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2025年全球半导体后端设备市场报告

Semiconductor Back-End Equipment Global Market Report 2025
出版日期: | 出版商: The Business Research Company | 英文 250 Pages | 商品交期: 2-10个工作天内

价格
简介目录

近年来，半导体后端设备市场经历了显着成长，预计将从2024年的198.8亿美元成长到2025年的216.5亿美元，复合年增长率为8.9%。过去的成长可归因于行动装置的日益普及、汽车电子产品产量的增加、通讯基础设施的扩展、对高效能运算日益增长的需求以及对工业自动化日益增长的需求。

预计未来几年半导体后端设备市场将维持强劲成长，2029年市场规模将达到301.9亿美元，复合年增长率（CAGR）为8.7%。预测期内的成长预计将受到人工智慧（AI）应用日益普及、5G网路部署不断扩大、电动车（EV）需求不断增长、资料中心容量不断扩大以及物联网（IoT）设备广泛应用等因素的推动。预测期内的关键趋势包括晶圆级封装技术的进步、自动化光学检测系统的开发、高通量组装设备的投资、温度控管解决方案的创新以及真空拾放自动化技术的进步。

预计未来几年，人们对电动车 (EV) 的兴趣日益浓厚，将推动半导体后端设备市场的扩张。电动车由可充电电池储存的电能驱动，并使用电动马达而非传统的燃油引擎进行推进。日益增长的环境问题促使人们更加重视电动车，电动车透过减少温室气体排放和降低对石化燃料的依赖，有助于实现全球永续性目标。半导体后端设备在电动车生产中发挥着至关重要的作用，它支援先进功率晶片的製造，这些晶片能够提高能源效率、优化电池性能并增强整车可靠性。例如，根据美国政府机构能源与交通联合办公室 (JOET) 于 2024 年 11 月发布的报告，预计美国插电式电动车的销量占汽车总销量的比例将从 2022 年的 6.8% 增长到 2023 年的 9.4%。因此，电动车的日益普及正在推动半导体后端设备市场的成长。

半导体后端设备市场的主要企业正致力于开发混合键合系统等先进技术，以提升性能、提高能源效率并实现3D整合。混合键结系统无需焊料凸块，即可利用金属-介质界面直接键合晶粒或晶圆，从而实现超细间距和卓越的电气及热性能。例如，2024年5月，总部位于荷兰的半导体组装设备製造商BE Semiconductor Industries NV从一家大型半导体逻辑製造商获得26套混合键结系统的订单。该产品实现了100奈米的高精度贴片，超越了传统键合系统。它支援先进的晶圆间和晶片晶粒键合，适用于大批量生产。对混合键合技术的日益关注反映了半导体产业正在寻求解决方案，以满足下一代元件对性能、密度和效率不断增长的需求。

目录

第一章执行摘要

第二章 市场特征

第三章 市场趋势与策略

第四章 市场：宏观经济情景，包括利率、通货膨胀、地缘政治、贸易战和关税，以及新冠疫情及其復苏对市场的影响

第五章 全球成长分析与策略分析框架

  • 全球半导体后端设备：PESTEL 分析（政治、社会、技术、环境、法律因素、驱动因素和限制因素）
  • 终端用户产业分析
  • 全球半导体后端设备市场：成长率分析
  • 全球半导体后端设备市场表现：规模与成长，2019-2024年
  • 全球半导体后端设备市场预测：规模与成长，2024-2029年，2034年预测
  • 全球半导体后端设备：潜在市场规模 (TAM)

