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市场调查报告书
商品编码
1878253

半导体设备市场－2025-2030年预测

Semiconductor Equipment Market - Forecasts from 2025 to 2030
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 151 Pages | 商品交期: 最快1-2个工作天内

价格
简介目录

预计半导体设备市场将从 2025 年的 1,135.32 亿美元成长到 2030 年的 1,382.62 亿美元，复合年增长率为 4.02%。

半导体设备市场分析

半导体设备涵盖了生产电子元件所必需的工具和系统，这些电子元件利用了硅、锗、砷化镓和有机半导体等材料的特性。市场动力源自于5G的加速部署和人工智慧的融合，这在近期、中期和长期内都需要高效能、高性价比的晶片。 5G的广泛应用正在推动扩增实境、关键任务通讯、固定无线存取和物联网(IoT)生态系统等创新，这些创新共同促进了对先进半导体设备的需求。

市集亮点

  • 消费性电子产品需求激增，推动了设备投资。
  • 5G 和人工智慧的日益普及推动了对下一代製造解决方案的需求。
  • 亚太地区凭藉其高度集中的製造群主导地位。
  • 扩展的 OSAT（外包半导体组装和测试）能力将使晶片的组装、封装和测试更加高效。
  • 汽车产业的成长正在推动感测器和处理器专用设备的发展。
  • 政府资金将加速国内生产生态系的发展。
  • 加强研发正在推动 5nm 以下製程节点的创新。

市场驱动因素

消费性电子产品是关键成长引擎

智慧型手机、平板电脑、笔记型电脑、穿戴式装置和智慧家电的日益普及推动了消费性电子产品的发展，也构成了半导体设备需求的基础。积体电路晶片、二极体和电晶体等半导体技术为从微波炉、冷藏库到游戏机和行动电话等各种设备的功能提供动力。该产业的规模之大可见一斑：预计到2027年，智慧型手机用户数将达到78亿部，占全球行动用户总数的87%。为了满足市场对小型化和高性能的需求，设备製造商正投入大量研发资金，用于开发5奈米以下製程节点的精密设备以及平板显示器和太阳能板等相关市场。随着製造商扩大产能以满足设备普及的需求，这些投资与市场成长直接相关。

扩展 OSAT 生态系统

OSAT供应商将积体电路设计与可直接投放市场的零件连接起来，在封装、测试和供应链优化方面发挥关键作用。微控制器、感测器和雷达晶片在汽车、工业和物联网应用的整合度不断提高，正在拓展OSAT供应商的工作范围。随着半导体代工厂和OSAT工厂扩大生产规模，对设备的需求也随之成长。设计复杂性、产量比率要求和不断扩大的量产规模之间的相互作用，使得OSAT成为推动成长的关键因素，这就要求设备供应商提供专为异构整合和先进封装技术而设计的高吞吐量、高精度系统。

区域展望

在亚太地区主导地位

亚太地区凭藉其成熟的製造地和战略政策，正逐步确立市场主导地位。在优先考虑技术自主和经济实力的国家倡议的支持下，中国正巩固其作为先进半导体设备生产中心的地位。以韩国为首的晶圆代工经济体，正透过有针对性的激励措施和产能扩张，进一步增强该地区的成长动能。晶圆製造、组装和测试业务的集中，以及强大的供应链生态系统，使亚太地区成为製造设备应用中心。持续投资于国内基地和跨境伙伴关係将强化该地区的成长轨迹，确保在整个预测期内持续的资本流入和技术领先地位。

主要企业

  • 应用材料公司：涵盖沉积、蚀刻和检测的全面产品系列。
  • ASML控股公司：在极紫外线（EUV）微影术系统领域占据主导地位。
  • 东京电子有限公司：拥有涂布/开发人员和热处理的专业技术。
  • KLA公司：测量和过程控制领域的领导者。
  • Lam Research Corporation：为先进节点提供蚀刻和沈积解决方案。

