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市场调查报告书
商品编码
1556178

2024 年先进晶片封装全球市场报告

Advanced Chip Packaging Global Market Report 2024
出版日期: | 出版商: The Business Research Company | 英文 175 Pages | 商品交期: 2-10个工作天内

价格
简介目录

先进晶片封装的市场规模预计在未来几年将快速成长。 2028年，将以18.3%的复合年增长率成长至242.9亿美元。预测期内的预期成长受到几个关键因素的推动，包括 5G 技术的普及、物联网 (IoT) 设备的扩展、人工智慧 (AI) 和机器学习的日益普及以及可穿戴技术的兴起。 。预测期内的显着趋势包括3D封装技术的使用增加、温度控管的进步、高密度互连技术的进步、扇出晶圆级封装技术的扩展以及柔性和可拉伸封装，其中包括管理的发展。

家用电子电器产品需求的成长预计将推动先进晶片封装市场的成长。家用电子电器包括智慧型手机、平板电脑、笔记型电脑等。互联网和无线网路的扩展显着增加了对这些设备的需求。先进的晶片封装技术有助于将高效能家用电子电器必需的多种功能整合到紧凑的设计中。这些技术提高了处理能力、效率和散热，从而能够创建功能丰富且紧凑的设备。例如，根据日本电子情报技术产业协会2023年5月发布的报告，消费性电子产品产值达2.095亿美元，与前一年同期比较增加127%。因此，家用电子电器的需求不断增长，推动了先进晶片封装市场的扩张。

先进晶片封装市场的主要参与者正在专注于开发晶片级封装（CSP）技术，以提高半导体装置的性能、小型化和可靠性。 CSP技术涉及封装，其封装尺寸与半导体晶片本身大致相同。 2022年9月，美国LED创新公司Bridgelux Inc.推出了晶片级封装（CSP）LED，提供1800K至6500K、CRI值70至95、RGB颜色至全光谱。这款 LED 采用带有磷光体涂层的覆晶技术，无需键合线或塑胶模具，从而改善了温度控管并增加了光通量产量。 CSP2727 车型拥有业界领先的效率，在 350 mA 时为 209 lm/W，在 700 mA 时为 190 lm/W，非常适合商业照明应用。 CSP LED 有助于顺利、灵活地进行基板组装，从而为商业、娱乐、工业和户外等各种照明应用创建客户特定的 COB（板上晶片）模组。

目录

第一章执行摘要

第二章 市场特点

第三章 市场趋势与策略

第四章宏观经济情景

  • 高通膨对市场的影响
  • 乌克兰与俄罗斯战争对市场的影响
  • COVID-19 对市场的影响

第五章世界市场规模与成长

  • 全球先进晶片封装市场：驱动因素与限制因素
    • 市场驱动因素
    • 市场限制因素
  • 全球先进晶片封装市场表现：规模与成长，2018-2023
  • 全球先进晶片封装市场预测：规模与成长，2023-2028，2033F

第六章 市场细分

  • 全球先进晶片封装市场：依封装分类的表现与预测，2018-2023、2023-2028F、2033F
  • 球栅阵列 (BGA)
  • 四方扁平封装 (QFP)
  • 晶片级封装 (CSP)
  • 晶圆级晶片尺寸封装 (WLCSP)
  • 全球先进晶片封装市场：依技术分類的表现与预测，2018-2023、2023-2028F、2033F
  • 五维 (5D) 包装
  • 3D(3D) 包装
  • 扇出晶圆级封装
  • 覆晶构装
  • 系统级封装解决方案
  • 全球先进晶片封装市场：最终用途产业的表现与预测，2018-2023、2023-2028F、2033F
  • 电子产品
  • 车
  • 通讯
  • 产业
  • 卫生保健
  • 航太和国防

第 7 章 区域/国家分析

  • 全球先进晶片封装市场：按地区分類的表现与预测，2018-2023、2023-2028F、2033F
  • 全球先进晶片封装市场：依国家分類的表现与预测，2018-2023、2023-2028F、2033F