第六章 市场细分

  • 全球半导体后端设备市场：依设备、性能及预测划分，2019-2024年、2024-2029年预测、2034年预测
  • 晶粒黏合设备
  • 焊线设备
  • 包装设备
  • 测试设备
  • 全球半导体后端设备市场依製程阶段、性能及预测划分，2019-2024年、2024-2029年预测、2034年预测
  • 晶圆级加工
  • 晶片级处理
  • 最终测试和包装
  • 组装
  • 其他工艺步骤
  • 全球半导体后端设备市场：按应用、性能和预测划分，2019-2024年、2024-2029年预测、2034年预测
  • 家用电子电器
  • 汽车电子
  • 电讯
  • 资料处理
  • 工业应用
  • 全球半导体后端设备市场：依终端用户产业划分，结果及预测，2019-2024年、2024-2029年预测、2034年预测
  • 半导体製造商
  • 原始设备製造商 (OEM)
  • 製造厂（fab）
  • 研究与发展研究所
  • 其他终端用户产业
  • 全球半导体后端设备市场：晶片键合设备晶粒，按类型、性能和预测（2019-2024年、2024-2029年预测、2034年预测）
  • 热压晶片晶粒合
  • 共晶晶片晶粒合
  • 瞬态液相键结（TLP键结）
  • 覆晶合
  • 黏合剂晶粒
  • 全球半导体后端设备市场：细分市场－引线焊线设备，依类型、效能与预测（2019-2024年、2024-2029年预测、2034年预测）
  • 球键合
  • 楔形黏合
  • 环形回路系统
  • 带状黏合
  • 全球半导体后端设备市场：依封装设备、类型、效能与预测细分，2019-2024年、2024-2029年预测、2034年预测
  • 成型设备
  • 封装装置
  • 导线架加工设备
  • 修整成型装置
  • 晶圆层次电子构装（WLP）设备
  • 全球半导体后端设备市场：按测试设备、类型、性能和预测进行细分，2019-2024年、2024-2029年预测、2034年预测
  • 最终测试设备
  • 在线连续测试设备
  • 老化测试设备
  • 自动测试设备（ATE）

第七章 区域和国家分析

  • 全球半导体后端设备市场：依地区划分，结果及预测，2019-2024年、2024-2029年预测、2034年预测
  • 全球半导体后端设备市场：依国家划分，结果及预测，2019-2024 年、2024-2029 年预测、2034 年预测

第八章 亚太市场

第九章：中国市场

第十章 印度市场

第十一章 日本市场

第十二章：澳洲市场

第十三章 印尼市场

第十四章 韩国市场

第十五章 西欧市场

第十六章英国市场

第十七章：德国市场

第十八章：法国市场

第十九章：义大利市场

第二十章：西班牙市场

第21章 东欧市场

第22章：俄罗斯市场

第23章 北美市场

第24章美国市场

第25章：加拿大市场

第26章 南美洲市场

第27章：巴西市场

第28章 中东市场

第29章：非洲市场

第三十章：竞争格局与公司概况

  • 半导体后端设备市场：竞争格局
  • 半导体后端设备市场：公司概况
    • ASE Group Overview, Products and Services, Strategy and Financial Analysis
    • Toray Engineering Co. Ltd. Overview, Products and Services, Strategy and Financial Analysis
    • Yamaha Robotics Holdings Co. Ltd. Overview, Products and Services, Strategy and Financial Analysis
    • Micron Technology Inc. Overview, Products and Services, Strategy and Financial Analysis
    • Applied Materials Inc. Overview, Products and Services, Strategy and Financial Analysis

第31章：其他领先和创新企业

  • Advantest Corp.
  • ASM International
  • Teradyne Inc.
  • Nordson Corporation
  • KLA Corp.
  • Disco Corporation
  • Advanced Micro-Fabrication Equipment Inc.
  • Onto Innovation Inc.
  • FormFactor
  • Cohu Inc.
  • SUSS MicroTec SE
  • TOWA Corp.
  • EV Group Inc.
  • Kulicke & Soffa Industries Inc.
  • Screen Holdings Company Limited

第32章 全球市场竞争基准化分析与仪錶板

第33章 重大併购

第34章 近期市场趋势

第35章：高潜力市场国家、细分市场与策略

  • 2029年半导体后端设备市场：蕴藏新机会的国家
  • 2029年半导体后端设备市场：新兴细分市场机会
  • 2029年半导体后端设备市场：成长策略
    • 基于市场趋势的策略
    • 竞争对手策略

第36章附录

简介目录
Product Code: r38997

Semiconductor back-end equipment refers to the machinery and tools used in the later stages of semiconductor manufacturing, where fabricated wafers undergo assembly, packaging, and testing processes. This equipment is essential for transforming processed wafers into finished semiconductor devices by ensuring precision, reliability, and consistent performance.

