查看购物车
  • Traditional Chinese
  • English
  • Japanese
  • Korean
封面
市场调查报告书
商品编码
1878107

半导体製造设备市场－2025年至2030年预测

Semiconductor Manufacturing Equipment Market - Forecasts from 2025 to 2030
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 112 Pages | 商品交期: 最快1-2个工作天内

价格
简介目录

预计半导体製造设备市场将从 2025 年的 1,255.4 亿美元成长到 2030 年的 2,104.1 亿美元，复合年增长率为 10.88%。

半导体製造设备产业正处于关键时刻，面临需求激增和营运瓶颈并存的双重挑战。人工智慧 (AI)、5G 基础设施和高效能运算 (HPC) 的快速发展推动了对先进半导体的需求不断增长，进而引发了全球对新建製造工厂 (晶圆厂) 的资本投资热潮。这一增长对微影术、蚀刻、沉积、计量和测试设备的供应商提出了前所未有的要求，同时也带来了供应链脆弱性、日益复杂的技术以及不断加剧的地缘政治摩擦等挑战。

主要市场成长驱动因素

市场由多项相互关联的技术变革所驱动。人工智慧的日益融合推动了对先进沉积和蚀刻设备的需求，因为晶片製造商正转向更小的製程节点以处理神经网路处理的大量数据。这需要能够以原子级精度沉积超薄膜的设备。同时，5G基础设施的全球扩张推动了对微影术设备的需求。基地台需要具有卓越频率响应特性的晶片，这就要求更精细的图形化和更高的晶圆吞吐量。第三个主要驱动因素是汽车电气化，加速了计量和测试设备的应用。电动车需要可靠、无缺陷的半导体和功率模组，这推动了对先进后处理检测和检验设备的需求，以确保其可靠性和性能。

重大挑战与供应链限制因素

行业成长正受到一系列复杂挑战的限制。地缘政治紧张局势导致某些地区对先进设备出口实施限制，限制了关键供应商的市场进入，并可能延长依赖全球供应链的非监管晶圆厂的前置作业时间。此外，精密工程领域人才严重短缺阻碍了无尘室自动化的推广，可能延缓设备的检验和部署。永续性法规也带来了日益增长的压力，特别是超纯水等资源的消耗以及特种化学废弃物的管理，这增加了营运成本和合规要求。

设备供应链本身就面临巨大的压力。它依赖某些特殊原料，例如特定的合金和光阻剂聚合物，而这些原料极易受到价格波动和采购瓶颈的影响，而采购瓶颈又是由生产集中度和地缘政治因素造成的。这些依赖性造成了脆弱性，单一供应商的断供都可能导致全球晶圆厂产运作的严重中断。从港口拥挤到国际贸易关税等一系列物流挑战，进一步加剧了这些高度复杂且精密设备的及时交付难度。

政府法规

世界各国政府的政策正积极塑造市场格局。例如，美国的《晶片与科学法案》和欧洲的《晶片法案》等倡议，为国内半导体製造能力注入了大量资金，直接推动了这些地区对先进设备的需求。然而，这些政策往往包含有利于本地供应商的条款，并实施出口限制，导致全球市场分散化。作为回应，其他国家也实施了旨在发展本国设备产业的补贴计画和进口限制措施，在削弱现有全球供应商市场份额的同时，也创造了新的、受保护的国内市场。

市场区隔分析

在设备市场，微影术产业仍然主导着前端采购。受人工智慧处理器和高效能逻辑晶片需求的驱动，向极紫外线（EUV）光刻微影术的过渡对于尖端製程节点的图形化至关重要。该领域占设备总支出的大部分，并且是实现过程节点持续缩小的核心。

同时，测试设备领域正迅速崛起，成为关键成长点，尤其是在后端领域。随着异质整合和3D封装技术的兴起，产量比率和可靠性变得日益重要，而这些技术对于先进的人工智慧和高效能运算模组至关重要。这推动了对先进测试和测量工具的大量投资，这些工具能够检验复杂的多晶粒组件和功率装置，应用于电动车等领域。

竞争环境

竞争格局由一群专业化的全球性公司主导，每家公司都有独特的优势。 ASML Holdings NV 在重要的极微影术(EUV) 市场中占据绝对主导地位。 Applied Materials 和 LAM Research 等公司提供涵盖沉积、蚀刻和其他关键製程工具的广泛产品组合。其他主要企业，例如东京电子和泰瑞达，分别在晶圆製造系统和后端测试设备等特定领域拥有强大的实力。这些公司面临的策略挑战在于，如何在抓住持续技术进步带来的成长机会的同时，降低供应链中断和日益复杂的地缘政治法规环境所带来的风险。

本报告的主要优势：

  • 深入分析：获取主要和新兴地区的深入市场洞察，重点关注客户群、政府政策和社会经济因素、消费者偏好、垂直行业和其他细分市场。
  • 竞争格局：了解全球主要企业的策略倡议，并了解透过正确的策略实现市场渗透的潜力。
  • 市场驱动因素与未来趋势：探索推动市场的动态因素和关键趋势，以及它们将如何塑造未来的市场发展。
  • 可操作的建议：利用这些见解，在快速变化的环境中製定策略决策，发展新的商业机会和收入来源。
  • 受众广泛：适用于Start-Ups、研究机构、顾问公司、中小企业和大型企业，且经济实惠。

企业使用我们的报告的目的是什么？

产业与市场分析、机会评估、产品需求预测、打入市场策略、地理扩张、资本投资决策、法规结构及影响、新产品开发、竞争情报

报告范围：

  • 2022年至2024年的历史数据和2025年至2030年的预测数据
  • 成长机会、挑战、供应链前景、法规结构与趋势分析
  • 竞争定位、策略和市场占有率分析
  • 按业务板块和地区分類的收入成长和预测评估，包括国家/地区
  • 公司概况（策略、产品、财务资讯、关键发展等）

半导体製造设备市场区隔：

  • 按前端设备：
  • 水面处理设备
  • 清洁过程
  • 其他的
  • 透过后端设备
  • 组装和包装
  • 黏合设备
  • 切丁设备
  • 测试设备
  • 测量设备
  • 按尺寸
  • 2D
  • 3D
  • 透过製造工厂
  • 自动化
  • 化学控制设备
  • 瓦斯控制设备
  • 其他的
  • 按地区
  • 美洲
  • 美国
  • 其他的
  • 欧洲、中东和非洲
  • 德国
  • 英国
  • 荷兰
  • 其他的
  • 亚太地区
  • 中国
  • 日本
  • 韩国
  • 印度
  • 其他的

目录

第一章执行摘要

第二章 市场概览

  • 市场概览
  • 市场定义
  • 调查范围

第二章 4. 市场区隔

第三章 商业情境

  • 市场驱动因素
  • 市场限制
  • 市场机会
  • 波特五力分析
  • 产业价值链分析
  • 政策与法规
  • 策略建议

第四章 技术展望

第五章 半导体製造设备市场（依前端设备划分）

  • 介绍
  • 水处理设备
  • 清洁过程
  • 其他的

第六章 半导体製造设备市场（依后端设备划分）

  • 介绍
  • 组装和包装
  • 黏合设备
  • 切丁设备
  • 测试设备
  • 测量设备

第七章 半导体製造设备市场（依尺寸划分）

  • 介绍
  • 2D
  • 3D

第八章 半导体製造设备市场（依製造工厂划分）

  • 介绍
  • 自动化
  • 化学控制设备
  • 瓦斯控制设备
  • 其他的

第九章 半导体製造设备市场（按地区划分）

  • 介绍
  • 美洲
    • 美国
    • 其他的
  • 欧洲、中东和非洲
    • 德国
    • 英国
    • 荷兰
    • 其他的
  • 亚太地区
    • 中国
    • 日本
    • 韩国
    • 印度
    • 其他的

第十章 竞争格局与分析

  • 主要企业和策略分析
  • 市占率分析
  • 合併、收购、协议和合作
  • 竞争对手仪錶板

第十一章：公司简介

  • Tokyo Seimitsu Co., Ltd.
  • Kokusai Electric Corporation
  • Terra Universal
  • Modutek Corporation
  • Hitachi High-Technologies Corporation
  • LAM Research Corporation
  • Applied Materials, Inc.
  • ASML Holdings NV
  • Tokyo Electron Limited
  • Teradyne, Inc.

第十二章附录

  • 货币
  • 先决条件
  • 基准年和预测年时间表
  • 相关人员的主要收益
  • 调查方法
  • 简称
简介目录
Product Code: KSI061611948

Semiconductor Manufacturing Equipment Market, with a 10.88% CAGR, is anticipated to reach USD 210.401 billion in 2030 from USD 125.540 billion in 2025.

The semiconductor manufacturing equipment industry is at a pivotal juncture, characterized by intense demand and significant operational constraints. Escalating requirements for advanced semiconductors, driven by the proliferation of Artificial Intelligence (AI), 5G infrastructure, and high-performance computing (HPC), are triggering a global wave of capital expenditure in new fabrication facilities (fabs). This surge places unprecedented demands on suppliers of lithography, etch, deposition, metrology, and test tools, who are simultaneously challenged by supply chain fragility, escalating technological complexity, and increasing geopolitical friction.

Primary Market Growth Drivers

The market is propelled by several interconnected technological shifts. The rising integration of AI is propelling demand for advanced deposition and etching equipment, as chipmakers scale to increasingly minute nodes to handle massive data throughput in neural networks. This necessitates tools capable of depositing ultra-thin films with atomic-level precision. Concurrently, the global expansion of 5G infrastructure is catalyzing acquisitions of lithography tools, as base stations require chips with superior frequency response, driving the need for finer patterning and higher wafer throughput. A third major driver is automotive electrification, which is accelerating the uptake of metrology and testing equipment. Electric vehicles require robust, defect-free semiconductors and power modules, boosting demand for sophisticated back-end inspection and validation tools to ensure reliability and performance.

Critical Challenges and Supply Chain Constraints

The industry's growth is tempered by a complex set of challenges. Geopolitical tensions are manifesting as export controls on advanced tools to certain regions, which constrains market access for major suppliers and can elongate lead times for non-restricted fabs reliant on the global supply chain. Furthermore, a significant talent shortage in precision engineering is impeding the scaling of cleanroom automation, leading to potential delays in equipment validation and deployment. Sustainability mandates are also applying pressure, particularly concerning the intensive consumption of resources like ultrapure water and the management of specialized chemical waste, driving up operational costs and compliance requirements.

The equipment supply chain itself is under considerable stress. It relies on specialized raw materials, including certain alloys and photoresist polymers, which are vulnerable to price volatility and sourcing bottlenecks due to concentrated production and geopolitical factors. These dependencies create vulnerabilities, where a disruption at a single supplier can idle significant global fab capacity. Logistical strains, from port congestion to international trade tariffs, further complicate the timely delivery of these highly complex and sensitive tools.

Government Regulatory Landscape

Government policies worldwide are actively shaping the market. Initiatives like the U.S. CHIPS and Science Act and the European Chips Act are injecting substantial funding to bolster domestic semiconductor manufacturing capacity, directly driving demand for advanced equipment within these regions. Conversely, such policies often include provisions that prioritize local suppliers or impose export controls, creating a fragmented global market. In response, other nations are implementing their own subsidy programs and import restrictions to foster indigenous equipment industries, which simultaneously erodes the market share of established global suppliers while creating new, protected domestic markets.

Market Segment Analysis

Within the equipment landscape, the lithography segment continues to dominate front-end procurement. The industry's transition to Extreme Ultraviolet (EUV) lithography is critical for patterning at the most advanced nodes, driven by the demands of AI processors and other high-performance logic chips. This segment commands a significant portion of total equipment spend and is central to enabling continued node scaling.

Simultaneously, the testing equipment segment is emerging as a critical growth area, particularly in the back-end. The rise of heterogeneous integration and 3D packaging, essential for advanced AI and HPC modules, places a premium on ensuring yield and reliability. This is driving substantial investment in sophisticated testing and metrology tools to validate complex multi-die assemblies and power devices for applications like electric vehicles.

Competitive Environment

The competitive landscape is dominated by a group of specialized global players, each with distinct strengths. ASML Holdings N.V. maintains a unique, dominant position in the critical EUV lithography market. Companies like Applied Materials, Inc. and LAM Research Corporation offer broad portfolios across deposition, etch, and other critical process tools. Other significant players, including Tokyo Electron and Teradyne, Inc., hold strong positions in specific domains such as wafer fabrication systems and back-end test equipment, respectively. The strategic imperative for these firms is to navigate the dual challenges of capturing growth from relentless technological advancement while mitigating risks associated with supply chain disruptions and an increasingly complex geopolitical regulatory environment.