第八章亚太市场

第九章 中国市场

第十章 印度市场

第十一章 日本市场

第十二章 澳洲市场

第十三章 印尼市场

第14章 韩国市场

第十五章 西欧市场

第十六章英国市场

第十七章 德国市场

第十八章 法国市场

第十九章 义大利市场

第20章 西班牙市场

第21章 东欧市场

第22章 俄罗斯市场

第23章 北美市场

第24章美国市场

第25章加拿大市场

第26章 南美洲市场

第27章 巴西市场

第28章 中东市场

第29章 非洲市场

第三十章 竞争格局及公司概况

  • 先进晶片封装市场：竞争格局
  • 先进晶片封装市场：公司简介
    • Samsung Electronics Co. Ltd.
    • Advanced Micro Devices Inc.
    • Advanced Semiconductor Engineering Inc
    • Henkel Group
    • Texas Instruments Incorporated

第31章 其他大型创新企业

  • Lam Research Corporation
  • NXP Semiconductors
  • Onsemi
  • Amkor Technology
  • Nordson Corporation
  • Siliconware Precision Industries Co. Ltd.
  • Kulicke and Soffa Industries Inc.
  • ChipMOS Technologies Inc.
  • SUSS MicroTec SE
  • EV Group
  • Indium Corporation
  • Palomar Technologies
  • Brewer Science Inc.
  • MacDermid Alpha Electronics Solutions
  • Universal Instruments Corporation

第32章竞争基准化分析

第 33 章. 竞争对手仪表板

第三十四章 重大併购

第35章前瞻性与潜力分析

第36章附录

简介目录
Product Code: r19526

Advanced chip packaging refers to advanced processes and technologies used to encase and connect semiconductor devices (chips) to their external environments, commonly found within electronic devices. This method offers design flexibility, allowing for the creation of tailored solutions for specific applications and performance requirements.

The main types of advanced chip packaging include ball grid array (BGA), quad flat package (QFP), chip scale package (CSP), and wafer-level chip scale package (WLCSP). A ball grid array is an integrated circuit packaging type that employs an array of solder balls on the bottom of the package to provide electrical connections to the printed circuit board. This design facilitates higher pin counts, enhanced thermal performance, and more compact designs compared to traditional pin-based packages. Technologies such as five-dimensional (5D) packaging, three-dimensional (3D) packaging, fan-out wafer-level packaging, flip-chip packaging, and system-in-package solutions are utilized in various industries, including electronics, automotive, telecommunications, industrial, healthcare, aerospace, and defense.

The advanced chip packaging market research report is one of a series of new reports from The Business Research Company that provides advanced chip packaging market statistics, including the advanced chip packaging industry global market size, regional shares, competitors with the advanced chip packaging market share, detailed advanced chip packaging market segments, market trends, and opportunities, and any further data you may need to thrive in the advanced chip packaging industry. These advanced chip packaging market research reports deliver a complete perspective of everything you need, with an in-depth analysis of the current and future scenarios of the industry.

The advanced chip packaging market size has grown rapidly in recent years. It will grow from $10.51 billion in 2023 to $12.41 billion in 2024 at a compound annual growth rate (CAGR) of 18.1%. The growth observed during the historic period can be attributed to several factors such as the increasing demand for smaller, more powerful consumer electronics, the proliferation of mobile devices and smartphones, the expansion of high-speed data networks, the rising integration of electronics in the automotive sector, and the evolving requirements of computing technology.

The advanced chip packaging market size is expected to see rapid growth in the next few years. It will grow to $24.29 billion in 2028 at a compound annual growth rate (CAGR) of 18.3%. The anticipated growth during the forecast period is driven by several key factors such as the widespread adoption of 5G technology, the expansion of Internet of Things (IoT) devices, the increasing prevalence of artificial intelligence (AI) and machine learning, and the rise of wearable technology. Notable trends for the forecast period include the growing use of 3D packaging technologies, advancements in thermal management, progress in high-density interconnect technologies, expansion of fan-out wafer-level packaging technologies, and the development of flexible and stretchable packaging solutions.

