查看购物车
  • Traditional Chinese
  • English
  • Japanese
  • Korean
封面
市场调查报告书
商品编码
1577174

先进半导体封装市场预测至 2030 年：按封装类型、装置类型、材料类型、技术、应用、最终用户和地区进行的全球分析

Advanced Semiconductor Packaging Market Forecasts to 2030 - Global Analysis By Packaging Type, Device Type, Material Type, Technology, Application, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3个工作天内

价格

根据Stratistics MRC预测，2024年全球先进半导体封装市场规模将达345亿美元，预计2030年将达到524亿美元，预测期内复合年增长率为7.2%。

先进半导体封装包括旨在透过创新封装解决方案提高积体电路性能和效率的最尖端科技。这包括 3D 堆迭、系统级封装(SiP) 和小晶片架构等技术，以实现进一步小型化和改进温度控管。透过优化半导体元件的布局和连接，先进封装可实现更快的资料传输和更低的功耗。

电子设备的需求增加

随着消费性电子产品、物联网设备和汽车技术变得更加复杂和功能丰富，对高效能、高效能封装解决方案的需求正在迅速增加。先进的封装技术能够以较小的外形规格实现更强大的功能，并支援小型化和能源效率等趋势。此外，人工智慧和5G连接的兴起也进一步推动了这项需求。这些技术需要高度整合和强大的性能，进一步加速市场扩张。

整合的复杂性

半导体设计日益复杂，增加了缺陷的可能性，增加了故障率，并降低了产量比率。此外，复杂的互连和依赖性使製造过程变得复杂，增加了生产时间和成本。这种复杂性也使得难以确保可靠性和温度控管，从而阻碍电子设备的整体性能并限制产业创新。

技术进步

3D 封装、小晶片架构和扇出晶圆级封装等创新可提高效能，同时缩小尺寸和功耗。穿透硅通孔(TSV) 和先进温度控管解决方案等技术可改善连接性和散热性。这些进步不仅可以提高整合密度和更快的资料传输速率，还可以支援人工智慧、5G 和物联网 (IoT) 设备等新应用，从而推动产业成长。

製造成本高

市场上的高製造成本会严重阻碍产业成长和创新。随着包装技术变得更加复杂，与材料、设备和技术纯熟劳工相关的成本也变得越来越复杂。这些财务负担导致製造商利润率下降，并限制他们投资研发的能力。此外，成本上升可能会阻碍先进封装解决方案的采用，并减缓各领域的技术进步。

COVID-19 的影响：

COVID-19 大流行对市场产生了重大影响，扰乱了供应链并导致製造延误。封锁和监管措施导致生产设施暂时停止，导致零件严重短缺。由于远距工作和数位转型，对电子产品的需求增加进一步加剧了市场压力。虽然疫情凸显了先进封装对于高效、紧凑设备的重要性，但它也暴露了全球供应网络的脆弱性，迫使企业重新考虑筹资策略并建立更具弹性的系统来鼓励投资。

预计有机基板部分在预测期内将是最大的

预计有机基板部分在预测期内将占据最大的市场占有率。这些基板具有多种优点，包括轻质特性和与各种製造流程的兼容性。它还支援复杂的电路设计并支援现代电子产品所必需的高密度互连。此外，有机基板还有助于提高热性能和可靠性，使其成为消费电子、通讯和汽车行业等应用的理想选择。

预计影像感测器领域在预测期内的复合年增长率最高。

预计影像感测器领域在预测期内复合年增长率最高。这些感测器需要先进的封装解决方案来提高性能、提高整合度并最大限度地减小尺寸，同时保持影像品质。随着智慧型手机、汽车和安全系统等应用需求的不断增加，对影像感测器的有效温度控管和保护的关注至关重要，这将进一步推动半导体封装的进步。

占比最大的地区：

北美地区专注于技术创新和研究，预计在预测期内将占据最大的市场占有率。此外，旨在加强国内製造能力和减少供应链脆弱性的政府措施正在为半导体封装的进步创造有利的环境，使该地区成为全球事务的主要参与者。

复合年增长率最高的地区：

在消费电子和汽车等各行业强劲需求的推动下，预计亚太地区在预测期内将实现最高成长率。消费性电子产品采用的快速成长和通讯技术的进步正在推动对先进封装解决方案的需求。旨在提高国内製造能力和吸引外国投资的各种政府政策进一步增强了市场活力。