The primary types of semiconductor back-end equipment include die bonding equipment, wire bonding equipment, packaging equipment, and testing equipment. Die bonding equipment consists of machines that attach semiconductor dies or chips onto substrates, packages, or carriers with high precision. These tools cover various process stages, such as wafer-level processing, chip-level processing, final testing and packaging, assembly, and more. They are applied across sectors including consumer electronics, automotive electronics, telecommunications, data processing, and industrial applications, and are used by end-users such as semiconductor manufacturers, original equipment manufacturers (OEMs), fabrication plants (fabs), research and development institutions, and others.

Note that the outlook for this market is being affected by rapid changes in trade relations and tariffs globally. The report will be updated prior to delivery to reflect the latest status, including revised forecasts and quantified impact analysis. The report's Recommendations and Conclusions sections will be updated to give strategies for entities dealing with the fast-moving international environment.

The rapid rise in U.S. tariffs and the subsequent trade frictions in spring 2025 are having a major impact on the electrical and electronics sector, with semiconductors, display panels, and rare-earth metals (essential for batteries and motors) subject to steep duties. Consumer electronics brands face profit erosion, as competitive markets limit their ability to pass costs to buyers. Industrial electronics manufacturers, meanwhile, grapple with delayed projects due to shortages of tariff-impacted components like printed circuit boards. Companies are responding by relocating assembly to tariff-exempt countries, increasing inventory buffers, and redesigning products to reduce dependency on restricted materials.

The semiconductor back-end equipment market research report is one of a series of new reports from The Business Research Company that provides semiconductor back-end equipment market statistics, including semiconductor back-end equipment industry global market size, regional shares, competitors with a semiconductor back-end equipment market share, detailed semiconductor back-end equipment market segments, market trends and opportunities, and any further data you may need to thrive in the semiconductor back-end equipment industry. This semiconductor back-end equipment market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.

The semiconductor back-end equipment market size has grown strongly in recent years. It will grow from $19.88 billion in 2024 to $21.65 billion in 2025 at a compound annual growth rate (CAGR) of 8.9%. The growth during the historic period can be linked to the rising adoption of mobile devices, increasing production of automotive electronics, expansion of telecommunications infrastructure, growing demand for high-performance computing, and rising requirements for industrial automation.

The semiconductor back-end equipment market size is expected to see strong growth in the next few years. It will grow to $30.19 billion in 2029 at a compound annual growth rate (CAGR) of 8.7%. The growth in the forecast period is expected to result from the growing adoption of artificial intelligence applications, increased deployment of 5G networks, rising demand for electric vehicles, expansion of data center capacities, and broader use of Internet of Things (IoT) devices. Key trends in the forecast period include advancements in wafer-level packaging, development of automated optical inspection systems, investment in high-throughput assembly equipment, innovations in thermal management solutions, and progress in vacuum pick-and-place automation.

The growing focus on electric vehicles (EVs) is expected to drive the expansion of the semiconductor back-end equipment market in the coming years. EVs are powered by electricity stored in rechargeable batteries and use electric motors for propulsion instead of traditional fuel-based engines. The increasing emphasis on EVs is driven by rising environmental concerns, as they help reduce greenhouse gas emissions and dependency on fossil fuels, supporting global sustainability goals. Semiconductor back-end equipment plays a critical role in EV production by supporting the manufacturing of advanced power chips that enhance energy efficiency, optimize battery performance, and improve overall vehicle reliability. For example, in November 2024, the Joint Office of Energy and Transportation, a US-based government agency, reported that plug-in electric vehicle sales in the US grew from 6.8% of total vehicle sales in 2022 to 9.4% in 2023. As a result, the rising adoption of electric vehicles is driving the growth of the semiconductor back-end equipment market.