Key Benefits of this Report:

  • Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
  • Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
  • Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
  • Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
  • Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

  • Historical data from 2022 to 2024 & forecast data from 2025 to 2030
  • Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
  • Competitive Positioning, Strategies, and Market Share Analysis
  • Revenue Growth and Forecast Assessment of segments and regions including countries
  • Company Profiling (Strategies, Products, Financial Information, and Key Developments among others.

Semiconductor Manufacturing Equipment Market Segmentation:

  • BY FRONT END EQUIPMENT:
  • Water Surface Conditioning Equipment
  • Cleaning Process
  • Others
  • BY BACK END EQUIPMENT
  • Assembling and Packaging
  • Bonding Equipment
  • Dicing Equipment
  • Testing Equipment
  • Metrology Equipment
  • BY DIMENSION
  • 2D
  • 3D
  • BY FAB FACILITY
  • Automation
  • Chemical Control Equipment
  • Gas Control Equipment
  • Others
  • BY GEOGRAPHY
  • Americas
  • United States
  • Others
  • Europe, the Middle East, and Africa
  • Germany
  • United Kingdom
  • Netherlands
  • Others
  • Asia Pacific
  • China
  • Japan
  • South Korea
  • India
  • Others

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

  • 2.1. Market Overview
  • 2.2. Market Definition
  • 2.3. Scope of the Study

2.4. Market Segmentation

3. BUSINESS LANDSCAPE

  • 3.1. Market Drivers
  • 3.2. Market Restraints
  • 3.3. Market Opportunities
  • 3.4. Porter's Five Forces Analysis
  • 3.5. Industry Value Chain Analysis
  • 3.6. Policies and Regulations
  • 3.7. Strategic Recommendations

4. TECHNOLOGICAL OUTLOOK

5. SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET BY FRONT-END EQUIPMENT

  • 5.1. Introduction
  • 5.2. Water Surface Conditioning Equipment
  • 5.3. Cleaning Process
  • 5.4. Others

6. SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET BY BACK-END EQUIPMENT

  • 6.1. Introduction
  • 6.2. Assembling and Packaging
  • 6.3. Bonding Equipment
  • 6.4. Dicing Equipment
  • 6.5. Testing Equipment
  • 6.6. Metrology Equipment

7. SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET BY DIMENSION

  • 7.1. Introduction
  • 7.2. 2D
  • 7.3. 3D

8. SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET BY FAB FACILITY

  • 8.1. Introduction
  • 8.2. Automation
  • 8.3. Chemical Control Equipment
  • 8.4. Gas Control Equipment
  • 8.5. Others

9. SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET BY GEOGRAPHY

  • 9.1. Introduction
  • 9.2. Americas
    • 9.2.1. United States
    • 9.2.2. Others
  • 9.3. Europe, the Middle East, and Africa
    • 9.3.1. Germany
    • 9.3.2. United Kingdom
    • 9.3.3. Netherlands
    • 9.3.4. Others
  • 9.4. Asia Pacific
    • 9.4.1. China
    • 9.4.2. Japan
    • 9.4.3. South Korea
    • 9.4.4. India
    • 9.4.5. Others

10. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 10.1. Major Players and Strategy Analysis
  • 10.2. Market Share Analysis
  • 10.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 10.4. Competitive Dashboard

11. COMPANY PROFILES

  • 11.1. Tokyo Seimitsu Co., Ltd.
  • 11.2. Kokusai Electric Corporation
  • 11.3. Terra Universal
  • 11.4. Modutek Corporation
  • 11.5. Hitachi High-Technologies Corporation
  • 11.6. LAM Research Corporation
  • 11.7. Applied Materials, Inc.
  • 11.8. ASML Holdings N.V
  • 11.9. Tokyo Electron Limited
  • 11.10. Teradyne, Inc.

12. APPENDIX

  • 12.1. Currency
  • 12.2. Assumptions
  • 12.3. Base and Forecast Years Timeline
  • 12.4. Key Benefits for the Stakeholders
  • 12.5. Research Methodology
  • 12.6. Abbreviations