半导体设备市场处于地缘政治策略、技术融合和终端市场演变的交会点。相关人员必须兼顾供应链韧性、节点过渡蓝图和永续性等迫切需求，同时充分利用5G/人工智慧和汽车电气化带来的机会。亚太地区的结构性优势——集中的製造地、政策的一致性以及接近性需求中心——巩固了其优势，迫使全球企业相应地调整其研发、产能和伙伴关係策略。随着产业向基于埃的製造模式转型，精度、产能和产量比率仍然是关键指标。

本报告的主要优势：

  • 深入分析：提供对主要和新兴地区的深入市场洞察，重点关注客户群、政府政策和社会经济因素、消费者偏好、垂直行业和其他细分市场。
  • 竞争格局：了解主要全球参与者正在采取的策略倡议，并了解透过正确的策略进入市场的可能性。
  • 市场驱动因素与未来趋势：探索推动市场的动态因素和关键趋势，以及它们将如何塑造未来的市场发展。
  • 可操作的建议：利用洞察力，做出策略决策，在动态环境中发展新的业务流和收入来源。
  • 受众广泛：适用于Start-Ups、研究机构、顾问公司、中小企业和大型企业，且经济实惠。

您打算如何使用这份报告？

产业与市场分析、机会评估、产品需求预测、打入市场策略、地理扩张、资本投资决策、法规结构及影响、新产品开发、竞争情报

研究范围：

  • 2022年至2024年的历史数据和2025年至2030年的预测数据
  • 成长机会、挑战、供应链前景、法规结构与趋势分析
  • 竞争定位、策略和市场占有率分析
  • 按业务板块和地区分類的收入成长和预测评估，包括国家/地区
  • 公司概况（策略、产品、财务资讯、关键发展等）

目录

第一章执行摘要

第二章 市场概览

  • 市场概览
  • 市场定义
  • 调查范围

第三章 商业情境

  • 市场驱动因素
  • 市场限制
  • 市场机会
  • 波特五力分析
  • 产业价值链分析
  • 政策与法规
  • 策略建议

第四章 技术展望

第五章 半导体设备市场（依设备分类）

  • 介绍
  • 前端设备
  • 后端设备

第六章 半导体设备市场（依最终用户划分）

  • 介绍
  • 铸造厂
  • IDM公司
  • OSAT公司

第七章 半导体设备市场（依尺寸划分）

  • 介绍
  • QR 图
  • 2.5D
  • 3D

第八章 半导体设备市场（按地区划分）

  • 介绍
  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 南美洲
    • 巴西
    • 阿根廷
    • 其他的
  • 欧洲
    • 德国
    • 法国
    • 英国
    • 西班牙
    • 其他的
  • 中东和非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 其他的
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 韩国
    • 印尼
    • 泰国
    • 其他的

第九章 竞争格局与分析

  • 主要企业和策略分析
  • 市占率分析
  • 合併、收购、协议和合作
  • 竞争对手仪錶板

第十章：公司简介

  • Applied Materials Inc.
  • ASML Holding Semiconductor Company
  • Tokyo Electron Limited
  • KLA Corporation
  • Lam Research Corporation
  • Hitachi Corporation
  • Teradyne Inc.
  • SCREEN Semiconductor Solutions Co. Ltd.

第十一章附录

  • 货币
  • 先决条件
  • 基准年和预测年时间表
  • 相关人员的主要收益
  • 调查方法
  • 简称列表

第一章执行摘要

第二章 市场概览

  • 市场概览
  • 市场定义
  • 调查范围

第二章 4. 市场区隔

第三章 商业情境

  • 市场驱动因素
  • 市场限制
  • 市场机会
  • 波特五力分析
  • 产业价值链分析
  • 政策与法规
  • 策略建议

第四章 技术展望

第五章 半导体设备市场（依设备分类）

  • 介绍
  • 前端设备
  • 后端设备

第六章 半导体设备市场（依最终用户划分）

  • 介绍
  • 铸造厂
  • IDM公司
  • OSAT公司

第七章 半导体设备市场（依尺寸划分）

  • 介绍
  • 2D
  • 2.5D
  • 3D

第八章 半导体设备市场（按地区划分）

  • 介绍
  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 南美洲
    • 巴西
    • 阿根廷
    • 其他的
  • 欧洲
    • 德国
    • 法国
    • 英国
    • 西班牙
    • 其他的
  • 中东和非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 其他的
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 韩国
    • 印尼
    • 泰国
    • 其他的

第九章 竞争格局与分析

  • 主要企业和策略分析
  • 市占率分析
  • 合併、收购、协议和合作
  • 竞争对手仪錶板

第十章：公司简介

  • Applied Materials Inc.
  • ASML Holding Semiconductor Company
  • Tokyo Electron Limited
  • KLA Corporation
  • Lam Research Corporation
  • Hitachi Corporation
  • Teradyne Inc.
  • SCREEN Semiconductor Solutions Co. Ltd.

第十一章附录

  • 货币
  • 先决条件
  • 基准年和预测年时间表
  • 相关人员的主要收益
  • 调查方法
  • 简称列表
简介目录
Product Code: KSI061614632

The semiconductor equipment market is anticipated to increase at a 4.02% CAGR, from USD 113.532 billion in 2025 to USD 138.262 billion in 2030.

Semiconductor Equipment Market Analysis

Semiconductor equipment encompasses tools and systems essential for fabricating electronic components that leverage the properties of materials such as silicon, germanium, gallium arsenide, and organic semiconductors. Market momentum stems from accelerating 5G deployments and artificial intelligence integration, which demand high-performance, cost-effective chips across short-, medium-, and long-term horizons. The proliferation of 5G enables innovations including augmented reality, mission-critical communications, fixed wireless access, and Internet of Things ecosystems, collectively amplifying requirements for advanced semiconductor manufacturing equipment.

Market Highlights

  • Surging consumer electronics demand propels equipment investments.
  • 5G and AI adoption escalates need for next-generation fabrication solutions.
  • Asia-Pacific dominates with concentrated manufacturing clusters.
  • Expanding OSAT capabilities streamline chip assembly, packaging, and testing.
  • Automotive sector growth drives specialized equipment for sensors and processors.
  • Government funding accelerates domestic production ecosystems.
  • Intensified R&D fosters breakthroughs in sub-5 nm process nodes.

Market Drivers

Consumer Electronics as Primary Growth Engine

Consumer electronics represent a cornerstone of semiconductor equipment demand, fueled by escalating adoption of smartphones, tablets, laptops, wearables, and connected appliances. Semiconductors-manifested as integrated chips, diodes, and transistors-underpin functionality in devices ranging from microwaves and refrigerators to gaming consoles and mobile handsets. The sector's scale is evidenced by projected smartphone subscriptions reaching 7.8 billion by 2027, equating to 87% of global mobile users. Equipment providers channel substantial R&D into precision tools for sub-5 nm nodes and adjacent markets like flat-panel displays and solar panels, ensuring alignment with miniaturization and performance mandates. These investments directly correlate with market expansion as manufacturers scale capacity to meet device proliferation.

OSAT Ecosystem Expansion

Outsourced Semiconductor Assembly and Test (OSAT) providers bridge integrated circuit design and market-ready components, assuming critical roles in packaging, testing, and supply chain optimization. Rising integration of microcontrollers, sensors, and radar chips in automotive, industrial, and IoT applications broadens OSAT scope. As semiconductor foundries and OSAT facilities ramp production, equipment demand surges proportionally. The interplay between design complexity, yield requirements, and volume scaling positions OSAT as a pivotal growth lever, compelling equipment vendors to deliver high-throughput, high-precision systems tailored to heterogeneous integration and advanced packaging techniques.

Geographical Outlook

Asia-Pacific Leadership

Asia-Pacific asserts market dominance through entrenched manufacturing hubs and strategic policy alignment. China has solidified its position as a producer of advanced semiconductor equipment, bolstered by national initiatives prioritizing technological sovereignty and economic leverage. South Korea and other foundry-centric economies amplify regional momentum via targeted incentives and capacity expansions. The concentration of wafer fabrication, assembly, and test operations-coupled with robust supply chain ecosystems-establishes Asia-Pacific as the epicenter of equipment deployment. Continued investments in domestic nodes and cross-border partnerships reinforce the region's trajectory, ensuring sustained capital inflows and technological leadership throughout the forecast period.