The rising demand for consumer electronic devices is anticipated to drive the growth of the advanced chip packaging market. Consumer electronic devices, which are designed for everyday use in private homes, include smartphones, tablets, and laptops. The expansion of internet and wireless networks has significantly increased the demand for these devices. Advanced chip packaging technologies facilitate the integration of multiple functions into compact designs, which are essential for high-performance consumer electronics. These technologies improve processing power, efficiency, and heat dissipation, enabling the creation of feature-rich, compact devices. For instance, a report published by the Japan Electronics and Information Technology Industries Association in May 2023 indicated that consumer electronics production reached $209.50 million, representing a 127% increase compared to the previous year. Consequently, the growing demand for consumer electronic devices is fueling the expansion of the advanced chip packaging market.

Major players in the advanced chip packaging market are focusing on the development of chip-scale package (CSP) technology to enhance semiconductor device performance, miniaturization, and reliability. CSP technology involves packaging where the package dimensions are nearly the same as the semiconductor chip itself. In September 2022, Bridgelux Inc., a US-based LED innovation company, introduced its Chip Scale Package (CSP) LEDs, which range from 1800K to 6500K, with CRI values from 70 to 95, and offer RGB color to full spectrum. Utilizing flip-chip technology with a phosphor coating, these LEDs eliminate the need for bond wires and plastic molds, resulting in improved heat management and increased luminous flux production. The CSP2727 model boasts an industry-leading efficacy of 209 lm/W at 350 mA and 190 lm/W at 700 mA, making it well-suited for commercial lighting applications. The CSP LEDs facilitate smooth and flexible board assembly, allowing for the creation of customer-specific Chip-on-Board (COB) modules for various lighting applications including commercial, entertainment, industrial, and outdoor settings.

In November 2022, Lam Research Corporation, a US-based semiconductor company, acquired SEMSYSCO GmbH for an undisclosed amount. This acquisition expands Lam Research's capabilities in innovative packaging solutions, particularly for advanced logic chips and chipset-based systems. The acquisition includes a state-of-the-art research and development facility located in Austria, which enhances Lam Research's expertise in next-generation substrates and heterogeneous packaging. SEMSYSCO GmbH, an Austria-based provider of wet-processing semiconductor equipment, will contribute to Lam Research's advanced chip packaging efforts.

Major companies operating in the advanced chip packaging market are Samsung Electronics Co. Ltd., Advanced Micro Devices Inc., Advanced Semiconductor Engineering Inc, Henkel Group, Texas Instruments Incorporated, Lam Research Corporation, NXP Semiconductors, Onsemi, Amkor Technology, Nordson Corporation, Siliconware Precision Industries Co. Ltd., Kulicke and Soffa Industries Inc., ChipMOS Technologies Inc., SUSS MicroTec SE, EV Group, Indium Corporation, Palomar Technologies, Brewer Science Inc., MacDermid Alpha Electronics Solutions, Universal Instruments Corporation, CHIPBOND Technology Corporation

Asia-Pacific was the largest region in the advanced chip packaging market in 2023. The regions covered in the advanced chip packaging market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

The countries covered in the advanced chip packaging market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The advanced chip packaging market consists of revenues earned by entities by providing services such as multi-chip modules, through-silicon vias, lead frame packages, and embedded die packaging. The market value includes the value of related goods sold by the service provider or included within the service offering. The advanced chip packaging market also includes sales of wire bonders, encapsulation equipment, die-attach equipment, and test and inspection equipment. Values in this market are 'factory gate' values, that is, the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

Advanced Chip Packaging Global Market Report 2024 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.

This report focuses on advanced chip packaging market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.

