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市场调查报告书
商品编码
1698502

半导体封装市场：2025-2030 年预测

Semiconductor Packaging Market - Forecasts from 2025 to 2030
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 140 Pages | 商品交期: 最快1-2个工作天内

价格
简介目录

预计半导体封装市场将从 2025 年的 531.19 亿美元成长到 2030 年的 738.86 亿美元，预测期内的复合年增长率为 6.82%。

半导体是应用于汽车、通讯、家电、医疗保健和航太等各行业的重要组件。半导体具有积体电路、电子分离式元件、电晶体等多种特性。半导体是精密的部件，在运送给多个最终用户之前需要保护性包装盒。半导体封装提供了一层保护层，保护半导体免受灰尘和刮伤等物理和环境损害。

预计半导体封装的需求将随着全球半导体需求的不断增长而增长。半导体是汽车的重要部件。半导体具有多种功能，例如支援汽车娱乐系统和网路连接选项。半导体还整合到各种汽车安全系统中，例如ADAS和紧急煞车系统。

市场趋势：

  • 全球对半导体的需求不断增长，推动着市场扩张：半导体是电子设备中必不可少的组件，促进了通讯并提高了运算能力。其应用涉及医疗保健、航太、汽车和消费电子等广泛行业，推动了全球半导体封装市场大幅成长的预期。由于半导体在许多领域的多功能性，对半导体的需求正在迅速增长。根据半导体产业协会 (SIA) 预测，从 2023 年 4 月到 2024 年 4 月，全球半导体需求预计将成长 15.8%，2024 年产业成长率预计将达到 16% 左右。销售额将反映这一上升趋势，预计 2024 年 4 月销售额将达到 464 亿美元，高于 2023 年 4 月的 401 亿美元。按地区划分，美洲将在 2024 年显着成长 32.4%，其次是中国（成长 23.4%）和亚太地区（成长 11.1%）。
  • 全球半导体封装市场细分：半导体封装市场分为五个区域：北美、南美、欧洲、中东和非洲以及亚太地区。中国是半导体行业的全球领导者，并制定了提高积体电路（IC）生产和加强国内晶片製造的雄心勃勃的目标。该国拥有蓬勃发展的半导体生态系统，包括代工厂、封装设备和研究机构。正如美国所指出的，中国政府正在积极支持这一增长，其中包括在2014年至2030年期间投资约1500亿美元。这些倡议促进半导体生产的政府措施预计将极大有利于半导体封装市场。

报告涉及的主要企业包括 ASE、Amkor Technology、Powertech Technology Inc.、富士通半导体有限公司、ChipMOS Technologies Inc.、英特尔公司、三星电子有限公司和 Unisem(M)Berhad。

本报告的主要优点

  • 深刻分析：获得涵盖主要和新兴地区的深入市场洞察，重点关注客户群、政府政策和社会经济因素、消费者偏好、垂直行业和其他子区隔。
  • 竞争格局：了解全球主要企业所采用的策略策略，并了解正确策略带来的潜在市场渗透。
  • 市场趋势和驱动因素：探索动态因素和关键市场趋势以及它们将如何影响市场的未来发展。
  • 可行的建议：利用洞察力进行策略决策，在动态环境中开闢新的业务流和收益。
  • 适用范围广：对于新兴企业、研究机构、顾问公司、中小企业和大型企业来说，它都是实用且具有成本效益的。

它有什么用途？

产业和市场考量、商业机会评估、产品需求预测、打入市场策略、地理扩张、资本支出决策、法律规范与影响、新产品开发、竞争影响

研究范围

  • 2022 年至 2024 年的历史数据和 2025 年至 2030 年的预测数据
  • 成长机会、挑战、供应链前景、法律规范与趋势分析
  • 竞争定位、策略和市场占有率分析
  • 评估收益成长和预测的地区（包括细分市场和国家）
  • 公司概况（策略、产品、财务资讯、主要趋势等）

目录

第一章 引言

  • 市场概览
  • 市场定义
  • 研究范围
  • 市场区隔
  • 货币
  • 先决条件
  • 基准年和预测年时间表
  • 相关人员的主要利益

第二章调查方法

  • 研究设计
  • 研究过程

第三章执行摘要

  • 主要发现
  • 分析师观点

第四章 市场动态

  • 市场驱动因素
  • 市场限制
  • 波特五力分析
  • 产业价值链分析

第五章半导体封装市场（依材料类型）

  • 介绍
  • 有机基材
  • 键合线
  • 陶瓷封装
  • 其他的

第六章半导体封装市场（依封装类型）

  • 介绍
  • 先进封装
  • 覆晶
  • 嵌入式晶粒
  • 扇出级封装（FO-WLP）
  • 扇入级封装 (FI-WLP)

