封面
市场调查报告书
商品编码
1946110

全球极微影术元件市场:预测(至2034年)-按装置类型、材料类型、技术、应用、最终使用者和地区分類的分析

EUV Lithography Components Market Forecasts to 2034 - Global Analysis By Component Type, Material Type, Technology, Application, End User, and By Geography

出版日期: | 出版商: Stratistics Market Research Consulting | 英文 | 商品交期: 2-3个工作天内

价格

根据 Stratistics MRC 的研究,预计到 2026 年,全球 EUV微影术零件市场将达到 44 亿美元,并在预测期内以 8.8% 的复合年增长率成长,到 2034 年达到 88 亿美元。

EUV微影术组件专注于极紫外半导体製造设备中的关键子系统,包括光源、反射镜、光学元件、真空系统、光罩和精密平台。这为关键製程节点上的先进逻辑和记忆体製造奠定了基础。推动该产业成长的因素包括:对更小、更高效能晶片的持续需求、代工厂的大规模资本投资、人工智慧和高效能运算工作负载的扩展,以及高精度组件供应商的供应限制。

根据 ASML 公开的讯息,EUV 系统的工作波长为 13.5 奈米,每个设备都包含超过 100,000 个精密组件。

对先进逻辑和记忆体晶片的需求

随着人工智慧和5G基础设施对更高密度电晶体的需求日益增长,传统微影术技术的实体解析度已接近极限。 EUV元件能够在单次曝光中形成7奈米或更小的微结构,显着减少了对复杂多重图形化方法的需求。这种高效性不仅有助于提高逻辑处理器的产量比率,还有助于向下一代架构过渡,并确保领先代工厂的稳定需求,从而助力厂商延续摩尔定律。

技术复杂程度极高,高成本极为昂贵。

一套完整的扫描系统需要整合二氧化碳雷射和液滴产生器等组件,这些组件必须在真空条件下近乎完美地同步运作。即使不包括无尘室所需的大规模基础设施,这些系统的成本通常超过1.5亿美元,这使得许多二线半导体製造商难以证明投资的合理性。如此高的进入门槛将基本客群限制在少数几家全球巨头,并可能阻碍整个中阶市场设备生态系统的广泛创新。

拓展高容量DRAM和NAND生产

为满足DDR5及更高版本所需的位元密度,各大记忆体製造商正加速将EUV微影技术融入其DRAM蓝图。随着这些製造商从试生产转向大规模量产,对高反射率光刻掩模和特殊抗蚀剂材料的需求预计将呈指数级增长。这项转变将为供应商提供稳定的长期收入来源,使其产品组合摆脱对波动较大的逻辑元件领域的依赖,并透过提高产量来稳定整个供应链。

地缘政治出口限制扰乱供应链。

严格的出口限制,特别是针对先进微影术设备及其组件的限制,可能会扰乱全球市场。这些限制可能会突然切断关键製造地的准入,迫使供应商陷入供应链碎片化。这种中断不仅会导致即时的收入损失,还会刺激受管制地区获得补贴的国内竞争对手崛起。这种地缘政治摩擦将造成长期的不确定性,使研发计画和跨国製造资源的有效配置变得更加复杂。

新冠疫情的感染疾病:

疫情初期导致供应链严重受阻,全球物流中断,关键光学模组和精密感测器的交付也因此延误。然而,这场危机也加速了以「在家工作」为中心的数位转型,导致笔记型电脑、伺服器和资料中心基础设施的需求空前激增。终端用户需求的激增迫使半导体製造商加快极紫外光微影(EUV)技术的部署,以扩大产能。儘管现场安装工作受到人手不足的阻碍,但市场展现出了韧性,最终促成了更强大、更多元化的筹资策略的建立。

在预测期内,测量和检测模组领域预计将占据最大的市场份额。

预计在预测期内,测量和检测模组领域将占据最大的市场份额。随着电路图案变得极其微小,公差几乎消失殆尽,即时缺陷检测和晶圆对准的重要性甚至超过了曝光製程本身。先进的检测工具在製程的每个阶段都至关重要,以确保多层反射镜和掩模上不存在亚奈米级污染物。这种需求推动了对高灵敏度感测器和电子束检测系统的持续投资,预计该领域将在整个EUV组件生态系统中保持主导的财务地位。

