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封面
市场调查报告书
商品编码
1905276

日本半导体製造设备市场报告（按设备类型、产品类型、尺寸、供应链参与者和地区划分，2026-2034年）

Japan Semiconductor Manufacturing Equipment Market Report by Equipment Type, Product Type, Dimension, Supply Chain Participant, and Region 2026-2034
出版日期: | 出版商: IMARC | 英文 116 Pages | 商品交期: 5-7个工作天内

价格
简介目录

2025年，日本半导体製造设备市场规模达70亿美元。展望未来， IMARC Group预计到2034年，该市场规模将达到152亿美元，2026年至2034年期间的复合年增长率（CAGR）为8.93%。装置小型化趋势的日益普及以及连网设备的广泛应用是推动市场成长的主要因素。

本报告解答的关键问题：

  • 日本半导体製造设备市场目前的表现如何？未来几年又将如何发展？
  • 新冠疫情对日本半导体製造设备市场产生了哪些影响？
  • 日本半导体製造设备市场依设备类型分類的组成是怎样的？
  • 日本半导体製造设备市场依产品类型分類的组成是怎样的？
  • 日本半导体製造设备市场依规模分類的组成是怎样的？
  • 日本半导体製造设备市场依供应链参与者分類的组成是怎样的？
  • 日本半导体製造设备市场价值链的各个阶段有哪些？
  • 日本半导体製造设备的关键驱动因素和挑战是什么？
  • 日本半导体製造设备市场的结构是怎么样的？主要参与者有哪些？
  • 日本半导体製造设备市场的竞争程度如何？

目录

第一章：序言

第二章：范围与方法

  • 研究目标
  • 利害关係人
  • 数据来源
  • 市场估算
  • 预测方法

第三章：执行概要

第四章：日本半导体製造设备市场－简介

  • 概述
  • 市场动态
  • 产业趋势
  • 竞争情报

第五章：日本半导体製造设备市场概况

  • 历史及当前市场趋势（2020-2025）
  • 市场预测（2026-2034）

第六章：日本半导体製造设备市场－依设备类型划分

  • 前端
  • 后端
  • 製造厂设备

第七章：日本半导体製造设备市场－依产品类型划分

  • 记忆
  • 逻辑元件
  • 微处理器
  • 类比元件
  • 光电元件
  • 离散组件
  • 其他的

第八章：日本半导体製造设备市场－依尺寸细分

  • QR 图
  • 2.5D
  • 3D

第九章：日本半导体製造设备市场－依供应链参与者划分

  • IDM公司
  • OSAT公司
  • 铸造厂

第十章：日本半导体製造设备市场－依地区划分

  • 关东地区
  • 关西/近畿地区
  • 中部/中部地区
  • 九州·冲绳地区
  • 东北部地区
  • 中国地区
  • 北海道地区
  • 四国地区

第十一章：日本半导体製造设备市场－竞争格局

  • 概述
  • 市场结构
  • 市场参与者定位
  • 最佳制胜策略
  • 竞争格局分析
  • 公司评估象限

第十二章：关键参与者简介

第十三章：日本半导体製造设备市场－产业分析

  • 驱动因素、限制因素和机会
  • 波特五力分析
  • 价值链分析

第十四章：附录

简介目录
Product Code: SR112026A18686

Japan semiconductor manufacturing equipment market size reached USD 7.0 Billion in 2025. Looking forward, IMARC Group expects the market to reach USD 15.2 Billion by 2034, exhibiting a growth rate (CAGR) of 8.93% during 2026-2034. The rising popularity of device miniaturization, along with the widespread adoption of connected devices, is primarily driving the market growth.

Semiconductor manufacturing equipment encompass the machinery employed in the production of a wide range of electronic components and integrated circuits (ICs). Among the commonly utilized devices are the front-end and back-end equipment. In addition to this, the front-end category comprises machines used in silicon-wafer fabrication, photolithography, deposition, etching, ion implantation, and mechanical polishing. In contrast, the back-end category involves machinery used in the assembly, packaging, and testing of integrated circuits. These machines offer numerous advantages, including streamlined production processes, enhanced yield and reliability, reduction in design and manufacturing errors, and improved workplace safety. Consequently, they have found widespread applications in the manufacturing of various products across industries such as automotive, electronics, robotics, etc.