Leading companies in the semiconductor back-end equipment market are focusing on developing advanced technologies, such as hybrid bonding systems, to improve performance, power efficiency, and enable 3D integration. A hybrid bonding system allows for the direct bonding of dies or wafers using metal and dielectric interfaces without the need for solder bumps, providing ultra-fine pitch and superior electrical and thermal performance. For example, in May 2024, BE Semiconductor Industries N.V., a Netherlands-based semiconductor assembly equipment manufacturer, received an order for 26 Hybrid Bonding Systems from a leading semiconductor logic manufacturer. This product delivers high precision with 100 nm placement accuracy, surpassing conventional bonding systems. It supports advanced wafer-to-wafer and die-to-wafer bonding, making it suitable for high-volume manufacturing. This growing interest in hybrid bonding reflects the semiconductor industry's need for solutions to meet the increasing performance, density, and efficiency demands of next-generation devices.

In October 2023, Cohu Inc., a US-based provider of semiconductor test and inspection solutions, acquired Equiptest Engineering for an undisclosed amount. Through this acquisition, Cohu aims to expand its product portfolio of test contactors and consumables while strengthening its position in the global semiconductor back-end equipment market. Equiptest Engineering, a Singapore-based manufacturer, specializes in semiconductor back-end equipment.

Major players in the semiconductor back-end equipment market are ASE Group, Toray Engineering Co. Ltd., Yamaha Robotics Holdings Co. Ltd., Micron Technology Inc., Applied Materials Inc., Advantest Corp., ASM International, Teradyne Inc., Nordson Corporation, KLA Corp., Disco Corporation, Advanced Micro-Fabrication Equipment Inc., Onto Innovation Inc., FormFactor, Cohu Inc., SUSS MicroTec SE, TOWA Corp., EV Group Inc., Kulicke & Soffa Industries Inc., Screen Holdings Company Limited, Hanmi Semiconductor Company Limited, GL Tech Co. Ltd., Camtek Ltd., Synova LLC, Matsusada Precision Inc.

Asia-Pacific was the largest region in the semiconductor back-end equipment market in 2024. Asia-Pacific is expected to be the fastest-growing region in the forecast period. The regions covered in semiconductor back-end equipment report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East and Africa.

The countries covered in the semiconductor back-end equipment market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The semiconductor back-end equipment market consists of sales of molding equipment, metrology equipment, burn-in equipment, and final test handlers. Values in this market are 'factory gate' values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

Semiconductor Back-End Equipment Global Market Report 2025 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.

This report focuses on semiconductor back-end equipment market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.

Reasons to Purchase

  • Gain a truly global perspective with the most comprehensive report available on this market covering 15 geographies.
  • Assess the impact of key macro factors such as geopolitical conflicts, trade policies and tariffs, post-pandemic supply chain realignment, inflation and interest rate fluctuations, and evolving regulatory landscapes.
  • Create regional and country strategies on the basis of local data and analysis.
  • Identify growth segments for investment.
  • Outperform competitors using forecast data and the drivers and trends shaping the market.
  • Understand customers based on the latest market shares.
  • Benchmark performance against key competitors.
  • Suitable for supporting your internal and external presentations with reliable high quality data and analysis
  • Report will be updated with the latest data and delivered to you within 2-3 working days of order along with an Excel data sheet for easy data extraction and analysis.
  • All data from the report will also be delivered in an excel dashboard format.

Where is the largest and fastest growing market for semiconductor back-end equipment ? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward, including technological disruption, regulatory shifts, and changing consumer preferences? The semiconductor back-end equipment market global report from the Business Research Company answers all these questions and many more.

The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.

  • The market characteristics section of the report defines and explains the market.
  • The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
  • The forecasts are made after considering the major factors currently impacting the market. These include:

The forecasts are made after considering the major factors currently impacting the market. These include the technological advancements such as AI and automation, Russia-Ukraine war, trade tariffs (government-imposed import/export duties), elevated inflation and interest rates.

  • Market segmentations break down the market into sub markets.
  • The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth.
  • The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
  • The trends and strategies section analyses the shape of the market as it emerges from the crisis and suggests how companies can grow as the market recovers.

Scope

  • Markets Covered:1) By Equipment Type: Die Bonding Equipment; Wire Bonding Equipment; Packaging Equipment; Testing Equipment
  • 2) By Process Stage: Wafer Level Processing; Chip Level Processing; Final Test And Packaging; Assembly; Other Process Stages
  • 3) By Application: Consumer Electronics; Automotive Electronics; Telecommunications; Data Processing; Industrial Applications
  • 4) By End-User Industry: Semiconductor Manufacturers; Original Equipment Manufacturers (OEMs); Fabrication Plants (Fabs); Research And Development Institutions; Other End-User Industries
  • Subsegments:
  • 1) By Die Bonding Equipment: Thermo-Compression Die Bonding; Eutectic Die Bonding; Transient Liquid Phase (TLP) Bonding; Flip Chip Bonding; Adhesive Die Bonding
  • 2) By Wire Bonding Equipment: Ball Bonding; Wedge Bonding; Looping Systems; Ribbon Bonding
  • 3) By Packaging Equipment: Molding Equipment; Encapsulation Equipment; Lead Frame Processing Equipment; Trim And Form Equipment; Wafer-Level Packaging (WLP) Equipment
  • 4) By Testing Equipment: Final Test Equipment; In-Line Test Equipment; Burn-In Test Equipment; Automated Test Equipment (ATE)
  • Companies Mentioned: ASE Group; Toray Engineering Co. Ltd.; Yamaha Robotics Holdings Co. Ltd.; Micron Technology Inc.; Applied Materials Inc.; Advantest Corp.; ASM International; Teradyne Inc.; Nordson Corporation; KLA Corp.; Disco Corporation; Advanced Micro-Fabrication Equipment Inc.; Onto Innovation Inc.; FormFactor; Cohu Inc.; SUSS MicroTec SE; TOWA Corp.; EV Group Inc.; Kulicke & Soffa Industries Inc.; Screen Holdings Company Limited; Hanmi Semiconductor Company Limited; GL Tech Co. Ltd.; Camtek Ltd.; Synova LLC; Matsusada Precision Inc.
  • Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Russia; South Korea; UK; USA; Canada; Italy; Spain.
  • Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
  • Time Series: Five years historic and ten years forecast.
  • Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita,
  • Data Segmentations: country and regional historic and forecast data, market share of competitors, market segments.
  • Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
  • Delivery Format: PDF, Word and Excel Data Dashboard.

Table of Contents

1. Executive Summary

2. Semiconductor Back-End Equipment Market Characteristics

3. Semiconductor Back-End Equipment Market Trends And Strategies

4. Semiconductor Back-End Equipment Market - Macro Economic Scenario Including The Impact Of Interest Rates, Inflation, Geopolitics, Trade Wars and Tariffs, And Covid And Recovery On The Market

  • 4.1. Supply Chain Impact from Tariff War & Trade Protectionism

5. Global Semiconductor Back-End Equipment Growth Analysis And Strategic Analysis Framework

  • 5.1. Global Semiconductor Back-End Equipment PESTEL Analysis (Political, Social, Technological, Environmental and Legal Factors, Drivers and Restraints)
  • 5.2. Analysis Of End Use Industries
  • 5.3. Global Semiconductor Back-End Equipment Market Growth Rate Analysis
  • 5.4. Global Semiconductor Back-End Equipment Historic Market Size and Growth, 2019 - 2024, Value ($ Billion)
  • 5.5. Global Semiconductor Back-End Equipment Forecast Market Size and Growth, 2024 - 2029, 2034F, Value ($ Billion)
  • 5.6. Global Semiconductor Back-End Equipment Total Addressable Market (TAM)