在预测期内,记忆体製造商细分市场预计将呈现最高的复合年增长率。

在预测期内,记忆体製造商预计将呈现最高的成长率。传统上,记忆体生产依赖成本效益高的深紫外线(DUV)工艺,但DRAM物理尺寸小型化的极限使得采用极紫外线(EUV)工艺势在必行。随着三星、SK海力士和美光等公司扩展其基于EUV的生产线以满足人工智慧驱动型资料中心的需求,该领域的成长速度已超过逻辑元件领域。记忆体工厂从图形化DUV过渡到图形化EUV的将是资本支出方面最重要的转捩点。

市占率最大的地区:

在预测期内,亚太地区预计将占据最大的市场份额。这一主导地位主要归功于台湾和韩国拥有世界领先的晶圆代工厂,使该地区成为几乎所有极紫外光刻扫描仪的主要目的地。该地区成熟的半导体基础设施,加上政府主导的大规模“晶圆厂丛集”,使其成为零件需求的中心。从特种化学品到光掩模坯,供应链高度依赖这些亚洲製造地,确保该地区继续成为全球微影术投资和营运活动的焦点。

复合年增长率最高的地区:

在预测期内,亚太地区预计将呈现最高的复合年增长率。除了目前的优势地位外,该地区正经历製造业产能的快速扩张,成熟企业和新兴参与企业都在投资建造新的EUV光刻设备。东南亚的快速工业化以及对高端半导体製造自给自足的持续投入,是推动这项加速成长的主要动力。随着本地材料和子组件生态系统的日益成熟,该地区正从单纯的技术消费地转型为涵盖EUV光刻整个生命週期的高成长中心,其成长速度超过了欧美市场。

免费客製化服务:

购买此报告的客户可享有以下免费自订选项之一:

  • 企业概况
    • 对其他市场参与者(最多 3 家公司)进行全面分析
    • 主要参与者(最多3家公司)的SWOT分析
  • 区域划分
    • 主要国家的市场估算和预测,以及根据客户需求量身定制的复合年增长率(註:需要进行可行性测试)。
  • 竞争性标竿分析
    • 根据主要参与者的产品系列、地理覆盖范围和策略联盟进行基准分析。

目录

第一章执行摘要

  • 市场概览及主要亮点
  • 成长要素、挑战与机会
  • 竞争格局概述
  • 战略考虑和建议

第二章:分析框架

  • 分析的目标和范围
  • 相关人员分析
  • 分析的前提条件与限制
  • 分析方法

第三章 市场动态与趋势分析

  • 市场定义与结构
  • 主要市场驱动因素
  • 市场限制与挑战
  • 投资成长机会和重点领域
  • 产业威胁与风险评估
  • 科技与创新趋势
  • 新兴市场和高成长市场
  • 监管和政策环境
  • 感染疾病的影响及恢復前景

第四章:竞争环境与策略评估

  • 波特五力分析
    • 供应商议价能力
    • 买方的议价能力
    • 替代产品的威胁
    • 新进入者的威胁
    • 竞争公司之间的竞争
  • 主要企业市占率分析
  • 产品基准评效和效能比较

第五章 全球EUV微影术元件市场:依元件类型划分

  • 极紫外光源系统
  • 收藏家之镜
  • 投影光学系统反射镜
  • 空白光掩模
  • 薄膜
  • 晶圆台运动控制系统
  • 测量和检测模组
  • 真空室和污染控制系统
  • 电源和温度控管系统
  • 控制电子设备和软体