第七章半导体封装市场（依封装材料）

  • 介绍
  • 有机基材
  • 导线架
  • 陶瓷封装
  • 键合线
  • 其他的

第八章半导体封装市场（依最终使用者）

  • 介绍
  • 家电
  • 航太和国防
  • 医疗设备
  • 通讯和电讯
  • 其他的

9. 半导体封装市场（依地区）

  • 世界概况
  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 南美洲
    • 巴西
    • 阿根廷
    • 其他的
  • 欧洲
    • 英国
    • 德国
    • 法国
    • 义大利
    • 其他的
  • 中东和非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 其他的
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 韩国
    • 泰国
    • 印尼
    • 其他的

第十章竞争格局及分析

  • 主要企业和策略分析
  • 市场占有率分析
  • 合併、收购、协议和合作
  • 竞争仪錶板

第十一章 公司简介

  • ASE
  • Amkor Technology
  • Powertech Technology Inc.
  • Fujitsu Semiconductor Limited
  • ChipMOS Technologies Inc.
  • Intel Corporation
  • Samsung Electronics Co., Ltd.
  • Unisem（M）Berhad
  • ISI-Interconnect Systems
  • Jiangsu Changjiang Electronics Technology Co., Ltd.（JCET）
简介目录
Product Code: KSI061616099

The semiconductor packaging market is projected to grow at a CAGR of 6.82% over the forecast period, increasing from US$53.119 billion in 2025 to US$73.886 billion by 2030.

Semiconductors are an important component applicable across multiple industries, like automotive, telecommunications, consumer electronics, healthcare, and aerospace, among others. Semiconductors have various properties like integrated circuits, electronic discrete, and transistors. They are a sensitive component, requiring a protective packaging case before being transported to multiple end-users. The semiconductor packaging offers a protective layer, which helps prevent the semiconductors from dust, scratches, or any other physical or environmental damage.

The demand for semiconductor packaging is expected to grow with the increasing demand for semiconductors globally. Semiconductors are an important component in automobiles. They offer multiple features, such as enabling the entertainment system and internet connectivity options in vehicles. The semiconductors are also embedded into various automobile safety systems, such as the ADAS and emergency braking systems.

Market Trends:

  • Rising Global Semiconductor Demand Set to Drive Market Expansion: Semiconductors are vital components in electronic devices, facilitating communication and enhancing computing capabilities. Their widespread use spans industries such as healthcare, aerospace, automotive, and consumer electronics, fueling expectations of significant growth in the global semiconductor packaging market. The semiconductor sector has experienced a surge in demand due to its versatility across multiple fields. According to the Semiconductor Industry Association (SIA), global semiconductor demand rose by 15.8% from April 2023 to April 2024, with a projected industry growth of approximately 16% for 2024. Sales figures reflect this upward trend, reaching an estimated US$46.4 billion in April 2024, up from US$40.1 billion in April 2023. Regionally, the Americas led with a remarkable 32.4% growth in 2024, followed by China at 23.4%, while the broader Asia-Pacific region saw an 11.1% increase.
  • Global Segmentation of the Semiconductor Packaging Market: The semiconductor packaging market is divided into five regions: North America, South America, Europe, the Middle East and Africa, and Asia-Pacific. China stands out as a global leader in the semiconductor industry, with ambitious goals to advance its integrated circuit (IC) production and bolster domestic chip manufacturing. The country boasts a thriving semiconductor ecosystem, encompassing foundries, packaging equipment, and research institutions. The Chinese government is actively supporting this growth, with initiatives including an estimated US$150 billion investment from 2014 to 2030, as noted by the SIA. These substantial government efforts to enhance semiconductor production are expected to significantly benefit the semiconductor packaging market.

Some of the major players covered in this report include ASE , Amkor Technology, Powertech Technology Inc., Fujitsu Semiconductor Limited, ChipMOS Technologies Inc., Intel Corporation, Samsung Electronics Co., Ltd., Unisem (M) Berhad, among others.