Japan Semiconductor Manufacturing Equipment Market Trends:

The Japan market for semiconductor manufacturing equipment is primarily being propelled by the burgeoning electronics sector, given the widespread use of semiconductors in consumer electronics like smartphones, tablets, and laptops. Furthermore, the increasing demand for hybrid and electric vehicles (H/EVs) stands as another significant driver of growth. Besides this, these manufacturing equipment is instrumental in the assembly of multiple semiconductors onto a single chip, reducing electronic interference and enhancing the protection of electronic devices, which is positively influencing the regional market. Additionally, several key market players are introducing advanced product variations in a bid to broaden their customer base. This, combined with various technological advancements, such as the integration of artificial intelligence (AI) solutions and the incorporation of connected devices into the Internet of Things (IoT), is exerting a positive impact on market growth. Apart from this, manufacturers are employing silicon-based sensors in their manufacturing equipment. These sensors provide the ability to remotely monitor intricate circuit boards. Moreover, the emerging trend of device miniaturization and extensive research and development (R&D) activities are among the other factors expected to drive market growth in the forthcoming years in Japan.

Japan Semiconductor Manufacturing Equipment Market Segmentation:

Equipment Type Insights:

  • Front-End
    • Lithography
    • Deposition
    • Cleaning
    • Wafer Surface Conditioning
    • Others
  • Back-End
    • Testing
    • Assembly and Packaging
    • Dicing
    • Bonding
    • Metrology
    • Others
  • Fab Facility Equipment
    • Automation
    • Chemical Control
    • Gas Control
    • Others

Product Type Insights:

  • Memory
  • Logic Components
  • Microprocessor
  • Analog Components
  • Optoelectronic Components
  • Discrete Components
  • Others

Dimension Insights:

  • 2D
  • 2.5D
  • 3D

Supply Chain Participant Insights:

  • IDM Firms
  • OSAT Companies
  • Foundries

Regional Insights:

  • Kanto Region
  • Kansai/Kinki Region
  • Central/ Chubu Region
  • Kyushu-Okinawa Region
  • Tohoku Region
  • Chugoku Region
  • Hokkaido Region
  • Shikoku Region
  • The report has also provided a comprehensive analysis of all the major regional markets, which include Kanto Region, Kansai/Kinki Region, Central/ Chubu Region, Kyushu-Okinawa Region, Tohoku Region, Chugoku Region, Hokkaido Region, and Shikoku Region.

Competitive Landscape:

The market research report has also provided a comprehensive analysis of the competitive landscape in the market. Competitive analysis such as market structure, key player positioning, top winning strategies, competitive dashboard, and company evaluation quadrant has been covered in the report. Also, detailed profiles of all major companies have been provided.

Key Questions Answered in This Report:

  • How has the Japan semiconductor manufacturing equipment market performed so far and how will it perform in the coming years?
  • What has been the impact of COVID-19 on the Japan semiconductor manufacturing equipment market?
  • What is the breakup of the Japan semiconductor manufacturing equipment market on the basis of equipment type?
  • What is the breakup of the Japan semiconductor manufacturing equipment market on the basis of product type?
  • What is the breakup of the Japan semiconductor manufacturing equipment market on the basis of dimension?
  • What is the breakup of the Japan semiconductor manufacturing equipment market on the basis of supply chain participant?
  • What are the various stages in the value chain of the Japan semiconductor manufacturing equipment market?
  • What are the key driving factors and challenges in the Japan semiconductor manufacturing equipment?
  • What is the structure of the Japan semiconductor manufacturing equipment market and who are the key players?
  • What is the degree of competition in the Japan semiconductor manufacturing equipment market?

Table of Contents

1 Preface

2 Scope and Methodology

  • 2.1 Objectives of the Study
  • 2.2 Stakeholders
  • 2.3 Data Sources
    • 2.3.1 Primary Sources
    • 2.3.2 Secondary Sources
  • 2.4 Market Estimation
    • 2.4.1 Bottom-Up Approach
    • 2.4.2 Top-Down Approach
  • 2.5 Forecasting Methodology

3 Executive Summary

4 Japan Semiconductor Manufacturing Equipment Market - Introduction

  • 4.1 Overview
  • 4.2 Market Dynamics
  • 4.3 Industry Trends
  • 4.4 Competitive Intelligence

5 Japan Semiconductor Manufacturing Equipment Market Landscape

  • 5.1 Historical and Current Market Trends (2020-2025)
  • 5.2 Market Forecast (2026-2034)