第六章 全球EUV微影术零件市场:依材料类型划分

  • 多层反射涂层
  • 超低热膨胀玻璃
  • 钍硅镜面材料
  • 特种陶瓷
  • 先进聚合物和复合材料
  • 精密金属/合金

第七章 全球EUV微影术元件市场:依技术划分

  • 7奈米或更小
  • 5nm
  • 3nm
  • 亚3nm、高数值孔径EUV平台

第八章 全球EUV微影术元件市场:依应用领域划分

  • 逻辑半导体製造
  • 先进记忆体製造
    • DRAM
    • NAND快闪记忆体
  • 铸造服务
  • 研究与开发设施

第九章 全球EUV微影术元件市场:依最终用户划分

  • 整合装置製造商 (IDM)
  • 专注于晶圆代工的製造商
  • 记忆体製造商
  • 半导体研究所

第十章 全球EUV微影术元件市场:依地区划分

  • 北美洲
    • 我们
    • 加拿大
    • 墨西哥
  • 欧洲
    • 英国
    • 德国
    • 法国
    • 义大利
    • 西班牙
    • 荷兰
    • 比利时
    • 瑞典
    • 瑞士
    • 波兰
    • 其他欧洲国家
  • 亚太地区
    • 中国
    • 日本
    • 印度
    • 韩国
    • 澳洲
    • 印尼
    • 泰国
    • 马来西亚
    • 新加坡
    • 越南
    • 亚太其他地区
  • 南美洲
    • 巴西
    • 阿根廷
    • 哥伦比亚
    • 智利
    • 秘鲁
    • 南美洲其他地区
  • 世界其他地区(RoW)
    • 中东
      • 沙乌地阿拉伯
      • 阿拉伯聯合大公国
      • 卡达
      • 以色列
      • 其他中东国家
    • 非洲
      • 南非
      • 埃及
      • 摩洛哥
      • 其他非洲国家

第十一章 策略市场资讯

  • 产业加值网络与供应链评估
  • 空白区域和机会地图
  • 产品演进与市场生命週期分析
  • 通路、经销商和打入市场策略的评估

第十二章 产业趋势与策略倡议

  • 企业合併(M&A)
  • 伙伴关係、联盟和合资企业
  • 新产品发布和认证
  • 扩大生产能力和投资
  • 其他策略倡议

第十三章:公司简介

  • ASML Holding NV
  • Carl Zeiss AG
  • Trumpf GmbH + Co. KG
  • KLA Corporation
  • Ushio Inc.
  • HOYA Corporation
  • AGC Inc.
  • Lasertec Corporation
  • NuFlare Technology Inc.
  • Photronics, Inc.
  • Rigaku Corporation
  • Energetiq Technology, Inc.
  • SUSS MicroTec SE
  • Edmund Optics Inc.
  • TRUMPF Group
Product Code: SMRC33884

According to Stratistics MRC, the Global EUV Lithography Components Market is accounted for $4.4 billion in 2026 and is expected to reach $8.8 billion by 2034 growing at a CAGR of 8.8% during the forecast period. The EUV lithography components focus on critical subsystems used in extreme ultraviolet semiconductor manufacturing equipment, including light sources, mirrors, optics, vacuum systems, masks, and precision stages. It supports advanced logic and memory fabrication at leading process nodes. Growth is driven by continued demand for smaller and more powerful chips, large capital investments by foundries, expansion of AI and high-performance computing workloads, and limited availability of high-precision component suppliers.

According to ASML public disclosures, EUV systems operate with 13.5-nanometer wavelength and each tool contains over 100,000 precision components.

Market Dynamics:

Driver:

Demand for advanced logic and memory chips

As artificial intelligence and 5G infrastructure demand chips with higher transistor densities, traditional optical lithography reaches its physical resolution limits. EUV components enable the patterning of sub-7nm features in a single exposure, significantly reducing the need for complex multi-patterning schemes. This efficiency not only improves yield for logic processors but also drives the transition to next-generation architectures, ensuring that component suppliers see consistent demand from leading-edge foundries aiming to maintain Moore's Law.

Restraint:

Extreme technical complexity and astronomically high cost

A single scanner requires integrated components like CO2 lasers and droplet generators that must operate with near-perfect synchronization in a vacuum environment. These systems often cost upwards of $150 million, excluding the massive infrastructure upgrades required for cleanrooms. For many second-tier semiconductor manufacturers, the return on investment remains difficult to justify. This high barrier to entry restricts the customer base to a handful of global giants, potentially stifling broader innovation across the mid-market equipment ecosystem.

Opportunity:

Expansion into high-volume DRAM and NAND production

Memory giants are increasingly integrating EUV layers into their DRAM roadmaps to achieve the bit density required for DDR5 and beyond. As these manufacturers move from pilot lines to full-scale production, the demand for high-reflectivity masks and specialized resist materials is expected to scale exponentially. This transition provides a steady, long-term revenue stream for suppliers, diversifying their portfolios beyond the volatile logic sector and stabilizing the overall supply chain through increased volume.

Threat:

Geopolitical export controls disrupting supply

Stringent export controls, particularly those targeting advanced lithography tools and their constituent components, threaten to fragment the global market. These regulations can abruptly cut off access to major manufacturing hubs, forcing suppliers to navigate a "decoupled" supply chain. Such disruptions not only lead to immediate revenue losses but also encourage the emergence of subsidized domestic competitors in restricted regions. This geopolitical friction creates long-term uncertainty, complicating R&D planning and the efficient allocation of manufacturing resources across international borders.

Covid-19 Impact:

The pandemic initially triggered severe supply chain bottlenecks, delaying the delivery of critical optical modules and precision sensors due to global logistics shutdowns. However, the crisis simultaneously accelerated the "stay-at-home" digital shift, creating an unprecedented surge in demand for laptops, servers, and data center infrastructure. This spike in end-user demand forced chipmakers to pull forward their EUV adoption timelines to increase capacity. While labor shortages hampered on-site installation, the market proved resilient, ultimately emerging with a more robust, diversified procurement strategy.

The metrology and inspection modules segment is expected to be the largest during the forecast period

The metrology and inspection modules segment is expected to account for the largest market share during the forecast period. As circuit patterns become incredibly minute, the margin for error effectively disappears, making real-time defect detection and wafer alignment more critical than the printing process itself. Advanced inspection tools are required at every stage to ensure that the multi-layer mirrors and masks remain free of sub-nanometer contaminants. This necessity drives continuous investment in high-sensitivity sensors and electron-beam inspection systems, ensuring this segment retains its dominant financial position within the broader EUV component ecosystem.

The memory manufacturers segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the memory manufacturers segment is predicted to witness the highest growth rate. Traditionally, memory production relied on cost-effective Deep Ultraviolet (DUV) processes, but the physical scaling limits of DRAM have made EUV adoption inevitable. As Samsung, SK Hynix, and Micron ramp up their EUV-based production lines to meet the needs of AI-driven data centers, the growth curve for this segment is outstripping logic. The transition from multi-patterning DUV to single-patterning EUV in memory fabs represents the most significant shift in capital equipment spending.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share. This dominance is anchored by the presence of the world's leading foundries in Taiwan and South Korea, which serve as the primary destination for almost all EUV scanner shipments. The region's mature semiconductor infrastructure, combined with massive government-backed "fab clusters," creates a centralized hub for component demand. From specialized chemicals to photomask blanks, the supply chain is heavily weighted toward supporting these Asian manufacturing powerhouses, ensuring the region remains the focal point of global lithography investment and operational activity.

Region with highest CAGR:

Over the forecast period, the Asia Pacific region is anticipated to exhibit the highest CAGR. Beyond its current dominance, the region is seeing aggressive expansion in manufacturing capacity as both established players and emerging entrants invest in new EUV-capable facilities. The rapid industrialization in Southeast Asia and the continued push for self-sufficiency in high-end chipmaking drive this accelerated growth. As local ecosystems for materials and sub-components mature, the region is evolving from a mere consumer of technology to a high-growth hub for the entire EUV lifecycle, outpacing the growth rates of Western markets.

Key players in the market

Some of the key players in EUV Lithography Components Market include ASML Holding N.V., Carl Zeiss AG, Trumpf GmbH + Co. KG, KLA Corporation, Ushio Inc., HOYA Corporation, AGC Inc., Lasertec Corporation, NuFlare Technology Inc., Photronics, Inc., Rigaku Corporation, Energetiq Technology, Inc., SUSS MicroTec SE, Edmund Optics Inc., and TRUMPF Group.

Key Developments:

In January 2026, ASML announced that its High NA EUV (0.55 NA) systems have reached a milestone in customer readiness, with revenue recognized for two systems and a projected sales growth for 2026 driven by the transition to the EXE:5200 platform for 2nm logic nodes.

In January 2026, Zeiss confirmed a production ramp-up for the next generation of High NA EUV optics, which are critical components for ASML's lithography machines, enabling a 1.7x increase in transistor density over previous generations.

Components Types Covered:

  • EUV Light Source Systems
  • Collector Mirrors
  • Projection Optics Mirrors
  • Mask Blanks and Photomasks
  • Pellicles
  • Wafer Stages and Motion Control Systems
  • Metrology and Inspection Modules
  • Vacuum Chambers and Contamination Control Systems
  • Power Supply and Thermal Management Systems
  • Control Electronics and Software

Material Types Covered:

  • Multilayer Reflective Coatings
  • Ultra-Low Thermal Expansion Glass
  • Molybdenum-Silicon Mirror Materials
  • Specialty Ceramics
  • Advanced Polymers and Composites
  • Precision Metals and Alloys

Technologies Covered:

  • 7 nm and Below
  • 5 nm
  • 3 nm
  • Sub-3 nm and High-NA EUV Platforms

Applications Covered:

  • Logic Semiconductor Manufacturing
  • Advanced Memory Manufacturing
  • Foundry Services
  • Research and Development Facilities

End Users Covered:

  • Integrated Device Manufacturers (IDMs)
  • Pure-Play Foundries
  • Memory Manufacturers
  • Semiconductor Research Institutes

Regions Covered:

  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • United Kingdom
    • Germany
    • France
    • Italy
    • Spain
    • Netherlands
    • Belgium
    • Sweden
    • Switzerland
    • Poland
    • Rest of Europe
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Australia
    • Indonesia
    • Thailand
    • Malaysia
    • Singapore
    • Vietnam
    • Rest of Asia Pacific
  • South America
    • Brazil
    • Argentina
    • Colombia
    • Chile
    • Peru
    • Rest of South America
  • Rest of the World (RoW)
    • Middle East
  • Saudi Arabia
  • United Arab Emirates
  • Qatar
  • Israel
  • Rest of Middle East
    • Africa
  • South Africa
  • Egypt
  • Morocco
  • Rest of Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2023, 2024, 2025, 2026, 2027, 2028, 2030, 2032 and 2034
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

  • 1.1 Market Snapshot and Key Highlights
  • 1.2 Growth Drivers, Challenges, and Opportunities
  • 1.3 Competitive Landscape Overview
  • 1.4 Strategic Insights and Recommendations

2 Research Framework

  • 2.1 Study Objectives and Scope
  • 2.2 Stakeholder Analysis
  • 2.3 Research Assumptions and Limitations
  • 2.4 Research Methodology
    • 2.4.1 Data Collection (Primary and Secondary)
    • 2.4.2 Data Modeling and Estimation Techniques
    • 2.4.3 Data Validation and Triangulation
    • 2.4.4 Analytical and Forecasting Approach

3 Market Dynamics and Trend Analysis

  • 3.1 Market Definition and Structure
  • 3.2 Key Market Drivers
  • 3.3 Market Restraints and Challenges
  • 3.4 Growth Opportunities and Investment Hotspots
  • 3.5 Industry Threats and Risk Assessment
  • 3.6 Technology and Innovation Landscape
  • 3.7 Emerging and High-Growth Markets
  • 3.8 Regulatory and Policy Environment
  • 3.9 Impact of COVID-19 and Recovery Outlook

4 Competitive and Strategic Assessment

  • 4.1 Porter's Five Forces Analysis
    • 4.1.1 Supplier Bargaining Power
    • 4.1.2 Buyer Bargaining Power
    • 4.1.3 Threat of Substitutes
    • 4.1.4 Threat of New Entrants
    • 4.1.5 Competitive Rivalry
  • 4.2 Market Share Analysis of Key Players
  • 4.3 Product Benchmarking and Performance Comparison

5 Global EUV Lithography Components Market, By Component Type

  • 5.1 EUV Light Source Systems
  • 5.2 Collector Mirrors
  • 5.3 Projection Optics Mirrors
  • 5.4 Mask Blanks and Photomasks
  • 5.5 Pellicles
  • 5.6 Wafer Stages and Motion Control Systems
  • 5.7 Metrology and Inspection Modules
  • 5.8 Vacuum Chambers and Contamination Control Systems
  • 5.9 Power Supply and Thermal Management Systems
  • 5.10 Control Electronics and Software

6 Global EUV Lithography Components Market, By Material Type

  • 6.1 Multilayer Reflective Coatings
  • 6.2 Ultra-Low Thermal Expansion Glass
  • 6.3 Molybdenum-Silicon Mirror Materials
  • 6.4 Specialty Ceramics
  • 6.5 Advanced Polymers and Composites
  • 6.6 Precision Metals and Alloys

