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1510385

3D IC 市场规模、份额、成长分析（按类型、组件、应用、最终用户、地区）- 产业预测，2024-2031 年

3D IC Market Size, Share, Growth Analysis, By Type, By Component(Through-Silicon Via, Through Glass Via, and Silicon Interposer), By Application, By End User, By Region - Industry Forecast 2024-2031

出版日期: 2024年07月05日 | 出版商:

SkyQuest | 英文 197 Pages | 商品交期: 3-5个工作天内

价格

简介目录

2022年3D IC市场规模将为132.5亿美元，预测期内（2024-2031年）复合年增长率为20.10%，从2023年的159.1亿美元增至2031年的688亿美元，预计将增长至80美元百万。

由于技术进步，特别是电子设备的小型化和高效化，3D IC 市场正在经历快速成长。这种快速成长是由消费者对更小、更强大的电子设备（例如智慧型手机和平板电脑设备）的需求增加所推动的。基本上，3D IC 透过多层堆迭积体电路来提高能源效率、讯号强度和小型化。儘管潜力巨大，但该市场仍面临许多挑战，例如初始成本高、需要专用工具的复杂製造流程以及对温度控管和标准化的担忧。儘管如此，3D IC 的采用带来了巨大的机会，特别是随着人工智慧、机器学习和 5G 技术的兴起，这些技术需要更快的资料处理速度和紧凑外形规格的增强功能。随着产业不断创新并应对这些挑战，3D IC 市场预计将在未来几年实现显着成长。

市场概况
北美洲
- 美国
- 加拿大
欧洲
- 德国
- 西班牙
- 法国
- 英国
- 义大利
- 其他欧洲国家地区
亚太地区
- 中国
- 印度
- 日本
- 韩国
- 其他亚太地区
拉丁美洲
- 巴西
- 其他拉丁美洲地区
中东和非洲 (MEA)
- 海湾合作委员会国家
- 南非
- 其他中东/非洲地区

竞争格局

前5名企业对比
主要企业市场定位（2023年）
主要市场参与者所采取的策略
近期市集活动
主要企业市场占有率（2023年）

主要企业简介

Taiwan Semiconductor Manufacturing Company Limited（Taiwan）
Intel Corporation（United States）
Samsung Electronics Co., Ltd.（South Korea）
Advanced Micro Devices, Inc.（United States）
SK Hynix Inc.（South Korea）
Micron Technology, Inc.（United States）
GlobalFoundries Inc.（United States）
United Microelectronics Corporation（Taiwan）
Xilinx, Inc.（United States）
ASE Technology Holding Co., Ltd.（Taiwan）
Broadcom Inc.（United States）
Qualcomm Incorporated（United States）
Texas Instruments Incorporated（United States）
Nvidia Corporation（United States）
MediaTek Inc.（Taiwan）
Cadence Design Systems, Inc.（United States）
Marvell Technology Group Ltd.（Bermuda）
Renesas Electronics Corporation（Japan）
Synopsys, Inc.（United States）
STMicroelectronics NV（Switzerland）

简介目录

Product Code: SQMIG45K2097

3D IC Market size was valued at USD 13.25 Billion in 2022 and is poised to grow from USD 15.91 Billion in 2023 to USD 68.88 Billion by 2031, at a CAGR of 20.10% during the forecast period (2024-2031).

The 3D IC market is experiencing rapid growth driven by advancements in technology, particularly in the miniaturization and efficiency of electronic devices. This surge is fueled by increasing consumer demand for smaller yet more powerful electronics, such as smartphones and tablets. Essentially, 3D ICs involve stacking multiple layers of integrated circuits, enhancing energy efficiency, signal strength, and compactness. Despite its potential, the market faces challenges like high initial costs, complex manufacturing processes requiring specialized tools, and concerns over heat management and standardization. Nonetheless, the adoption of 3D ICs presents significant opportunities, particularly with the rise of AI, machine learning, and 5G technologies, which demand faster data processing and enhanced capabilities in compact form factors. As the industry continues to innovate and address these challenges, the 3D IC market is poised for substantial growth in the coming years.

Top-down and bottom-up approaches were used to estimate and validate the size of the 3D IC Market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

3D IC Market Segmental Analysis

Global 3D IC market is segmented based on type, component, application, end user, and region. Based on type, the market is segmented into Stacked 3D, and Monolithic 3D. Based on components, the market is segmented into Through-Silicon Via (TSV), Through Glass Via (TGV), and Silicon Interposer. Based on application, the market is segmented into Logic, Imaging & Optoelectronics, Memory, Sensors, LEDs, and Others. Based on end user, the market is segmented into Consumer Electronics, Industrial, Telecommunications, automotive, Military and Aerospace, and Medical Devices. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America, and Middle East & Africa.