6. Semiconductor Back-End Equipment Market Segmentation

  • 6.1. Global Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Die Bonding Equipment
  • Wire Bonding Equipment
  • Packaging Equipment
  • Testing Equipment
  • 6.2. Global Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Wafer Level Processing
  • Chip Level Processing
  • Final Test And Packaging
  • Assembly
  • Other Process Stages
  • 6.3. Global Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Consumer Electronics
  • Automotive Electronics
  • Telecommunications
  • Data Processing
  • Industrial Applications
  • 6.4. Global Semiconductor Back-End Equipment Market, Segmentation By End-User Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Semiconductor Manufacturers
  • Original Equipment Manufacturers (OEMs)
  • Fabrication Plants (Fabs)
  • Research And Development Institutions
  • Other End-User Industries
  • 6.5. Global Semiconductor Back-End Equipment Market, Sub-Segmentation Of Die Bonding Equipment, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Thermo-Compression Die Bonding
  • Eutectic Die Bonding
  • Transient Liquid Phase (TLP) Bonding
  • Flip Chip Bonding
  • Adhesive Die Bonding
  • 6.6. Global Semiconductor Back-End Equipment Market, Sub-Segmentation Of Wire Bonding Equipment, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Ball Bonding
  • Wedge Bonding
  • Looping Systems
  • Ribbon Bonding
  • 6.7. Global Semiconductor Back-End Equipment Market, Sub-Segmentation Of Packaging Equipment, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Molding Equipment
  • Encapsulation Equipment
  • Lead Frame Processing Equipment
  • Trim And Form Equipment
  • Wafer-Level Packaging (WLP) Equipment
  • 6.8. Global Semiconductor Back-End Equipment Market, Sub-Segmentation Of Testing Equipment, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • Final Test Equipment
  • In-Line Test Equipment
  • Burn-In Test Equipment
  • Automated Test Equipment (ATE)

7. Semiconductor Back-End Equipment Market Regional And Country Analysis

  • 7.1. Global Semiconductor Back-End Equipment Market, Split By Region, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 7.2. Global Semiconductor Back-End Equipment Market, Split By Country, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

8. Asia-Pacific Semiconductor Back-End Equipment Market

  • 8.1. Asia-Pacific Semiconductor Back-End Equipment Market Overview
  • Region Information, Market Information, Background Information, Government Initiatives, Regulations, Regulatory Bodies, Major Associations, Taxes Levied, Corporate Tax Structure, Investments, Major Companies
  • 8.2. Asia-Pacific Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 8.3. Asia-Pacific Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 8.4. Asia-Pacific Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

9. China Semiconductor Back-End Equipment Market

  • 9.1. China Semiconductor Back-End Equipment Market Overview
  • 9.2. China Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion
  • 9.3. China Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion
  • 9.4. China Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion

10. India Semiconductor Back-End Equipment Market

  • 10.1. India Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 10.2. India Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 10.3. India Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

11. Japan Semiconductor Back-End Equipment Market

  • 11.1. Japan Semiconductor Back-End Equipment Market Overview
  • 11.2. Japan Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 11.3. Japan Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 11.4. Japan Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

12. Australia Semiconductor Back-End Equipment Market

  • 12.1. Australia Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 12.2. Australia Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 12.3. Australia Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

13. Indonesia Semiconductor Back-End Equipment Market

  • 13.1. Indonesia Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 13.2. Indonesia Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 13.3. Indonesia Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

14. South Korea Semiconductor Back-End Equipment Market

  • 14.1. South Korea Semiconductor Back-End Equipment Market Overview
  • 14.2. South Korea Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 14.3. South Korea Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 14.4. South Korea Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

15. Western Europe Semiconductor Back-End Equipment Market

  • 15.1. Western Europe Semiconductor Back-End Equipment Market Overview
  • 15.2. Western Europe Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 15.3. Western Europe Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 15.4. Western Europe Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

16. UK Semiconductor Back-End Equipment Market

  • 16.1. UK Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 16.2. UK Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 16.3. UK Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

17. Germany Semiconductor Back-End Equipment Market

  • 17.1. Germany Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 17.2. Germany Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 17.3. Germany Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

18. France Semiconductor Back-End Equipment Market

  • 18.1. France Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 18.2. France Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 18.3. France Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

19. Italy Semiconductor Back-End Equipment Market

  • 19.1. Italy Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 19.2. Italy Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 19.3. Italy Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

20. Spain Semiconductor Back-End Equipment Market

  • 20.1. Spain Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 20.2. Spain Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 20.3. Spain Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

21. Eastern Europe Semiconductor Back-End Equipment Market

  • 21.1. Eastern Europe Semiconductor Back-End Equipment Market Overview
  • 21.2. Eastern Europe Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 21.3. Eastern Europe Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 21.4. Eastern Europe Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

22. Russia Semiconductor Back-End Equipment Market

  • 22.1. Russia Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 22.2. Russia Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 22.3. Russia Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