Reasons to Purchase

  • Gain a truly global perspective with the most comprehensive report available on this market covering 50+ geographies.
  • Understand how the market has been affected by the COVID-19 and how it is responding as the impact of the virus abates.
  • Assess the Russia - Ukraine war's impact on agriculture, energy and mineral commodity supply and its direct and indirect impact on the market.
  • Measure the impact of high global inflation on market growth.
  • Create regional and country strategies on the basis of local data and analysis.
  • Identify growth segments for investment.
  • Outperform competitors using forecast data and the drivers and trends shaping the market.
  • Understand customers based on the latest market shares.
  • Benchmark performance against key competitors.
  • Suitable for supporting your internal and external presentations with reliable high quality data and analysis
  • Report will be updated with the latest data and delivered to you within 3-5 working days of order along with an Excel data sheet for easy data extraction and analysis.
  • All data from the report will also be delivered in an excel dashboard format.

Where is the largest and fastest growing market for advanced chip packaging ? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward? The advanced chip packaging market global report from the Business Research Company answers all these questions and many more.

The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.

  • The market characteristics section of the report defines and explains the market.
  • The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
  • The forecasts are made after considering the major factors currently impacting the market. These include:

The impact of sanctions, supply chain disruptions, and altered demand for goods and services due to the Russian Ukraine war, impacting various macro-economic factors and parameters in the Eastern European region and its subsequent effect on global markets.

The impact of higher inflation in many countries and the resulting spike in interest rates.

The continued but declining impact of COVID-19 on supply chains and consumption patterns.

  • Market segmentations break down the market into sub markets.
  • The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth. It covers the growth trajectory of COVID-19 for all regions, key developed countries and major emerging markets.
  • The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
  • The trends and strategies section analyses the shape of the market as it emerges from the crisis and suggests how companies can grow as the market recovers.

Scope

  • Markets Covered:1) By Packaging: Ball Grid Array (BGA); Quad Flat Package (QFP); Chip Scale Package (CSP); Wafer-Level Chip Scale Package (WLCSP)
  • 2) By Technology: Five-Dimensional (5D) Packaging; Three-Dimensional (3D) Packaging; Fan-Out Wafer-Level Packaging; Flip-Chip Packaging; System-In-Package Solutions
  • 3) By End-Use Industry: Electronics; Automotive; Telecommunications; Industrial; Healthcare; Aerospace And Defense
  • Companies Mentioned: Samsung Electronics Co. Ltd.; Advanced Micro Devices Inc.; Advanced Semiconductor Engineering Inc; Henkel Group; Texas Instruments Incorporated
  • Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Russia; South Korea; UK; USA; Canada; Italy; Spain
  • Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
  • Time series: Five years historic and ten years forecast.
  • Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita,
  • Data segmentations: country and regional historic and forecast data, market share of competitors, market segments.
  • Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
  • Delivery format: PDF, Word and Excel Data Dashboard.

Table of Contents

1. Executive Summary

2. Advanced Chip Packaging Market Characteristics

3. Advanced Chip Packaging Market Trends And Strategies

4. Advanced Chip Packaging Market - Macro Economic Scenario

  • 4.1. Impact Of High Inflation On The Market
  • 4.2. Ukraine-Russia War Impact On The Market
  • 4.3. COVID-19 Impact On The Market

5. Global Advanced Chip Packaging Market Size and Growth

  • 5.1. Global Advanced Chip Packaging Market Drivers and Restraints
    • 5.1.1. Drivers Of The Market
    • 5.1.2. Restraints Of The Market
  • 5.2. Global Advanced Chip Packaging Historic Market Size and Growth, 2018 - 2023, Value ($ Billion)
  • 5.3. Global Advanced Chip Packaging Forecast Market Size and Growth, 2023 - 2028, 2033F, Value ($ Billion)