Leading Industry Players

  • Applied Materials Inc.: Comprehensive portfolio spanning deposition, etch, and inspection.
  • ASML Holding: Monopoly in extreme ultraviolet (EUV) lithography systems.
  • Tokyo Electron Limited: Expertise in coater/developer and thermal processing.
  • KLA Corporation: Metrology and process control leadership.
  • Lam Research Corporation: Etch and deposition solutions for advanced nodes.

The semiconductor equipment market operates at the nexus of geopolitical strategy, technological convergence, and end-market evolution. Stakeholders must navigate supply chain resilience, node migration roadmaps, and sustainability imperatives while capitalizing on 5G/AI tailwinds and automotive electrification. Asia-Pacific's structural advantages-manufacturing density, policy coherence, and demand proximity-entrench its preeminence, compelling global players to align R&D, capacity, and partnership strategies accordingly. Precision, throughput, and yield remain non-negotiable metrics as the industry transitions toward angstrom-scale manufacturing paradigms.

Key Benefits of this Report:

  • Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
  • Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
  • Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
  • Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
  • Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

  • Historical data from 2022 to 2024 & forecast data from 2025 to 2030
  • Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
  • Competitive Positioning, Strategies, and Market Share Analysis
  • Revenue Growth and Forecast Assessment of segments and regions including countries
  • Company Profiling (Strategies, Products, Financial Information, and Key Developments among others.

Semiconductor Equipment Market Segmentation:

  • SEMICONDUCTOR EQUIPMENT MARKET BY EQUIPMENT TYPE
  • Front-end Equipment
  • Back-end Equipment
  • SEMICONDUCTOR EQUIPMENT MARKET BY END-USER
  • Foundries
  • IDM Firms
  • OSAT Companies
  • SEMICONDUCTOR EQUIPMENT MARKET BY DIMENSION
  • 2D
  • 2.5D
  • 3D
  • SEMICONDUCTOR EQUIPMENT MARKET BY GEOGRAPHY
  • North America
  • USA
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • Germany
  • France
  • United Kingdom
  • Spain
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • UAE
  • Others
  • Asia Pacific
  • China
  • India
  • Japan
  • South Korea
  • Indonesia
  • Thailand
  • Others

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

  • 2.1. Market Overview
  • 2.2. Market Definition
  • 2.3. Scope of the Study

2.4. Market Segmentation

3. BUSINESS LANDSCAPE

  • 3.1. Market Drivers
  • 3.2. Market Restraints
  • 3.3. Market Opportunities
  • 3.4. Porter's Five Forces Analysis
  • 3.5. Industry Value Chain Analysis
  • 3.6. Policies and Regulations
  • 3.7. Strategic Recommendations

4. TECHNOLOGICAL OUTLOOK

5. SEMICONDUCTOR EQUIPMENT MARKET BY EQUIPMENT TYPE

  • 5.1. Introduction
  • 5.2. Front-end Equipment
  • 5.3. Back-end Equipment

6. SEMICONDUCTOR EQUIPMENT MARKET BY END-USER

  • 6.1. Introduction
  • 6.2. Foundries
  • 6.3. IDM Firms
  • 6.4. OSAT Companies

7. SEMICONDUCTOR EQUIPMENT MARKET BY DIMENSION

  • 7.1. Introduction
  • 7.2. 2D
  • 7.3. 2.5D
  • 7.4. 3D

8. SEMICONDUCTOR EQUIPMENT MARKET BY GEOGRAPHY

  • 8.1. Introduction
  • 8.2. North America
    • 8.2.1. USA
    • 8.2.2. Canada
    • 8.2.3. Mexico
  • 8.3. South America
    • 8.3.1. Brazil
    • 8.3.2. Argentina
    • 8.3.3. Others
  • 8.4. Europe
    • 8.4.1. Germany
    • 8.4.2. France
    • 8.4.3. United Kingdom
    • 8.4.4. Spain
    • 8.4.5. Others
  • 8.5. Middle East and Africa
    • 8.5.1. Saudi Arabia
    • 8.5.2. UAE
    • 8.5.3. Others
  • 8.6. Asia Pacific
    • 8.6.1. China
    • 8.6.2. India
    • 8.6.3. Japan
    • 8.6.4. South Korea
    • 8.6.5. Indonesia
    • 8.6.6. Thailand
    • 8.6.7. Others