23. North America Semiconductor Back-End Equipment Market

  • 23.1. North America Semiconductor Back-End Equipment Market Overview
  • 23.2. North America Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 23.3. North America Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 23.4. North America Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

24. USA Semiconductor Back-End Equipment Market

  • 24.1. USA Semiconductor Back-End Equipment Market Overview
  • 24.2. USA Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 24.3. USA Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 24.4. USA Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

25. Canada Semiconductor Back-End Equipment Market

  • 25.1. Canada Semiconductor Back-End Equipment Market Overview
  • 25.2. Canada Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 25.3. Canada Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 25.4. Canada Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

26. South America Semiconductor Back-End Equipment Market

  • 26.1. South America Semiconductor Back-End Equipment Market Overview
  • 26.2. South America Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 26.3. South America Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 26.4. South America Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

27. Brazil Semiconductor Back-End Equipment Market

  • 27.1. Brazil Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 27.2. Brazil Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 27.3. Brazil Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

28. Middle East Semiconductor Back-End Equipment Market

  • 28.1. Middle East Semiconductor Back-End Equipment Market Overview
  • 28.2. Middle East Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 28.3. Middle East Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 28.4. Middle East Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

29. Africa Semiconductor Back-End Equipment Market

  • 29.1. Africa Semiconductor Back-End Equipment Market Overview
  • 29.2. Africa Semiconductor Back-End Equipment Market, Segmentation By Equipment Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 29.3. Africa Semiconductor Back-End Equipment Market, Segmentation By Process Stage, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
  • 29.4. Africa Semiconductor Back-End Equipment Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

30. Semiconductor Back-End Equipment Market Competitive Landscape And Company Profiles

  • 30.1. Semiconductor Back-End Equipment Market Competitive Landscape
  • 30.2. Semiconductor Back-End Equipment Market Company Profiles
    • 30.2.1. ASE Group Overview, Products and Services, Strategy and Financial Analysis
    • 30.2.2. Toray Engineering Co. Ltd. Overview, Products and Services, Strategy and Financial Analysis
    • 30.2.3. Yamaha Robotics Holdings Co. Ltd. Overview, Products and Services, Strategy and Financial Analysis
    • 30.2.4. Micron Technology Inc. Overview, Products and Services, Strategy and Financial Analysis
    • 30.2.5. Applied Materials Inc. Overview, Products and Services, Strategy and Financial Analysis

31. Semiconductor Back-End Equipment Market Other Major And Innovative Companies

  • 31.1. Advantest Corp.
  • 31.2. ASM International
  • 31.3. Teradyne Inc.
  • 31.4. Nordson Corporation
  • 31.5. KLA Corp.
  • 31.6. Disco Corporation
  • 31.7. Advanced Micro-Fabrication Equipment Inc.
  • 31.8. Onto Innovation Inc.
  • 31.9. FormFactor
  • 31.10. Cohu Inc.
  • 31.11. SUSS MicroTec SE
  • 31.12. TOWA Corp.
  • 31.13. EV Group Inc.
  • 31.14. Kulicke & Soffa Industries Inc.
  • 31.15. Screen Holdings Company Limited

32. Global Semiconductor Back-End Equipment Market Competitive Benchmarking And Dashboard

33. Key Mergers And Acquisitions In The Semiconductor Back-End Equipment Market

34. Recent Developments In The Semiconductor Back-End Equipment Market

35. Semiconductor Back-End Equipment Market High Potential Countries, Segments and Strategies

  • 35.1 Semiconductor Back-End Equipment Market In 2029 - Countries Offering Most New Opportunities
  • 35.2 Semiconductor Back-End Equipment Market In 2029 - Segments Offering Most New Opportunities
  • 35.3 Semiconductor Back-End Equipment Market In 2029 - Growth Strategies
    • 35.3.1 Market Trend Based Strategies
    • 35.3.2 Competitor Strategies

36. Appendix

  • 36.1. Abbreviations
  • 36.2. Currencies
  • 36.3. Historic And Forecast Inflation Rates
  • 36.4. Research Inquiries
  • 36.5. The Business Research Company
  • 36.6. Copyright And Disclaimer