6. Advanced Chip Packaging Market Segmentation

  • 6.1. Global Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • Ball Grid Array (BGA)
  • Quad Flat Package (QFP)
  • Chip Scale Package (CSP)
  • Wafer-Level Chip Scale Package (WLCSP)
  • 6.2. Global Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • Five-Dimensional (5D) Packaging
  • Three-Dimensional (3D) Packaging
  • Fan-Out Wafer-Level Packaging
  • Flip-Chip Packaging
  • System-In-Package Solutions
  • 6.3. Global Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • Electronics
  • Automotive
  • Telecommunications
  • Industrial
  • Healthcare
  • Aerospace And Defense

7. Advanced Chip Packaging Market Regional And Country Analysis

  • 7.1. Global Advanced Chip Packaging Market, Split By Region, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 7.2. Global Advanced Chip Packaging Market, Split By Country, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

8. Asia-Pacific Advanced Chip Packaging Market

  • 8.1. Asia-Pacific Advanced Chip Packaging Market Overview
  • Region Information, Impact Of COVID-19, Market Information, Background Information, Government Initiatives, Regulations, Regulatory Bodies, Major Associations, Taxes Levied, Corporate Tax Structure, Investments, Major Companies
  • 8.2. Asia-Pacific Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 8.3. Asia-Pacific Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 8.4. Asia-Pacific Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

9. China Advanced Chip Packaging Market

  • 9.1. China Advanced Chip Packaging Market Overview
  • 9.2. China Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F,$ Billion
  • 9.3. China Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F,$ Billion
  • 9.4. China Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F,$ Billion

10. India Advanced Chip Packaging Market

  • 10.1. India Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 10.2. India Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 10.3. India Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

11. Japan Advanced Chip Packaging Market

  • 11.1. Japan Advanced Chip Packaging Market Overview
  • 11.2. Japan Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 11.3. Japan Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 11.4. Japan Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

12. Australia Advanced Chip Packaging Market

  • 12.1. Australia Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 12.2. Australia Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 12.3. Australia Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

13. Indonesia Advanced Chip Packaging Market

  • 13.1. Indonesia Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 13.2. Indonesia Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 13.3. Indonesia Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

14. South Korea Advanced Chip Packaging Market

  • 14.1. South Korea Advanced Chip Packaging Market Overview
  • 14.2. South Korea Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 14.3. South Korea Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 14.4. South Korea Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

15. Western Europe Advanced Chip Packaging Market

  • 15.1. Western Europe Advanced Chip Packaging Market Overview
  • 15.2. Western Europe Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 15.3. Western Europe Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 15.4. Western Europe Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

16. UK Advanced Chip Packaging Market

  • 16.1. UK Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 16.2. UK Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 16.3. UK Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

17. Germany Advanced Chip Packaging Market

  • 17.1. Germany Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 17.2. Germany Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 17.3. Germany Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

18. France Advanced Chip Packaging Market

  • 18.1. France Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 18.2. France Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 18.3. France Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

19. Italy Advanced Chip Packaging Market

  • 19.1. Italy Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 19.2. Italy Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 19.3. Italy Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

20. Spain Advanced Chip Packaging Market

  • 20.1. Spain Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 20.2. Spain Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 20.3. Spain Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

21. Eastern Europe Advanced Chip Packaging Market

  • 21.1. Eastern Europe Advanced Chip Packaging Market Overview
  • 21.2. Eastern Europe Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 21.3. Eastern Europe Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 21.4. Eastern Europe Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

22. Russia Advanced Chip Packaging Market

  • 22.1. Russia Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 22.2. Russia Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 22.3. Russia Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

23. North America Advanced Chip Packaging Market

  • 23.1. North America Advanced Chip Packaging Market Overview
  • 23.2. North America Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 23.3. North America Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 23.4. North America Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

24. USA Advanced Chip Packaging Market

  • 24.1. USA Advanced Chip Packaging Market Overview
  • 24.2. USA Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 24.3. USA Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 24.4. USA Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

25. Canada Advanced Chip Packaging Market

  • 25.1. Canada Advanced Chip Packaging Market Overview
  • 25.2. Canada Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 25.3. Canada Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 25.4. Canada Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