7 Global EUV Lithography Components Market, By Technology

  • 7.1 7 nm and Below
  • 7.2 5 nm
  • 7.3 3 nm
  • 7.4 Sub-3 nm and High-NA EUV Platforms

8 Global EUV Lithography Components Market, By Application

  • 8.1 Logic Semiconductor Manufacturing
  • 8.2 Advanced Memory Manufacturing
    • 8.2.1 DRAM
    • 8.2.2 NAND Flash
  • 8.3 Foundry Services
  • 8.4 Research and Development Facilities

9 Global EUV Lithography Components Market, By End User

  • 9.1 Integrated Device Manufacturers (IDMs)
  • 9.2 Pure-Play Foundries
  • 9.3 Memory Manufacturers
  • 9.4 Semiconductor Research Institutes

10 Global EUV Lithography Components Market, By Geography

  • 10.1 North America
    • 10.1.1 United States
    • 10.1.2 Canada
    • 10.1.3 Mexico
  • 10.2 Europe
    • 10.2.1 United Kingdom
    • 10.2.2 Germany
    • 10.2.3 France
    • 10.2.4 Italy
    • 10.2.5 Spain
    • 10.2.6 Netherlands
    • 10.2.7 Belgium
    • 10.2.8 Sweden
    • 10.2.9 Switzerland
    • 10.2.10 Poland
    • 10.2.11 Rest of Europe
  • 10.3 Asia Pacific
    • 10.3.1 China
    • 10.3.2 Japan
    • 10.3.3 India
    • 10.3.4 South Korea
    • 10.3.5 Australia
    • 10.3.6 Indonesia
    • 10.3.7 Thailand
    • 10.3.8 Malaysia
    • 10.3.9 Singapore
    • 10.3.10 Vietnam
    • 10.3.11 Rest of Asia Pacific
  • 10.4 South America
    • 10.4.1 Brazil
    • 10.4.2 Argentina
    • 10.4.3 Colombia
    • 10.4.4 Chile
    • 10.4.5 Peru
    • 10.4.6 Rest of South America
  • 10.5 Rest of the World (RoW)
    • 10.5.1 Middle East
      • 10.5.1.1 Saudi Arabia
      • 10.5.1.2 United Arab Emirates
      • 10.5.1.3 Qatar
      • 10.5.1.4 Israel
      • 10.5.1.5 Rest of Middle East
    • 10.5.2 Africa
      • 10.5.2.1 South Africa
      • 10.5.2.2 Egypt
      • 10.5.2.3 Morocco
      • 10.5.2.4 Rest of Africa

11 Strategic Market Intelligence

  • 11.1 Industry Value Network and Supply Chain Assessment
  • 11.2 White-Space and Opportunity Mapping
  • 11.3 Product Evolution and Market Life Cycle Analysis
  • 11.4 Channel, Distributor, and Go-to-Market Assessment

12 Industry Developments and Strategic Initiatives

  • 12.1 Mergers and Acquisitions
  • 12.2 Partnerships, Alliances, and Joint Ventures
  • 12.3 New Product Launches and Certifications
  • 12.4 Capacity Expansion and Investments
  • 12.5 Other Strategic Initiatives

13 Company Profiles

  • 13.1 ASML Holding N.V.
  • 13.2 Carl Zeiss AG
  • 13.3 Trumpf GmbH + Co. KG
  • 13.4 KLA Corporation
  • 13.5 Ushio Inc.
  • 13.6 HOYA Corporation
  • 13.7 AGC Inc.
  • 13.8 Lasertec Corporation
  • 13.9 NuFlare Technology Inc.
  • 13.10 Photronics, Inc.
  • 13.11 Rigaku Corporation
  • 13.12 Energetiq Technology, Inc.
  • 13.13 SUSS MicroTec SE
  • 13.14 Edmund Optics Inc.
  • 13.15 TRUMPF Group