Key Benefits of this Report:

  • Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
  • Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
  • Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
  • Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
  • Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

  • Historical data from 2022 to 2024 & forecast data from 2025 to 2030
  • Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
  • Competitive Positioning, Strategies, and Market Share Analysis
  • Revenue Growth and Forecast Assessment of segments and regions including countries
  • Company Profiling (Strategies, Products, Financial Information, and Key Developments among others)

The Semiconductor Packaging Market is segmented and analyzed as follows:

By Material Type

  • Organic Substrate
  • Bonding Wire
  • Ceramic Package
  • Others
  • Packaging Type
  • Advanced Packaging
  • Flip Chip
  • Embedded Die
  • Fan-Out Level Packaging (FO-WLP)
  • Fan-In Level Packaging (FI-WLP)

By Packaging Material

  • Organic Substrate
  • Leadframe
  • Ceramic Packaging
  • Bonding-Wire
  • Others

By End-User

  • Consumer Electronics
  • Aerospace and Defence
  • Medical Devices
  • Communication and Telecom
  • Others

By Geography

  • North America
  • United States
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • United Kingdom
  • Germany
  • France
  • Italy
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • UAE
  • Others
  • Asia Pacific
  • China
  • India
  • Japan
  • South Korea
  • Thailand
  • Indonesia
  • Others

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Market Overview
  • 1.2. Market Definition
  • 1.3. Scope of the Study
  • 1.4. Market Segmentation
  • 1.5. Currency
  • 1.6. Assumptions
  • 1.7. Base and Forecast Years Timeline
  • 1.8. Key benefits for the stakeholders

2. RESEARCH METHODOLOGY

  • 2.1. Research Design
  • 2.2. Research Process

3. EXECUTIVE SUMMARY

  • 3.1. Key Findings
  • 3.2. Analyst View

4. MARKET DYNAMICS

  • 4.1. Market Drivers
  • 4.2. Market Restraints
  • 4.3. Porter's Five Forces Analysis
    • 4.3.1. Bargaining Power of Suppliers
    • 4.3.2. Bargaining Power of Buyers
    • 4.3.3. The Threat of New Entrants
    • 4.3.4. Threat of Substitutes
    • 4.3.5. Competitive Rivalry in the Industry
  • 4.4. Industry Value Chain Analysis

5. SEMICONDUCTOR PACKAGING MARKET BY MATERIAL TYPE

  • 5.1. Introduction
  • 5.2. Organic Substrate
  • 5.3. Bonding Wire
  • 5.4. Ceramic Package
  • 5.5. Others

6. SEMICONDUCTOR PACKAGING MARKET BY PACKAGING TYPE

  • 6.1. Introduction
  • 6.2. Advanced Packaging
  • 6.3. Flip Chip
  • 6.4. Embedded Die
  • 6.5. Fan-Out Level Packaging (FO-WLP)
  • 6.6. Fan-In Level Packaging (FI-WLP)

7. SEMICONDUCTOR PACKAGING MARKET BY PACKAGING MATERIAL

  • 7.1. Introduction
  • 7.2. Organic Substrate
  • 7.3. Leadframe
  • 7.4. Ceramic Packaging
  • 7.5. Bonding-Wire
  • 7.6. Others

8. SEMICONDUCTOR PACKAGING MARKET BY END-USER

  • 8.1. Introduction
  • 8.2. Consumer Electronics
  • 8.3. Aerospace and Defence
  • 8.4. Medical Devices
  • 8.5. Communication and Telecom
  • 8.6. Others

9. SEMICONDUCTOR PACKAGING MARKET BY GEOGRAPHY

  • 9.1. Global Overview
  • 9.2. North America
    • 9.2.1. United States
    • 9.2.2. Canada
    • 9.2.3. Mexico
  • 9.3. South America
    • 9.3.1. Brazil
    • 9.3.2. Argentina
    • 9.3.3. Others
  • 9.4. Europe
    • 9.4.1. United Kingdom
    • 9.4.2. Germany
    • 9.4.3. France
    • 9.4.4. Italy
    • 9.4.5. Others
  • 9.5. Middle East and Africa
    • 9.5.1. Saudi Arabia
    • 9.5.2. UAE
    • 9.5.3. Others
  • 9.6. Asia-Pacific
    • 9.6.1. China
    • 9.6.2. India
    • 9.6.3. Japan
    • 9.6.4. South Korea
    • 9.6.5. Thailand
    • 9.6.6. Indonesia
    • 9.6.7. Others

10. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 10.1. Major Players and Strategy Analysis
  • 10.2. Market Share Analysis
  • 10.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 10.4. Competitive Dashboard

11. COMPANY PROFILES

  • 11.1. ASE
  • 11.2. Amkor Technology
  • 11.3. Powertech Technology Inc.
  • 11.4. Fujitsu Semiconductor Limited
  • 11.5. ChipMOS Technologies Inc.
  • 11.6. Intel Corporation
  • 11.7. Samsung Electronics Co., Ltd.
  • 11.8. Unisem (M) Berhad
  • 11.9. ISI - Interconnect Systems
  • 11.10. Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET)