半导体封装市场－全球产业规模、份额、趋势、机会和预测，依封装平台、类型、技术、终端用户产业、地区和竞争格局划分，2021-2031年预测

全球半导体封装市场规模将从2025年的312.4亿美元成长到2031年的469.6亿美元，复合年增长率（CAGR）为7.03%。半导体封装是指将积体电路封装起来，以提供物理保护、散热和与印刷电路板的电气连接。市场成长的主要驱动力是高效能运算和人工智慧领域需求的激增，以及电动车中半导体含量的不断提高。

主要市场驱动因素

人工智慧和高效能运算的快速发展正在从根本上重塑全球半导体封装市场，因为这使得架构必须最大限度地提高频宽和能源效率。由于人工智慧演算法需要在逻辑单元和储存单元之间快速传输资料，因此该产业正在向2.

主要市场挑战

先进封装製程不断攀升的成本和技术复杂性严重阻碍了全球半导体封装市场的扩张。随着产业向异质整合方向发展以应对实体尺寸缩小的限制，对超精密互连的需求也需要对专用基础设施进行大量资本投入。

主要市场趋势

高效能运算用玻璃芯基板的商业化正成为关键的材料革新，旨在解决传统有机中介层的稳定性限制。随着製造商积极推进晶片级架构的小型化，玻璃展现出卓越的平整度和尺寸稳定性，从而能够实现下一代人工智慧处理器所需的超细互连间距，并有效缓解大尺寸封装中的翘曲问题。

目录

第一章：产品概述

第二章：研究方法

第三章：执行概要

第四章：顾客之声

第五章：全球半导体封装市场展望

• 市场规模及预测
  • 按价值
• 市占率及预测
  • 按包装平台（先进包装、传统包装）
  • 依类型（倒装晶片、嵌入式晶片、扇入式WLP、扇出式WLP）
  • 依封装技术分类（网格阵列封装、小外形封装、扁平无引脚封装、双扁平无引脚封装 (DFN)、四扁平无引脚封装 (QFN)、双列直插封装、塑胶双列直插封装 (PDIP)、陶瓷双列直插封装 (CDIP)、其他）
  • 依最终用户产业划分（消费性电子、航太与国防、医疗器材、通讯与电信、汽车、能源与照明）
  • 按地区
  • 按公司（2025 年）
• 市场地图

第六章：北美半导体封装市场展望

• 市场规模及预测
• 市占率及预测
• 北美洲：国家分析
  • 美国
  • 加拿大
  • 墨西哥

第七章：欧洲半导体封装市场展望

• 市场规模及预测
• 市占率及预测
• 欧洲：国家分析
  • 德国
  • 法国
  • 英国
  • 义大利
  • 西班牙

第八章：亚太半导体封装市场展望

• 市场规模及预测
• 市占率及预测
• 亚太地区：国家分析
  • 中国
  • 印度
  • 日本
  • 韩国
  • 澳洲

第九章：中东和非洲半导体封装市场展望

• 市场规模及预测
• 市占率及预测
• 中东和非洲：国家分析
  • 沙乌地阿拉伯
  • 阿联酋
  • 南非

第十章：南美洲半导体封装市场展望

• 市场规模及预测
• 市占率及预测
• 南美洲：国家分析
  • 巴西
  • 哥伦比亚
  • 阿根廷

第十一章：市场动态

• 司机
• 挑战

第十二章：市场趋势与发展

• 併购
• 产品发布
• 最新进展

第十三章：全球半导体封装市场：SWOT分析

第十四章：波特五力分析

• 产业竞争
• 新进入者的潜力
• 供应商议价能力
• 顾客的力量
• 替代产品的威胁

第十五章：竞争格局

• ASE Technology Holding Co., Ltd.
• Amkor Technology, Inc.
• Taiwan Semiconductor Manufacturing Company
• Intel Corporation
• Samsung Electronics Co., Ltd.
• Jiangsu Changjiang Electronics Technology Co., Ltd.
• Powertech Technology Inc.
• ChipMOS Technologies Inc.
• Siliconware Precision Industries Co., Ltd.
• Texas Instruments Incorporated

第十六章：策略建议

第17章调查会社について・免责事项

The Global Semiconductor Packaging Market will grow from USD 31.24 Billion in 2025 to USD 46.96 Billion by 2031 at a 7.03% CAGR. Semiconductor packaging entails the encasement of integrated circuits to provide physical protection, heat dissipation, and electrical connectivity to printed circuit boards. The market growth is fundamentally driven by the surging demand for high-performance computing and artificial intelligence, coupled with the increasing semiconductor content in electric vehicles.