List of Tables

  • Table 1 Global EUV Lithography Components Market Outlook, By Region (2023-2034) ($MN)
  • Table 2 Global EUV Lithography Components Market Outlook, By Component Type (2023-2034) ($MN)
  • Table 3 Global EUV Lithography Components Market Outlook, By EUV Light Source Systems (2023-2034) ($MN)
  • Table 4 Global EUV Lithography Components Market Outlook, By Collector Mirrors (2023-2034) ($MN)
  • Table 5 Global EUV Lithography Components Market Outlook, By Projection Optics Mirrors (2023-2034) ($MN)
  • Table 6 Global EUV Lithography Components Market Outlook, By Mask Blanks and Photomasks (2023-2034) ($MN)
  • Table 7 Global EUV Lithography Components Market Outlook, By Pellicles (2023-2034) ($MN)
  • Table 8 Global EUV Lithography Components Market Outlook, By Wafer Stages and Motion Control Systems (2023-2034) ($MN)
  • Table 9 Global EUV Lithography Components Market Outlook, By Metrology and Inspection Modules (2023-2034) ($MN)
  • Table 10 Global EUV Lithography Components Market Outlook, By Vacuum Chambers and Contamination Control Systems (2023-2034) ($MN)
  • Table 11 Global EUV Lithography Components Market Outlook, By Power Supply and Thermal Management Systems (2023-2034) ($MN)
  • Table 12 Global EUV Lithography Components Market Outlook, By Control Electronics and Software (2023-2034) ($MN)
  • Table 13 Global EUV Lithography Components Market Outlook, By Material Type (2023-2034) ($MN)
  • Table 14 Global EUV Lithography Components Market Outlook, By Multilayer Reflective Coatings (2023-2034) ($MN)
  • Table 15 Global EUV Lithography Components Market Outlook, By Ultra-Low Thermal Expansion Glass (2023-2034) ($MN)
  • Table 16 Global EUV Lithography Components Market Outlook, By Molybdenum-Silicon Mirror Materials (2023-2034) ($MN)
  • Table 17 Global EUV Lithography Components Market Outlook, By Specialty Ceramics (2023-2034) ($MN)
  • Table 18 Global EUV Lithography Components Market Outlook, By Advanced Polymers and Composites (2023-2034) ($MN)
  • Table 19 Global EUV Lithography Components Market Outlook, By Precision Metals and Alloys (2023-2034) ($MN)
  • Table 20 Global EUV Lithography Components Market Outlook, By Technology (2023-2034) ($MN)
  • Table 21 Global EUV Lithography Components Market Outlook, By 7 nm and Below (2023-2034) ($MN)
  • Table 22 Global EUV Lithography Components Market Outlook, By 5 nm (2023-2034) ($MN)
  • Table 23 Global EUV Lithography Components Market Outlook, By 3 nm (2023-2034) ($MN)
  • Table 24 Global EUV Lithography Components Market Outlook, By Sub-3 nm and High-NA EUV Platforms (2023-2034) ($MN)
  • Table 25 Global EUV Lithography Components Market Outlook, By Application (2023-2034) ($MN)
  • Table 26 Global EUV Lithography Components Market Outlook, By Logic Semiconductor Manufacturing (2023-2034) ($MN)
  • Table 27 Global EUV Lithography Components Market Outlook, By Advanced Memory Manufacturing (2023-2034) ($MN)
  • Table 28 Global EUV Lithography Components Market Outlook, By DRAM (2023-2034) ($MN)
  • Table 29 Global EUV Lithography Components Market Outlook, By NAND Flash (2023-2034) ($MN)
  • Table 30 Global EUV Lithography Components Market Outlook, By Foundry Services (2023-2034) ($MN)
  • Table 31 Global EUV Lithography Components Market Outlook, By Research and Development Facilities (2023-2034) ($MN)
  • Table 32 Global EUV Lithography Components Market Outlook, By End User (2023-2034) ($MN)
  • Table 33 Global EUV Lithography Components Market Outlook, By Integrated Device Manufacturers (IDMs) (2023-2034) ($MN)
  • Table 34 Global EUV Lithography Components Market Outlook, By Pure-Play Foundries (2023-2034) ($MN)
  • Table 35 Global EUV Lithography Components Market Outlook, By Memory Manufacturers (2023-2034) ($MN)
  • Table 36 Global EUV Lithography Components Market Outlook, By Semiconductor Research Institutes (2023-2034) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Rest of the World (RoW) Regions are also represented in the same manner as above.