免费客製化服务：

订阅此报告的客户可以存取以下免费自订选项之一：

  • 公司简介
    • 其他市场参与者的综合分析（最多 3 家公司）
    • 主要企业SWOT分析（最多3家企业）
  • 区域分割
    • 根据客户兴趣对主要国家的市场估计、预测和复合年增长率（註：基于可行性检查）
  • 竞争标基准化分析
    • 根据产品系列、地理分布和策略联盟对主要企业基准化分析

目录

第一章执行摘要

第二章 前言

  • 概述
  • 相关利益者
  • 调查范围
  • 调查方法
    • 资料探勘
    • 资料分析
    • 资料检验
    • 研究途径
  • 研究资讯来源
    • 主要研究资讯来源
    • 二次研究资讯来源
    • 先决条件

第三章市场趋势分析

  • 促进因素
  • 抑制因素
  • 机会
  • 威胁
  • 技术分析
  • 应用分析
  • 最终用户分析
  • 新兴市场
  • COVID-19 的影响

第4章波特五力分析

  • 供应商的议价能力
  • 买方议价能力
  • 替代品的威胁
  • 新进入者的威胁
  • 竞争公司之间的敌对关係

第五章全球先进半导体封装市场：依封装类型

  • QR 图封装
  • 3D包装
  • 系统级封装(SiP)
  • 扇出晶圆级封装 (FOWLP)
  • 覆晶封装
  • 其他封装类型

第六章全球先进半导体封装市场：按元件类型

  • 逻辑装置
  • 储存装置
  • 功率元件

第七章全球先进半导体封装市场：依材料类型

  • 硅
  • 有机基材物
  • 陶瓷製品
  • 玻璃
  • 其他材料类型

第八章全球先进半导体封装市场：依技术分类

  • 晶圆级封装 (WLP)
  • 多晶片封装 (MCP)
  • 穿透硅通孔(TSV)

第九章全球先进半导体封装市场：依应用分类

  • 处理器
  • 图形处理单元（GPU）
  • 动态随机存取记忆体 (DRAM)
  • NAND快闪记忆体
  • 影像感测器
  • 其他用途

第10章全球先进半导体封装市场：依最终用户分类

  • 通讯
  • 车
  • 航太和国防
  • 医疗设备
  • 家电
  • 其他最终用户

第十一章全球先进半导体封装市场：按地区

  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 欧洲
    • 德国
    • 英国
    • 义大利
    • 法国
    • 西班牙
    • 其他欧洲国家
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 澳洲
    • 纽西兰
    • 韩国
    • 其他亚太地区
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地区
  • 中东/非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 卡达
    • 南非
    • 其他中东和非洲

第十二章 主要进展

  • 合约、伙伴关係、合作和合资企业
  • 收购和合併
  • 新产品发布
  • 业务拓展
  • 其他关键策略

第十三章 公司概况

  • Samsung Electronics
  • Intel Corporation
  • Qualcomm Technologies Inc.
  • IBM
  • Microchip Technology
  • Renesas Electronics Corporation
  • Texas Instruments
  • Analog Devices
  • STMicroelectronics
  • Infineon Technologies AG
  • Avery Dennison Corporation
  • Sumitomo Chemical Co., Ltd.
  • Powertech Technology Inc.
  • Fujitsu Semiconductor Ltd.
  • NVIDIA Corporation
  • LG Chem
Product Code: SMRC27491

According to Stratistics MRC, the Global Advanced Semiconductor Packaging Market is accounted for $34.5 billion in 2024 and is expected to reach $52.4 billion by 2030 growing at a CAGR of 7.2% during the forecast period. Advanced Semiconductor Packaging involves cutting-edge techniques designed to enhance the performance and efficiency of integrated circuits through innovative packaging solutions. This includes methods like 3D stacking, system-in-package (SiP), and chiplet architectures, enabling greater miniaturization and improved thermal management. By optimizing the arrangement and connections of semiconductor components, advanced packaging achieves faster data transfer and lower power consumption.

Market Dynamics:

Driver:

Increased demand for electronics

As consumer electronics, IoT devices, and automotive technologies become more complex and feature-rich, the need for efficient, high-performance packaging solutions has surged. Advanced packaging techniques enable greater functionality in smaller form factors, catering to trends like miniaturization and energy efficiency. Additionally, the rise of artificial intelligence and 5G connectivity further propels this demand, as these technologies require advanced integration and robust performance, reinforcing the market's expansion.

Restraint:

Complexity of integration

Increasing complexity in semiconductor designs raises the possibility of flaws, which raises failure rates and lowers yield. Moreover, the intricate interconnections and dependencies can complicate the manufacturing process, resulting in longer production times and elevated costs. This complexity also makes it difficult to ensure reliability and thermal management, potentially hindering the overall performance of electronic devices and limiting innovation in the industry.