26. South America Advanced Chip Packaging Market

  • 26.1. South America Advanced Chip Packaging Market Overview
  • 26.2. South America Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 26.3. South America Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 26.4. South America Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

27. Brazil Advanced Chip Packaging Market

  • 27.1. Brazil Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 27.2. Brazil Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 27.3. Brazil Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

28. Middle East Advanced Chip Packaging Market

  • 28.1. Middle East Advanced Chip Packaging Market Overview
  • 28.2. Middle East Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 28.3. Middle East Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 28.4. Middle East Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

29. Africa Advanced Chip Packaging Market

  • 29.1. Africa Advanced Chip Packaging Market Overview
  • 29.2. Africa Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 29.3. Africa Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion
  • 29.4. Africa Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2018-2023, 2023-2028F, 2033F, $ Billion

30. Advanced Chip Packaging Market Competitive Landscape And Company Profiles

  • 30.1. Advanced Chip Packaging Market Competitive Landscape
  • 30.2. Advanced Chip Packaging Market Company Profiles
    • 30.2.1. Samsung Electronics Co. Ltd.
      • 30.2.1.1. Overview
      • 30.2.1.2. Products and Services
      • 30.2.1.3. Strategy
      • 30.2.1.4. Financial Performance
    • 30.2.2. Advanced Micro Devices Inc.
      • 30.2.2.1. Overview
      • 30.2.2.2. Products and Services
      • 30.2.2.3. Strategy
      • 30.2.2.4. Financial Performance
    • 30.2.3. Advanced Semiconductor Engineering Inc
      • 30.2.3.1. Overview
      • 30.2.3.2. Products and Services
      • 30.2.3.3. Strategy
      • 30.2.3.4. Financial Performance
    • 30.2.4. Henkel Group
      • 30.2.4.1. Overview
      • 30.2.4.2. Products and Services
      • 30.2.4.3. Strategy
      • 30.2.4.4. Financial Performance
    • 30.2.5. Texas Instruments Incorporated
      • 30.2.5.1. Overview
      • 30.2.5.2. Products and Services
      • 30.2.5.3. Strategy
      • 30.2.5.4. Financial Performance

31. Advanced Chip Packaging Market Other Major And Innovative Companies

  • 31.1. Lam Research Corporation
  • 31.2. NXP Semiconductors
  • 31.3. Onsemi
  • 31.4. Amkor Technology
  • 31.5. Nordson Corporation
  • 31.6. Siliconware Precision Industries Co. Ltd.
  • 31.7. Kulicke and Soffa Industries Inc.
  • 31.8. ChipMOS Technologies Inc.
  • 31.9. SUSS MicroTec SE
  • 31.10. EV Group
  • 31.11. Indium Corporation
  • 31.12. Palomar Technologies
  • 31.13. Brewer Science Inc.
  • 31.14. MacDermid Alpha Electronics Solutions
  • 31.15. Universal Instruments Corporation

32. Global Advanced Chip Packaging Market Competitive Benchmarking

33. Global Advanced Chip Packaging Market Competitive Dashboard

34. Key Mergers And Acquisitions In The Advanced Chip Packaging Market

35. Advanced Chip Packaging Market Future Outlook and Potential Analysis

  • 35.1 Advanced Chip Packaging Market In 2028 - Countries Offering Most New Opportunities
  • 35.2 Advanced Chip Packaging Market In 2028 - Segments Offering Most New Opportunities
  • 35.3 Advanced Chip Packaging Market In 2028 - Growth Strategies
    • 35.3.1 Market Trend Based Strategies
    • 35.3.2 Competitor Strategies

36. Appendix

  • 36.1. Abbreviations
  • 36.2. Currencies
  • 36.3. Historic And Forecast Inflation Rates
  • 36.4. Research Inquiries
  • 36.5. The Business Research Company
  • 36.6. Copyright And Disclaimer