% over the forecast period, increasing from US$48.966 billion in 2024 to US$69.733 billion by 2029.

Semiconductors are an important component applicable across multiple industries, like automotive, telecommunications, consumer electronics, healthcare, and aerospace, among others. The semiconductor has various properties like integrated circuits, electronic discrete, and transistors. it. Semiconductors are a sensitive component, so they require a protective packaging case before transporting it to various end-users. The semiconductor packaging offers a protective layer, which further helps prevent the semiconductors from dust, scratch, or any other physical or environmental damage.

The demand for semiconductor packaging is expected to grow with the increasing demand for semiconductors in the global market. Semiconductors act as an important component in automobiles in the global market. The semiconductors offer multiple features, such as enabling the entertainment system and internet connectivity options in vehicles. The semiconductors are also embedded into various safety systems of the automobile, such as the ADAS system and emergency braking systems. The global production of automotives in 2023 reached about 93.546 million units, as stated by the International Organization of Motor Vehicle Manufacturers (OICA). The organization also stated that about 55.115 million of the total vehicles produced globally, were produced in Asia Pacific region, like China and India.

The semiconductor packaging market is estimated to grow at a moderate rate, owing to the increasing demand for consumer electronics coupled with growing demand for miniaturization and increasing adoption of emerging technologies such as 5G. Additionally, the rising demand for the Internet of Things (IoT) has also had a positive impact on the semiconductor packaging market. There is a rising demand among consumers for miniaturized electronic devices such as smartwatches and wearables, among others. There is an upsurge in demand for semiconductor packaging as manufacturers are looking for solutions to fit everything in limited space. Hence, the above-listed factors are expected to propel the market for semiconductor packaging in the projected period

Semiconductor Packaging Market Drivers

  • Increasing global semiconductor demand is anticipated to propel market growth.

The semiconductor is one of the most applicable components in electrical devices. It enables the use of communications and provides a better computing experience. Semiconductors are applicable in multiple industries, such as healthcare, aerospace, automotive, and consumer electronics. The increasing demand for semiconductors is expected to boost the market size of the global semiconductor packaging market.

The global semiconductor industry has witnessed a massive boost in demand, majorly due to its multi-industry application. The global semiconductor demand increased by about 15.8% from April 2023 to 2024, as conveyed by the Semiconductor Industry Association. The industry is forecasted by the association, to achieve a growth of about 16% in 2024. The semiconductor sales in April 2024 were estimated to be about US$ 46.4 billion, which marked an increase from US$ 40.1 billion in sales in April 2023. In 2024, the Americas region observed the highest growth of about 32.4%, followed by China, which witnessed a growth of about 23.4%. The overall Asia Pacific region observed a growth of 11.1%.

Semiconductor Packaging Market Geographical Outlook

  • The market is projected to grow in the Asia Pacific region.

China's semiconductor industry is one of the largest in the world. The nation is highly ambitious about semiconductors and is developing its IC industry to produce more chips. The country has one of the boosting semiconductor ecosystems with foundries, packaging equipment, and research institutions, among others.

Additionally, the Chinese government is taking all necessary steps to promote the country's semiconductor industry. For instance, according to the Semiconductor Industry Association (SIA), the government is making serious efforts to close the gap in the semiconductor industry by investing about US$150 billion from 2014 to 2030. Hence, such booming investments by the government to promote the production of semiconductors are anticipated to have a positive impact on the semiconductor packaging market.

Moreover, in September 2023, China announced an investment of US$40 billion to build a new state-back for the semiconductor industry. This initiative is part of China's broader strategy to compete with countries like the United States.

China is one of the largest exporters of consumer electronics and other semiconductor-related materials. According to the Observatory of Economic Complexity, the country exported broadcasting equipment worth US$272 billion, computers worth US$181 billion, office machine parts worth US$111 billion, and semiconductor devices worth US$70.2 billion. The major countries where the country exported these goods were the United States, Hong Kong, Germany, and South Korea.

Semiconductor Packaging Key Market Developments:

  • In 2023, Amkor Technology, one of the leading companies in semiconductor packaging and test services, revealed its plan to create an advanced packaging and test facility in Arizona, United States. The facility will contribute to building a resilient supply chain for semiconductor packaging.

Semiconductor Packaging Market Key Players:

  • Amkor Technology, headquartered in Tempe, Arizona, United States, started its business in Korea in 1968 and is a leader in the Outsourced Semiconductor Assembly and Test (OSAT) industry. Moreover, the company is well known for outsourced (OSAT) semiconductor design, packaging, and test services. The offerings include IC semiconductor packaging, advanced packaging and testing of semiconductors, among others.
  • Fujitsu Semiconductor Limited specializes in manufacturing LSI and provides highly reliable solutions tailored to various customers who need LSI, such as FeRAM (Ferroelectric RAM). The company aims to make the world a better place by building new sustainable products with innovation. It provides FeRAM (Ferroelectric RAM), ReRAM (Resistive RAM), and Catalogs & Datasheets.
  • Intel Corporation is one of the major developers of process technology and one of the leading semiconductor manufacturers. The company's mission is to shape the future of technology to help create a better future. Popular product category includes Intel(R) Evo(TM) Laptops., Intel vPro(R) for Business., Gaming Systems, Intel (R) Arc(TM) Discrete Graphics, Intel(R) Wi-Fi Products, Thunderbolt(TM) Technology, Intel(R) Unison(TM) Software, and Chipsets among others

The Semiconductor Packaging Market is segmented and analyzed as:

By Packaging Type

  • Advanced Packaging
  • Flip Chip
  • Embedded Die
  • Fan-Out Level Packaging (FO-WLP)
  • Fan-In Level Packaging (FI-WLP)

By Packaging Material

  • Organic Substrate
  • Leadframe
  • Ceramic Packaging
  • Bonding-Wire
  • Others

By End-User

  • Consumer Electronics
  • Aerospace and Defence
  • Medical Devices
  • Communication and Telecom
  • Others

By Geography

  • North America
  • USA
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • UK
  • Germany
  • France
  • Italy
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • UAE
  • Others
  • Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Thailand
  • Indonesia
  • Others

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Market Overview
  • 1.2. Market Definition
  • 1.3. Scope of the Study
  • 1.4. Market Segmentation
  • 1.5. Currency
  • 1.6. Assumptions
  • 1.7. Base and Forecast Years Timeline
  • 1.8. Key benefits for the stakeholders

2. RESEARCH METHODOLOGY

  • 2.1. Research Design
  • 2.2. Research Process

3. EXECUTIVE SUMMARY

  • 3.1. Key Findings

4. MARKET DYNAMICS

  • 4.1. Market Drivers
  • 4.2. Market Restraints
  • 4.3. Porter's Five Forces Analysis
    • 4.3.1. Bargaining Power of Suppliers
    • 4.3.2. Bargaining Power of Buyers
    • 4.3.3. Threat of New Entrants
    • 4.3.4. Threat of Substitutes
    • 4.3.5. Competitive Rivalry in the Industry
  • 4.4. Industry Value Chain Analysis
  • 4.5. Analyst View

5. SEMICONDUCTOR PACKAGING MARKET BY PACKAGING TYPE

  • 5.1. Introduction
  • 5.2. Advanced Packaging
  • 5.3. Flip Chip
  • 5.4. Embedded Die
  • 5.5. Fan-Out Level Packaging (FO-WLP)
  • 5.6. Fan-In Level Packaging (FI-WLP)

6. SEMICONDUCTOR PACKAGING MARKET BY PACKAGING MATERIAL

  • 6.1. Introduction
  • 6.2. Organic Substrate
  • 6.3. Leadframe
  • 6.4. Ceramic Packaging
  • 6.5. Bonding-Wire
  • 6.6. Others

7. SEMICONDUCTOR PACKAGING MARKET BY END-USER

  • 7.1. Introduction
  • 7.2. Consumer Electronics
  • 7.3. Aerospace and Defence
  • 7.4. Medical Devices
  • 7.5. Communication and Telecom
  • 7.6. Others

8. SEMICONDUCTOR PACKAGING MARKET BY GEOGRAPHY

  • 8.1. Introduction
  • 8.2. North America
    • 8.2.1. By Packaging Type
    • 8.2.2. By Packaging Material
    • 8.2.3. By End-user
    • 8.2.4. By Country
      • 8.2.4.1. United States
      • 8.2.4.2. Canada
      • 8.2.4.3. Mexico
  • 8.3. South America
    • 8.3.1. By Packaging Type
    • 8.3.2. By Packaging Material
    • 8.3.3. By End-user
    • 8.3.4. By Country
      • 8.3.4.1. Brazil
      • 8.3.4.2. Argentina
      • 8.3.4.3. Others
  • 8.4. Europe
    • 8.4.1. By Packaging Type
    • 8.4.2. By Packaging Material
    • 8.4.3. By End-user
    • 8.4.4. By Country
      • 8.4.4.1. Germany
      • 8.4.4.2. United Kingdom
      • 8.4.4.3. France
      • 8.4.4.4. Spain
      • 8.4.4.5. Others
  • 8.5. Middle East and Africa
    • 8.5.1. By Packaging Type
    • 8.5.2. By Packaging Material
    • 8.5.3. By End-user
    • 8.5.4. By Country
      • 8.5.4.1. Saudi Arabia
      • 8.5.4.2. UAE
      • 8.5.4.3. Others
  • 8.6. Asia Pacific
    • 8.6.1. By Packaging Type
    • 8.6.2. By Packaging Material
    • 8.6.3. By End-user
    • 8.6.4. By Country
      • 8.6.4.1. China
      • 8.6.4.2. Japan
      • 8.6.4.3. South Korea
      • 8.6.4.4. India
      • 8.6.4.5. Thailand
      • 8.6.4.6. Indonesia
      • 8.6.4.7. Others

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 9.1. Major Players and Strategy Analysis
  • 9.2. Market Share Analysis
  • 9.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 9.4. Competitive Dashboard

10. COMPANY PROFILES

  • 10.1. ASE
  • 10.2. Amkor Technology
  • 10.3. Powertech Technology Inc.
  • 10.4. Fujitsu Semiconductor Limited
  • 10.5. ChipMOS TECHNOLOGIES INC.
  • 10.6. Intel Corporation
  • 10.7. Samsung Electronics Co. Ltd
  • 10.8. Unisem (M) Berhad
  • 10.9. ISI - Interconnect Systems
  • 10.10. Jiangsu Changjiang Electronics Technology Co. Ltd (JCET)