Opportunity:

Technological advancements

Innovations such as 3D packaging, chiplet architectures, and fan-out wafer-level packaging enhance performance while reducing size and power consumption. Techniques like through-silicon vias (TSVs) and advanced thermal management solutions improve connectivity and heat dissipation. These advancements not only enable higher integration density and faster data transfer rates but also support emerging applications in artificial intelligence, 5G, and Internet of Things (IoT) devices, driving industry growth.

Threat:

High manufacturing costs

High manufacturing costs in the market can significantly hinder industry growth and innovation. As the complexity of packaging technologies increases, so do the expenses associated with materials, equipment, and skilled labor. This financial burden can lead to reduced profit margins for manufacturers, limiting their ability to invest in research and development. Additionally, elevated costs can impede the widespread adoption of advanced packaging solutions, slowing down technological advancements across various sectors.

Covid-19 Impact:

The COVID-19 pandemic had a profound impact on the market, disrupting supply chains and causing delays in manufacturing. Lockdowns and restrictions led to a temporary shutdown of production facilities, exacerbating component shortages. Increased demand for electronics driven by remote work and digital transformation-further strained the market. While the pandemic highlighted the importance of advanced packaging for efficient and compact devices, it also exposed vulnerabilities in global supply networks, prompting companies to rethink sourcing strategies and invest in more resilient systems.

The organic substrates segment is projected to be the largest during the forecast period

The organic substrates segment is projected to account for the largest market share during the projection period. These substrates offer several advantages, including lightweight properties, compatibility with various fabrication processes. They enable intricate circuit designs and support high-density interconnections, essential for modern electronics. Additionally, organic substrates contribute to improved thermal performance and reliability, making them ideal for applications in consumer electronics, telecommunications, and automotive industries.

The image sensors segment is expected to have the highest CAGR during the forecast period

The image sensors segment is expected to have the highest CAGR during the extrapolated period. These sensors require advanced packaging solutions to enhance performance, improve integration, and minimize size while maintaining image quality. With rising demand in applications such as smartphones, automotive, and security systems, the focus on effective thermal management and protection for image sensors is essential, further propelling advancements in semiconductor packaging.

Region with largest share:

North America region is projected to account for the largest market share during the forecast period fueled by the region's strong emphasis on technological innovation and research. Additionally, government initiatives aimed at strengthening domestic manufacturing capabilities and reducing supply chain vulnerabilities are fostering a favorable environment for advancements in semiconductor packaging, positioning the region as a key player in the global landscape.

Region with highest CAGR:

Asia Pacific is expected to register the highest growth rate over the forecast period driven by robust demand from various sectors including consumer electronics, automotive. The surge in consumer electronics adoption and advancements in telecommunications technologies are fueling the demand for advanced packaging solutions. Various government policies aimed at boosting local manufacturing capabilities and attracting foreign investments are further enhancing market dynamics.

Key players in the market

Some of the key players in Advanced Semiconductor Packaging market include Samsung Electronics, Intel Corporation, Qualcomm Technologies Inc., IBM, Microchip Technology, Renesas Electronics Corporation, Texas Instruments, Analog Devices, STMicroelectronics, Infineon Technologies AG, Avery Dennison Corporation, Sumitomo Chemical Co., Ltd., Powertech Technology Inc.Fujitsu Semiconductor Ltd., NVIDIA Corporation and LG Chem.

Key Developments:

In August 2024, Veeco Instruments Inc. announced that IBM selected the WaferStorm(R) Wet Processing System for Advanced Packaging applications and has entered into a joint development agreement to explore advanced packaging applications using multiple wet processing technologies from Veeco.

In June 2024, Rapidus Corporation and IBM announced a joint development partnership aimed at establishing mass production technologies for chiplet packages. Through this agreement, Rapidus will receive packaging technology from IBM for high-performance semiconductors, and the two companies will collaborate with the aim to further innovate in this space.

Packaging Types Covered:

  • 2D Packaging
  • 3D Packaging
  • System-in-Package (SiP)
  • Fan-Out Wafer-Level Packaging (FOWLP)
  • Flip Chip Packaging
  • Other Packaging Types

Device Types Covered:

  • Logic Devices
  • Memory Devices
  • Power Devices

Material Types Covered:

  • Silicon
  • Organic Substrates
  • Ceramic
  • Glass
  • Other Material Types

Technologies Covered:

  • Wafer-Level Packaging (WLP)
  • Multi-Chip Packages (MCP)
  • Through-Silicon Via (TSV)

Applications Covered:

  • Processor
  • Graphical Processing Units (GPUs)
  • Dynamic Random Access Memory (DRAM)
  • NAND Flash Memory
  • Image Sensors
  • Other Applications

End Users Covered:

  • Telecommunications
  • Automotive
  • Aerospace and Defense
  • Medical Devices
  • Consumer Electronics
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Technology Analysis
  • 3.7 Application Analysis
  • 3.8 End User Analysis
  • 3.9 Emerging Markets
  • 3.10 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Advanced Semiconductor Packaging Market, By Packaging Type

  • 5.1 Introduction
  • 5.2 2D Packaging
  • 5.3 3D Packaging
  • 5.4 System-in-Package (SiP)
  • 5.5 Fan-Out Wafer-Level Packaging (FOWLP)
  • 5.6 Flip Chip Packaging
  • 5.7 Other Packaging Types

6 Global Advanced Semiconductor Packaging Market, By Device Type

  • 6.1 Introduction
  • 6.2 Logic Devices
  • 6.3 Memory Devices
  • 6.4 Power Devices

7 Global Advanced Semiconductor Packaging Market, By Material Type

  • 7.1 Introduction
  • 7.2 Silicon
  • 7.3 Organic Substrates
  • 7.4 Ceramic
  • 7.5 Glass
  • 7.6 Other Material Types

8 Global Advanced Semiconductor Packaging Market, By Technology

  • 8.1 Introduction
  • 8.2 Wafer-Level Packaging (WLP)
  • 8.3 Multi-Chip Packages (MCP)
  • 8.4 Through-Silicon Via (TSV)

9 Global Advanced Semiconductor Packaging Market, By Application

  • 9.1 Introduction
  • 9.2 Processor
  • 9.3 Graphical Processing Units (GPUs)
  • 9.4 Dynamic Random Access Memory (DRAM)
  • 9.5 NAND Flash Memory
  • 9.6 Image Sensors
  • 9.7 Other Applications

10 Global Advanced Semiconductor Packaging Market, By End User

  • 10.1 Introduction
  • 10.2 Telecommunications
  • 10.3 Automotive
  • 10.4 Aerospace and Defense
  • 10.5 Medical Devices
  • 10.6 Consumer Electronics
  • 10.7 Other End Users

11 Global Advanced Semiconductor Packaging Market, By Geography

  • 11.1 Introduction
  • 11.2 North America
    • 11.2.1 US
    • 11.2.2 Canada
    • 11.2.3 Mexico
  • 11.3 Europe
    • 11.3.1 Germany
    • 11.3.2 UK
    • 11.3.3 Italy
    • 11.3.4 France
    • 11.3.5 Spain
    • 11.3.6 Rest of Europe
  • 11.4 Asia Pacific
    • 11.4.1 Japan
    • 11.4.2 China
    • 11.4.3 India
    • 11.4.4 Australia
    • 11.4.5 New Zealand
    • 11.4.6 South Korea
    • 11.4.7 Rest of Asia Pacific
  • 11.5 South America
    • 11.5.1 Argentina
    • 11.5.2 Brazil
    • 11.5.3 Chile
    • 11.5.4 Rest of South America
  • 11.6 Middle East & Africa
    • 11.6.1 Saudi Arabia
    • 11.6.2 UAE
    • 11.6.3 Qatar
    • 11.6.4 South Africa
    • 11.6.5 Rest of Middle East & Africa

12 Key Developments

  • 12.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 12.2 Acquisitions & Mergers
  • 12.3 New Product Launch
  • 12.4 Expansions
  • 12.5 Other Key Strategies

13 Company Profiling

  • 13.1 Samsung Electronics
  • 13.2 Intel Corporation
  • 13.3 Qualcomm Technologies Inc.
  • 13.4 IBM
  • 13.5 Microchip Technology
  • 13.6 Renesas Electronics Corporation
  • 13.7 Texas Instruments
  • 13.8 Analog Devices
  • 13.9 STMicroelectronics
  • 13.10 Infineon Technologies AG
  • 13.11 Avery Dennison Corporation
  • 13.12 Sumitomo Chemical Co., Ltd.
  • 13.13 Powertech Technology Inc.
  • 13.14 Fujitsu Semiconductor Ltd.
  • 13.15 NVIDIA Corporation
  • 13.16 LG Chem

List of Tables

  • Table 1 Global Advanced Semiconductor Packaging Market Outlook, By Region (2022-2030) ($MN)
  • Table 2 Global Advanced Semiconductor Packaging Market Outlook, By Packaging Type (2022-2030) ($MN)
  • Table 3 Global Advanced Semiconductor Packaging Market Outlook, By 2D Packaging (2022-2030) ($MN)
  • Table 4 Global Advanced Semiconductor Packaging Market Outlook, By 3D Packaging (2022-2030) ($MN)
  • Table 5 Global Advanced Semiconductor Packaging Market Outlook, By System-in-Package (SiP) (2022-2030) ($MN)
  • Table 6 Global Advanced Semiconductor Packaging Market Outlook, By Fan-Out Wafer-Level Packaging (FOWLP) (2022-2030) ($MN)
  • Table 7 Global Advanced Semiconductor Packaging Market Outlook, By Flip Chip Packaging (2022-2030) ($MN)
  • Table 8 Global Advanced Semiconductor Packaging Market Outlook, By Other Packaging Types (2022-2030) ($MN)
  • Table 9 Global Advanced Semiconductor Packaging Market Outlook, By Device Type (2022-2030) ($MN)
  • Table 10 Global Advanced Semiconductor Packaging Market Outlook, By Logic Devices (2022-2030) ($MN)
  • Table 11 Global Advanced Semiconductor Packaging Market Outlook, By Memory Devices (2022-2030) ($MN)
  • Table 12 Global Advanced Semiconductor Packaging Market Outlook, By Power Devices (2022-2030) ($MN)
  • Table 13 Global Advanced Semiconductor Packaging Market Outlook, By Material Type (2022-2030) ($MN)
  • Table 14 Global Advanced Semiconductor Packaging Market Outlook, By Silicon (2022-2030) ($MN)
  • Table 15 Global Advanced Semiconductor Packaging Market Outlook, By Organic Substrates (2022-2030) ($MN)
  • Table 16 Global Advanced Semiconductor Packaging Market Outlook, By Ceramic (2022-2030) ($MN)
  • Table 17 Global Advanced Semiconductor Packaging Market Outlook, By Glass (2022-2030) ($MN)
  • Table 18 Global Advanced Semiconductor Packaging Market Outlook, By Other Material Types (2022-2030) ($MN)
  • Table 19 Global Advanced Semiconductor Packaging Market Outlook, By Technology (2022-2030) ($MN)
  • Table 20 Global Advanced Semiconductor Packaging Market Outlook, By Wafer-Level Packaging (WLP) (2022-2030) ($MN)
  • Table 21 Global Advanced Semiconductor Packaging Market Outlook, By Multi-Chip Packages (MCP) (2022-2030) ($MN)
  • Table 22 Global Advanced Semiconductor Packaging Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
  • Table 23 Global Advanced Semiconductor Packaging Market Outlook, By Application (2022-2030) ($MN)
  • Table 24 Global Advanced Semiconductor Packaging Market Outlook, By Processor (2022-2030) ($MN)
  • Table 25 Global Advanced Semiconductor Packaging Market Outlook, By Graphical Processing Units (GPUs) (2022-2030) ($MN)
  • Table 26 Global Advanced Semiconductor Packaging Market Outlook, By Dynamic Random Access Memory (DRAM) (2022-2030) ($MN)
  • Table 27 Global Advanced Semiconductor Packaging Market Outlook, By NAND Flash Memory (2022-2030) ($MN)
  • Table 28 Global Advanced Semiconductor Packaging Market Outlook, By Image Sensors (2022-2030) ($MN)
  • Table 29 Global Advanced Semiconductor Packaging Market Outlook, By Other Applications (2022-2030) ($MN)
  • Table 30 Global Advanced Semiconductor Packaging Market Outlook, By End User (2022-2030) ($MN)
  • Table 31 Global Advanced Semiconductor Packaging Market Outlook, By Telecommunications (2022-2030) ($MN)
  • Table 32 Global Advanced Semiconductor Packaging Market Outlook, By Automotive (2022-2030) ($MN)
  • Table 33 Global Advanced Semiconductor Packaging Market Outlook, By Aerospace and Defense (2022-2030) ($MN)
  • Table 34 Global Advanced Semiconductor Packaging Market Outlook, By Medical Devices (2022-2030) ($MN)
  • Table 35 Global Advanced Semiconductor Packaging Market Outlook, By Consumer Electronics (2022-2030) ($MN)
  • Table 36 Global Advanced Semiconductor Packaging Market Outlook, By Other End Users (2022-2030) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.