6 Japan Semiconductor Manufacturing Equipment Market - Breakup by Equipment Type

  • 6.1 Front-End
    • 6.1.1 Overview
    • 6.1.2 Historical and Current Market Trends (2020-2025)
    • 6.1.3 Market Segmentation
      • 6.1.3.1 Lithography
      • 6.1.3.2 Deposition
      • 6.1.3.3 Cleaning
      • 6.1.3.4 Wafer Surface Conditioning
      • 6.1.3.5 Others
    • 6.1.4 Market Forecast (2026-2034)
  • 6.2 Back-End
    • 6.2.1 Overview
    • 6.2.2 Historical and Current Market Trends (2020-2025)
    • 6.2.3 Market Segmentation
      • 6.2.3.1 Testing
      • 6.2.3.2 Assembly and Packaging
      • 6.2.3.3 Dicing
      • 6.2.3.4 Bonding
      • 6.2.3.3 Metrology
      • 6.2.3.4 Others
    • 6.2.4 Market Forecast (2026-2034)
  • 6.3 Fab Facility Equipment
    • 6.3.1 Overview
    • 6.3.2 Historical and Current Market Trends (2020-2025)
    • 6.3.3 Market Segmentation
      • 6.3.3.1 Automation
      • 6.3.3.2 Chemical Control
      • 6.3.3.3 Gas Control
      • 6.3.3.4 Others
    • 6.3.4 Market Forecast (2026-2034)

7 Japan Semiconductor Manufacturing Equipment Market - Breakup by Product Type

  • 7.1 Memory
    • 7.1.1 Overview
    • 7.1.2 Historical and Current Market Trends (2020-2025)
    • 7.1.3 Market Forecast (2026-2034)
  • 7.2 Logic Components
    • 7.2.1 Overview
    • 7.2.2 Historical and Current Market Trends (2020-2025)
    • 7.2.3 Market Forecast (2026-2034)
  • 7.3 Microprocessor
    • 7.3.1 Overview
    • 7.3.2 Historical and Current Market Trends (2020-2025)
    • 7.3.3 Market Forecast (2026-2034)
  • 7.4 Analog Components
    • 7.4.1 Overview
    • 7.4.2 Historical and Current Market Trends (2020-2025)
    • 7.4.3 Market Forecast (2026-2034)
  • 7.5 Optoelectronic Components
    • 7.5.1 Overview
    • 7.5.2 Historical and Current Market Trends (2020-2025)
    • 7.5.3 Market Forecast (2026-2034)
  • 7.6 Discrete Components
    • 7.6.1 Overview
    • 7.6.2 Historical and Current Market Trends (2020-2025)
    • 7.6.3 Market Forecast (2026-2034)
  • 7.7 Others
    • 7.7.1 Historical and Current Market Trends (2020-2025)
    • 7.7.2 Market Forecast (2026-2034)

8 Japan Semiconductor Manufacturing Equipment Market - Breakup by Dimension

  • 8.1 2D
    • 8.1.1 Overview
    • 8.1.2 Historical and Current Market Trends (2020-2025)
    • 8.1.3 Market Forecast (2026-2034)
  • 8.2 2.5D
    • 8.2.1 Overview
    • 8.2.2 Historical and Current Market Trends (2020-2025)
    • 8.2.3 Market Forecast (2026-2034)
  • 8.3 3D
    • 8.3.1 Overview
    • 8.3.2 Historical and Current Market Trends (2020-2025)
    • 8.3.3 Market Forecast (2026-2034)

9 Japan Semiconductor Manufacturing Equipment Market - Breakup by Supply Chain Participant

  • 9.1 IDM Firms
    • 9.1.1 Overview
    • 9.1.2 Historical and Current Market Trends (2020-2025)
    • 9.1.3 Market Forecast (2026-2034)
  • 9.2 OSAT Companies
    • 9.2.1 Overview
    • 9.2.2 Historical and Current Market Trends (2020-2025)
    • 9.2.3 Market Forecast (2026-2034)
  • 9.3 Foundries
    • 9.3.1 Overview
    • 9.3.2 Historical and Current Market Trends (2020-2025)
    • 9.3.3 Market Forecast (2026-2034)

10 Japan Semiconductor Manufacturing Equipment Market - Breakup by Region

  • 10.1 Kanto Region
    • 10.1.1 Overview
    • 10.1.2 Historical and Current Market Trends (2020-2025)
    • 10.1.3 Market Breakup by Equipment Type
    • 10.1.4 Market Breakup by Product Type
    • 10.1.5 Market Breakup by Dimension
    • 10.1.6 Market Breakup by Supply Chain Participant
    • 10.1.7 Key Players
    • 10.1.8 Market Forecast (2026-2034)
  • 10.2 Kansai/Kinki Region
    • 10.2.1 Overview
    • 10.2.2 Historical and Current Market Trends (2020-2025)
    • 10.2.3 Market Breakup by Equipment Type
    • 10.2.4 Market Breakup by Product Type
    • 10.2.5 Market Breakup by Dimension
    • 10.2.6 Market Breakup by Supply Chain Participant
    • 10.2.7 Key Players
    • 10.2.8 Market Forecast (2026-2034)
  • 10.3 Central/ Chubu Region
    • 10.3.1 Overview
    • 10.3.2 Historical and Current Market Trends (2020-2025)
    • 10.3.3 Market Breakup by Equipment Type
    • 10.3.4 Market Breakup by Product Type
    • 10.3.5 Market Breakup by Dimension
    • 10.3.6 Market Breakup by Supply Chain Participant
    • 10.3.7 Key Players
    • 10.3.8 Market Forecast (2026-2034)
  • 10.4 Kyushu-Okinawa Region
    • 10.4.1 Overview
    • 10.4.2 Historical and Current Market Trends (2020-2025)
    • 10.4.3 Market Breakup by Equipment Type
    • 10.4.4 Market Breakup by Product Type
    • 10.4.5 Market Breakup by Dimension
    • 10.4.6 Market Breakup by Supply Chain Participant
    • 10.4.7 Key Players
    • 10.4.8 Market Forecast (2026-2034)
  • 10.5 Tohoku Region
    • 10.5.1 Overview
    • 10.5.2 Historical and Current Market Trends (2020-2025)
    • 10.5.3 Market Breakup by Equipment Type
    • 10.5.4 Market Breakup by Product Type
    • 10.5.5 Market Breakup by Dimension
    • 10.5.6 Market Breakup by Supply Chain Participant
    • 10.5.7 Key Players
    • 10.5.8 Market Forecast (2026-2034)
  • 10.6 Chugoku Region
    • 10.6.1 Overview
    • 10.6.2 Historical and Current Market Trends (2020-2025)
    • 10.6.3 Market Breakup by Equipment Type
    • 10.6.4 Market Breakup by Product Type
    • 10.6.5 Market Breakup by Dimension
    • 10.6.6 Market Breakup by Supply Chain Participant
    • 10.6.7 Key Players
    • 10.6.8 Market Forecast (2026-2034)
  • 10.7 Hokkaido Region
    • 10.7.1 Overview
    • 10.7.2 Historical and Current Market Trends (2020-2025)
    • 10.7.3 Market Breakup by Equipment Type
    • 10.7.4 Market Breakup by Product Type
    • 10.7.5 Market Breakup by Dimension
    • 10.7.6 Market Breakup by Supply Chain Participant
    • 10.7.7 Key Players
    • 10.7.8 Market Forecast (2026-2034)
  • 10.8 Shikoku Region
    • 10.8.1 Overview
    • 10.8.2 Historical and Current Market Trends (2020-2025)
    • 10.8.3 Market Breakup by Equipment Type
    • 10.8.4 Market Breakup by Product Type
    • 10.8.5 Market Breakup by Dimension
    • 10.8.6 Market Breakup by Supply Chain Participant
    • 10.8.7 Key Players
    • 10.8.8 Market Forecast (2026-2034)

11 Japan Semiconductor Manufacturing Equipment Market - Competitive Landscape

  • 11.1 Overview
  • 11.2 Market Structure
  • 11.3 Market Player Positioning
  • 11.4 Top Winning Strategies
  • 11.5 Competitive Dashboard
  • 11.6 Company Evaluation Quadrant

12 Profiles of Key Players

  • 12.1 Company A
    • 12.1.1 Business Overview
    • 12.1.2 Product Portfolio
    • 12.1.3 Business Strategies
    • 12.1.4 SWOT Analysis
    • 12.1.5 Major News and Events
  • 12.2 Company B
    • 12.2.1 Business Overview
    • 12.2.2 Product Portfolio
    • 12.2.3 Business Strategies
    • 12.2.4 SWOT Analysis
    • 12.2.5 Major News and Events
  • 12.3 Company C
    • 12.3.1 Business Overview
    • 12.3.2 Product Portfolio
    • 12.3.3 Business Strategies
    • 12.3.4 SWOT Analysis
    • 12.3.5 Major News and Events
  • 12.4 Company D
    • 12.4.1 Business Overview
    • 12.4.2 Product Portfolio
    • 12.4.3 Business Strategies
    • 12.4.4 SWOT Analysis
    • 12.4.5 Major News and Events
  • 12.5 Company E
    • 12.5.1 Business Overview
    • 12.5.2 Product Portfolio
    • 12.5.3 Business Strategies
    • 12.5.4 SWOT Analysis
    • 12.5.5 Major News and Events

13 Japan Semiconductor Manufacturing Equipment Market - Industry Analysis

  • 13.1 Drivers, Restraints, and Opportunities
    • 13.1.1 Overview
    • 13.1.2 Drivers
    • 13.1.3 Restraints
    • 13.1.4 Opportunities
  • 13.2 Porters Five Forces Analysis
    • 13.2.1 Overview
    • 13.2.2 Bargaining Power of Buyers
    • 13.2.3 Bargaining Power of Suppliers
    • 13.2.4 Degree of Competition
    • 13.2.5 Threat of New Entrants
    • 13.2.6 Threat of Substitutes
  • 13.3 Value Chain Analysis

14 Appendix