Drivers of the 3D IC Market

The 3D IC market is expanding significantly due to increasing demand for compact and high-speed electronic devices worldwide. As consumer preferences lean towards smaller, lighter, and more powerful gadgets such as smartphones, tablets, and wearables, 3D IC technology enables the stacking of multiple layers of integrated circuits. This approach enhances device performance, reduces power consumption, and facilitates miniaturization, effectively meeting evolving consumer demands for advanced electronics. The adoption of 3D IC technology not only improves device functionality but also aligns with the dynamic expectations of tech-savvy consumers seeking efficient and compact solutions in their electronic purchases.

Restraints in the 3D IC Market

The significant initial expenses associated with 3D IC technology pose a formidable obstacle to market adoption. The intricate manufacturing processes and requirement for specialized tools substantially inflate production costs, which can deter widespread adoption of this technology across various industries. The substantial upfront investment required may hinder many factories from integrating this innovative technology into their operations, limiting its broader application and potential impact.

Market Trends of the 3D IC Market

The 3D IC market is witnessing a significant trend towards increased adoption in artificial intelligence (AI) and machine learning (ML) applications. With the rising prevalence of these advanced technologies, there is a growing demand for faster data processing and enhanced performance capabilities. 3D IC technology emerges as a crucial solution to meet these requirements effectively. The trend underscores the growing significance of 3D ICs in both the development and utilization of AI and ML, thereby driving expansion within the market for this technology.

Introduction

Objectives of the Study
Definitions
Market Scope

Research Methodology

Information Procurement
Secondary & Primary Data Sources
Market Size Estimation
Market Assumptions & Limitations

Executive Summary

Market Overview Outlook
Supply Demand Trend Analysis
Segmental Opportunity Analysis

Market Dynamics & Outlook

Market Dynamics
- Drivers
- Opportunities
- Restraints
- Challenges
Porters Analysis
- Competitive rivalry
- Threat of Substitute Products
- Bargaining Power of Buyers
- Threat of New Entrants
- Bargaining Power of Suppliers

Key Market Insights

Technology Analysis
Pricing Analysis
Value Chain Analysis
Ecosystem of the Market
Start-up Analysis
Regulatory Landscape
Innovation Matrix
Top Investment Analysis
Key Success Factor
Market Attractive Index
Degree of Competition

Global 3D IC Market by Type

Market Overview
Stacked 3D
Monolithic 3D

Global 3D IC Market by Component

Market Overview
Through-Silicon Via (TSV)
Through Glass Via (TGV)
Silicon Interposer

Global 3D IC Market by Application

Market Overview
Logic
Imaging and Optoelectronics
Memory
LEDs
Sensors
Others

Global 3D IC Market by End User

Market Overview
Consumer Electronics
Industrial
Telecommunications
Military and Aerospace
Automotive
Medical Devices

Global 3D IC Market Size by Region

Market Overview
North America
- USA
- Canada
Europe
- Germany
- Spain
- France
- UK
- Italy
- Rest of Europe
Asia Pacific
- China
- India
- Japan
- South Korea
- Rest of Asia-Pacific
Latin America
- Brazil
- Rest of Latin America
Middle East & Africa (MEA)
- GCC Countries
- South Africa
- Rest of MEA

Competitive Landscape

Top 5 Player Comparison
Market Positioning of Key Players, 2023
Strategies Adopted by Key Market Players
Recent Activities in the Market
Key Companies Market Share (%), 2023

Key Company Profiles

Taiwan Semiconductor Manufacturing Company Limited (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Intel Corporation (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Samsung Electronics Co., Ltd. (South Korea)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Advanced Micro Devices, Inc. (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
SK Hynix Inc. (South Korea)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Micron Technology, Inc. (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
GlobalFoundries Inc. (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
United Microelectronics Corporation (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Xilinx, Inc. (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Development
ASE Technology Holding Co., Ltd. (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Broadcom Inc. (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Qualcomm Incorporated (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Development
Texas Instruments Incorporated (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Nvidia Corporation (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
MediaTek Inc. (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Cadence Design Systems, Inc. (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Marvell Technology Group Ltd. (Bermuda)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Renesas Electronics Corporation (Japan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Synopsys, Inc. (United States)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
STMicroelectronics N.V. (Switzerland)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments