封面
市场调查报告书
商品编码
1603297

半导体资本设备市场规模、份额、成长分析,按类型、製程类型、产业、地区划分 - 产业预测,2024-2031 年

Semiconductor Capital Equipment Market Size, Share, Growth Analysis, By Type, By Process Type, By Industry Vertical, By Region - Industry Forecast 2024-2031

出版日期: | 出版商: SkyQuest | 英文 192 Pages | 商品交期: 3-5个工作天内

价格
简介目录

2022年全球半导体资本设备市场规模为758亿美元,从2023年的812.6亿美元成长到2031年的1417.2亿美元,在预测期内(2024-2031年)预计将以复合年增长率增长。 。

由于智慧型手机使用量的快速增加、先进电子设备的扩张以及汽车行业的发展,全球半导体行业正在经历显着增长。 5G 和人工智慧等技术创新正在推动这一转变,特别是 5G 技术可提高无线效能并促进扩增实境和物联网 (IoT) 等新应用。对高性能且具有成本效益的半导体的持续需求正在推动短期、中期和长期的市场动态。此外,智慧型设备和行动装置的兴起,加上各行业数位化的进步,大大促进了采用半导体元件的数位电子产品的普及。智慧型穿戴装置在消费和工业应用中的出现需要更高水准的半导体整合度。这一趋势强调了对尖端加工技术的需求,包括蚀刻和晶圆研磨,以及半导体製造专业知识。人工智慧、机器学习和物联网技术以及先进机器人技术的整合正在重塑製造格局,尤其是半导体组件。技术进步不断发展,推动全球半导体资本设备市场向前发展,并凸显该产业在支援次世代应用程式和服务方面的关键作用。

目录

介绍

  • 研究目的
  • 调查范围
  • 定义

调查方法

  • 资讯采购
  • 二手资料和主要资料方法
  • 市场规模预测
  • 市场假设与限制

执行摘要

  • 全球市场展望
  • 供需趋势分析
  • 按细分市场的机会分析

市场动态及展望

  • 市场概况
  • 市场规模
  • 市场动态
    • 驱动因素和机会
    • 限制因素和挑战
  • 波特分析及影响
    • 竞争公司之间的敌对关係
    • 替代品的威胁
    • 买方议价能力
    • 新进入者的威胁
    • 供应商的议价能力

主要市场考察

  • 关键成功因素
  • 竞争程度
  • 主要投资机会
  • 市场生态系统
  • 技术进步
  • 监管环境
  • 专利分析
  • 价值链分析
  • 案例研究分析
  • 客户和购买标准分析
  • PESTEL分析
  • 总体经济指标
  • 市场吸引力指数
  • 价格分析

半导体资本设备市场规模:按类型和复合年增长率(2024-2031)

  • 市场概况
  • 晶圆级製造设备
    • 光刻设备
    • 蚀刻设备
    • 沉积装置
    • 化学机械平坦化(CMP)设备
    • 清洁工具
  • 组装/包装设备
    • 固晶机
    • 焊接线机
    • 覆晶键合机
    • 封装装置
  • 自动测试设备(ATE)
    • 记忆体测试系统
    • 非记忆体测试系统
    • 单独测试系统

以製程类型和复合年增长率分類的半导体资本设备市场规模(2024-2031)

  • 市场概况
    • 晶圆加工
    • 表面处理
    • 化学机械平坦化 (CMP)
    • 化学沉淀(CVD)
    • 物理气相淀积气相沉积 (PVD)
    • 离子布植
  • 组装和包装
    • 晶圆键合技术
    • 晶片贴装
    • 引线接合法
    • 封装
  • 测试
    • 电气测试
    • 功能测试
    • 老化测试

半导体资本设备市场规模:依产业及复合年增长率(2024-2031)

  • 市场概况
  • 家电
    • 智慧型手机
    • 药片
    • 笔记型电脑
    • 穿戴式的
    • ADAS(进阶驾驶辅助系统)(ADAS)
    • 资讯娱乐系统
    • 电动车(EV)
    • 自动驾驶汽车
  • 卫生保健
    • 医疗设备
    • 诊断设备
    • 穿戴式健康监测器
  • 资讯科技/通讯
    • 资料中心
    • 网路装置
    • 5G基础设施

半导体资本设备市场规模:依地区及复合年增长率(2024-2031)

  • 北美洲
    • 美国
    • 加拿大
  • 欧洲
    • 英国
    • 德国
    • 西班牙
    • 法国
    • 义大利
    • 其他欧洲国家地区
  • 亚太地区
    • 中国
    • 印度
    • 日本
    • 韩国
    • 其他亚太地区
  • 拉丁美洲
    • 巴西
    • 其他拉丁美洲地区
  • 中东和非洲
    • 海湾合作委员会国家
    • 南非
    • 其他中东/非洲

竞争资讯

  • 前5名企业对比
  • 主要企业市场定位(2023年)
  • 主要市场参与者所采取的策略
  • 近期市场趋势
  • 公司市场占有率分析(2023)
  • 主要企业简介
    • 公司简介
    • 产品系列分析
    • 按细分市场分類的份额分析
    • 收益与前一年同期比较(2021-2023)

主要企业简介

  • Applied Materials, Inc.
  • ASML Holding NV
  • Tokyo Electron Limited
  • Lam Research Corporation
  • KLA Corporation
  • Advantest Corporation
  • Teradyne Inc.
  • Screen Holdings Co., Ltd.
  • Hitachi High-Technologies Corporation
  • ASM International NV
  • Kulicke & Soffa Industries, Inc.
  • Nikon Corporation
  • Canon Inc.
  • Plasma-Therm LLC
  • Veeco Instruments Inc.
  • Nova Measuring Instruments Ltd.
  • Ontoo Innovation
  • Camtek Ltd.
  • ACCRETECH-Tokyo Seimitsu Co., Ltd.
  • Ultratech, Inc.

结论和建议

简介目录
Product Code: SQMIG15A2433

Global Semiconductor Capital Equipment Market size was valued at USD 75.8 billion in 2022 and is poised to grow from USD 81.26 billion in 2023 to USD 141.72 billion by 2031, growing at a CAGR of 7.2% during the forecast period (2024-2031).

The global semiconductor industry is witnessing significant growth driven by the surge in smartphone usage and the expansion of advanced electronic devices, alongside the automotive sector's evolution. Innovations like 5G and artificial intelligence are catalyzing this transformation, particularly with 5G technology enhancing wireless performance and facilitating new applications, such as augmented reality and the Internet of Things (IoT). The sustained demand for high-performance yet cost-effective semiconductors is propelling market dynamics across short, medium, and long-term scenarios. Furthermore, the rise of smart and portable devices, coupled with increased digitization across various industries, is significantly contributing to the proliferation of digital electronics that incorporate semiconductor elements. The emergence of smart wearables in both consumer and industrial settings further necessitates advanced semiconductor integration. This trend underscores the need for cutting-edge processing techniques, including etching and wafer back grinding, while also requiring expertise in semiconductor manufacturing. The integration of AI, machine learning, and IoT technologies, along with advanced robotics, is reshaping the manufacturing landscape, particularly for semiconductor components. As technological advancements continue to evolve, they are set to drive the global semiconductor capital equipment market forward, highlighting the industry's pivotal role in supporting next-generation applications and services.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Semiconductor Capital Equipment market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Semiconductor Capital Equipment Market Segmental Analysis

Global Semiconductor Capital Equipment Market is segmented by type, process type, industry vertical and region. Based on type, the market is segmented into wafer-level manufacturing equipment (lithography equipment, etching equipment, deposition equipment, chemical mechanical planarization (CMP) equipment, cleaning equipment), assembly and packaging equipment (die bonders, wire bonders, flip chip bonders, encapsulation equipment) and automated test equipment (ATE) (memory test systems, non-memory test systems, discrete test systems). Based on process type, the market is segmented into wafer processing (surface conditioning, chemical mechanical planarization (CMP), chemical vapor deposition (CVD), physical vapor deposition (PVD), ion implantation), assembly and packaging (wafer bonding, die attach, wire bonding, encapsulation) and testing (electrical testing, functional testing, burn-in testing). Based on industrial vertical, the market is segmented into consumer electronics (smartphones, tablets, laptops, wearables), automotive (advanced driver assistance systems (ADAS), infotainment systems, electric vehicles (EVs), autonomous vehicles), healthcare (medical devices, diagnostic equipment, wearable health monitors) and IT and telecommunication (data centers, networking equipment, 5g infrastructure). Based on end user, the market is segmented into automotive, consumer electronics, healthcare, agriculture, manufacturing, and others. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & and Africa.

Driver of the Global Semiconductor Capital Equipment Market

The Global Semiconductor Capital Equipment market is primarily driven by the rising demand for electrical appliances, particularly in the consumer electronics sector, which is experiencing rapid growth. This surge is largely fueled by the increasing popularity of smartphones amidst a rising global population, serving as a key catalyst for market expansion. The heightened consumption of electronic devices such as tablets, laptops, and wearable technology propels industry growth. Moreover, as semiconductor technology advances, innovative market segments, including machine learning devices, are swiftly incorporated, further elevating the demand for semiconductor capital equipment and shaping the future landscape of the industry.

Restraints in the Global Semiconductor Capital Equipment Market

Restraints in the Global Semiconductor Capital Equipment market include significant premature expenditures, which pose challenges for stakeholders. The dynamics of the copper and semiconductor segments contribute to this issue, as their operational frameworks are influenced by market conditions and external factors. These conditions, compounded by the influx of skilled labor, have a pronounced impact on investment strategies and project timelines. As a result, the interplay of these elements may lead to financial strain and inefficiencies, ultimately affecting the overall growth and stability of the semiconductor capital equipment sector in a competitive global landscape.

Market Trends of the Global Semiconductor Capital Equipment Market

The Global Semiconductor Capital Equipment market is poised for significant expansion between 2024 and 2031, largely driven by the emergence of 5G technology. This transformative period is expected to see the market size double, fueled by escalating demand for advanced applications, including autonomous vehicles and virtual reality solutions. As industries innovate and integrate high-speed connectivity into their platforms, the need for sophisticated semiconductor manufacturing equipment will surge. Consequently, players in the semiconductor capital equipment space are likely to capitalize on this trend, investing in research, development, and production capacities to meet the burgeoning requirements of next-generation technologies.

Table of Contents

Introduction

  • Objectives of the Study
  • Scope of the Report
  • Definitions

Research Methodology

  • Information Procurement
  • Secondary & Primary Data Methods
  • Market Size Estimation
  • Market Assumptions & Limitations

Executive Summary

  • Global Market Outlook
  • Supply & Demand Trend Analysis
  • Segmental Opportunity Analysis

Market Dynamics & Outlook

  • Market Overview
  • Market Size
  • Market Dynamics
    • Driver & Opportunities
    • Restraints & Challenges
  • Porters Analysis & Impact
    • Competitive rivalry
    • Threat of substitute
    • Bargaining power of buyers
    • Threat of new entrants
    • Bargaining power of suppliers

Key Market Insights

  • Key Success Factors
  • Degree of Competition
  • Top Investment Pockets
  • Market Ecosystem
  • Technological Advancement
  • Regulatory Landscape
  • Patent Analysis
  • Value Chain Analysis
  • Case Study Analysis
  • Customer & Buying Criteria Analysis
  • PESTEL Analysis
  • Macro-Economic Indicators
  • Market Attractiveness Index
  • Pricing Analysis

Semiconductor Capital Equipment Market Size by Type & CAGR (2024-2031)

  • Market Overview
  • Wafer-Level Manufacturing Equipment
    • Lithography Equipment
    • Etching Equipment
    • Deposition Equipment
    • Chemical Mechanical Planarization (CMP) Equipment
    • Cleaning Equipment
  • Assembly and Packaging Equipment
    • Die Bonders
    • Wire Bonders
    • Flip Chip Bonders
    • Encapsulation Equipment
  • Automated Test Equipment (ATE)
    • Memory Test Systems
    • Non-Memory Test Systems
    • Discrete Test Systems

Semiconductor Capital Equipment Market Size by Process Type & CAGR (2024-2031)

  • Market Overview
    • Wafer Processing
    • Surface Conditioning
    • Chemical Mechanical Planarization (CMP)
    • Chemical Vapor Deposition (CVD)
    • Physical Vapor Deposition (PVD)
    • Ion Implantation
  • Assembly and Packaging
    • Wafer Bonding
    • Die Attach
    • Wire Bonding
    • Encapsulation
  • Testing
    • Electrical Testing
    • Functional Testing
    • Burn-In Testing

Semiconductor Capital Equipment Market Size by Industry Vertical & CAGR (2024-2031)

  • Market Overview
  • Consumer Electronics
    • Smartphones
    • Tablets
    • Laptops
    • Wearables
  • Automotive
    • Advanced Driver Assistance Systems (ADAS)
    • Infotainment Systems
    • Electric Vehicles (EVs)
    • Autonomous Vehicles
  • Healthcare
    • Medical Devices
    • Diagnostic Equipment
    • Wearable Health Monitors
  • IT and Telecommunication
    • Data Centers
    • Networking Equipment
    • 5G Infrastructure

Semiconductor Capital Equipment Market Size & CAGR (2024-2031)

  • North America, (Type, Process Type, Industry Vertical)
    • US
    • Canada
  • Europe, (Type, Process Type, Industry Vertical)
    • UK
    • Germany
    • Spain
    • France
    • Italy
    • Rest of Europe
  • Asia-Pacific, (Type, Process Type, Industry Vertical)
    • China
    • India
    • Japan
    • South Korea
    • Rest of Asia Pacific
  • Latin America, (Type, Process Type, Industry Vertical)
    • Brazil
    • Rest of Latin America
  • Middle East & Africa, (Type, Process Type, Industry Vertical)
    • GCC Countries
    • South Africa
    • Rest of Middle East & Africa

Competitive Intelligence

  • Top 5 Player Comparison
  • Market Positioning of Key Players, 2023
  • Strategies Adopted by Key Market Players
  • Recent Developments in the Market
  • Company Market Share Analysis, 2023
  • Company Profiles of All Key Players
    • Company Details
    • Product Portfolio Analysis
    • Company's Segmental Share Analysis
    • Revenue Y-O-Y Comparison (2021-2023)

Key Company Profiles

  • Applied Materials, Inc.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • ASML Holding N.V.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Tokyo Electron Limited
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Lam Research Corporation
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • KLA Corporation
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Advantest Corporation
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Teradyne Inc.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Screen Holdings Co., Ltd.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Hitachi High-Technologies Corporation
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • ASM International N.V.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Kulicke & Soffa Industries, Inc.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Nikon Corporation
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Canon Inc.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Plasma-Therm LLC
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Veeco Instruments Inc.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Nova Measuring Instruments Ltd.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Ontoo Innovation
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Camtek Ltd.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • ACCRETECH - Tokyo Seimitsu Co., Ltd.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Ultratech, Inc.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments

Conclusion & Recommendation