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 9.1. Major Players and Strategy Analysis
  • 9.2. Market Share Analysis
  • 9.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 9.4. Competitive Dashboard

10. COMPANY PROFILES

  • 10.1. Applied Materials Inc.
  • 10.2. ASML Holding Semiconductor Company
  • 10.3. Tokyo Electron Limited
  • 10.4. KLA Corporation
  • 10.5. Lam Research Corporation
  • 10.6. Hitachi Corporation
  • 10.7. Teradyne Inc.
  • 10.8. SCREEN Semiconductor Solutions Co. Ltd.

11. APPENDIX

  • 11.1. Currency
  • 11.2. Assumptions
  • 11.3. Base and Forecast Years Timeline
  • 11.4. Key Benefits for the Stakeholders
  • 11.5. Research Methodology
  • 11.6. Abbreviations

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

  • 2.1. Market Overview
  • 2.2. Market Definition
  • 2.3. Scope of the Study

2.4. Market Segmentation

3. BUSINESS LANDSCAPE

  • 3.1. Market Drivers
  • 3.2. Market Restraints
  • 3.3. Market Opportunities
  • 3.4. Porter's Five Forces Analysis
  • 3.5. Industry Value Chain Analysis
  • 3.6. Policies and Regulations
  • 3.7. Strategic Recommendations

4. TECHNOLOGICAL OUTLOOK

5. SEMICONDUCTOR EQUIPMENT MARKET BY EQUIPMENT TYPE

  • 5.1. Introduction
  • 5.2. Front-end Equipment
  • 5.3. Back-end Equipment

6. SEMICONDUCTOR EQUIPMENT MARKET BY END-USER

  • 6.1. Introduction
  • 6.2. Foundries
  • 6.3. IDM Firms
  • 6.4. OSAT Companies

7. SEMICONDUCTOR EQUIPMENT MARKET BY DIMENSION

  • 7.1. Introduction
  • 7.2. 2D
  • 7.3. 2.5D
  • 7.4. 3D

8. SEMICONDUCTOR EQUIPMENT MARKET BY GEOGRAPHY

  • 8.1. Introduction
  • 8.2. North America
    • 8.2.1. USA
    • 8.2.2. Canada
    • 8.2.3. Mexico
  • 8.3. South America
    • 8.3.1. Brazil
    • 8.3.2. Argentina
    • 8.3.3. Others
  • 8.4. Europe
    • 8.4.1. Germany
    • 8.4.2. France
    • 8.4.3. United Kingdom
    • 8.4.4. Spain
    • 8.4.5. Others
  • 8.5. Middle East and Africa
    • 8.5.1. Saudi Arabia
    • 8.5.2. UAE
    • 8.5.3. Others
  • 8.6. Asia Pacific
    • 8.6.1. China
    • 8.6.2. India
    • 8.6.3. Japan
    • 8.6.4. South Korea
    • 8.6.5. Indonesia
    • 8.6.6. Thailand
    • 8.6.7. Others

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 9.1. Major Players and Strategy Analysis
  • 9.2. Market Share Analysis
  • 9.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 9.4. Competitive Dashboard

10. COMPANY PROFILES

  • 10.1. Applied Materials Inc.
  • 10.2. ASML Holding Semiconductor Company
  • 10.3. Tokyo Electron Limited
  • 10.4. KLA Corporation
  • 10.5. Lam Research Corporation
  • 10.6. Hitachi Corporation
  • 10.7. Teradyne Inc.
  • 10.8. SCREEN Semiconductor Solutions Co. Ltd.

11. APPENDIX

  • 11.1. Currency
  • 11.2. Assumptions
  • 11.3. Base and Forecast Years Timeline
  • 11.4. Key Benefits for the Stakeholders
  • 11.5. Research Methodology
  • 11.6. Abbreviations