Key Market Drivers

The surging adoption of artificial intelligence and high-performance computing is fundamentally reshaping the Global Semiconductor Packaging Market by necessitating architectures that maximize bandwidth and power efficiency. As AI algorithms require rapid data movement between logic and memory units, the industry is pivoting toward 2.5D and 3D packaging solutions to bridge the gap that traditional interconnects cannot sustain. This computational intensity drives foundries to aggressively scale their backend capabilities to accommodate complex integration schemes like Chip-on-Wafer-on-Substrate.

Key Market Challenges

The escalating cost and technical complexity associated with advanced packaging processes constitute a severe impediment to the expansion of the Global Semiconductor Packaging Market. As the industry moves toward heterogeneous integration to address physical scaling limits, the requirement for ultra-precise interconnects necessitates substantial capital expenditure on specialized infrastructure. This financial burden creates a high barrier to entry that disproportionately affects smaller market participants who lack the liquidity to upgrade their facilities.

Key Market Trends

The Commercialization of Glass Core Substrates for High-Performance Computing is emerging as a critical material evolution to address the stability limitations of traditional organic interposers. As manufacturers aggressively scale chiplet architectures, glass provides superior flatness and dimensional stability, which enables the ultra-fine interconnect pitches required for next-generation AI processors and mitigates warpage issues in large-form-factor packages. This transition is rapidly moving from research to active industrial deployment as companies build dedicated infrastructure to support this technology.

Key Market Players

• ASE Technology Holding Co., Ltd.
• Amkor Technology, Inc.
• Taiwan Semiconductor Manufacturing Company
• Intel Corporation
• Samsung Electronics Co., Ltd.
• Jiangsu Changjiang Electronics Technology Co., Ltd.
• Powertech Technology Inc.
• ChipMOS Technologies Inc.
• Siliconware Precision Industries Co., Ltd.
• Texas Instruments Incorporated

Report Scope:

In this report, the Global Semiconductor Packaging Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Semiconductor Packaging Market, By Packaging Platform:

• Advanced Packaging
• Traditional Packaging

Semiconductor Packaging Market, By Type:

• Flip Chip
• Embedded DIE
• Fan-in WLP
• Fan-out WLP

Semiconductor Packaging Market, By Technology:

• Grid Array
• Small Outline Package
• Flat no-leads packages
• Dual-flat no-leads (DFN)
• Quad-flat no-leads (QFN)
• Dual In-Line Package
• Plastic Dual Inline Package (PDIP)
• Ceramic Dual Inline Package (CDIP)
• Others

Semiconductor Packaging Market, By End-user Industry:

• Consumer Electronics
• Aerospace & Defense
• Medical Devices
• Communications & Telecom
• Automotive
• and Energy & Lighting

Semiconductor Packaging Market, By Region:

• North America
• United States
• Canada
• Mexico
• Europe
• France
• United Kingdom
• Italy
• Germany
• Spain
• Asia Pacific
• China
• India
• Japan
• Australia
• South Korea
• South America
• Brazil
• Argentina
• Colombia
• Middle East & Africa
• South Africa
• Saudi Arabia
• UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Semiconductor Packaging Market.

Available Customizations:

Global Semiconductor Packaging Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

• Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

• 1.1. Market Definition
• 1.2. Scope of the Market
  • 1.2.1. Markets Covered
  • 1.2.2. Years Considered for Study
  • 1.2.3. Key Market Segmentations

2. Research Methodology

• 2.1. Objective of the Study
• 2.2. Baseline Methodology
• 2.3. Key Industry Partners
• 2.4. Major Association and Secondary Sources
• 2.5. Forecasting Methodology
• 2.6. Data Triangulation & Validation
• 2.7. Assumptions and Limitations

3. Executive Summary

• 3.1. Overview of the Market
• 3.2. Overview of Key Market Segmentations
• 3.3. Overview of Key Market Players
• 3.4. Overview of Key Regions/Countries
• 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global Semiconductor Packaging Market Outlook

• 5.1. Market Size & Forecast
  • 5.1.1. By Value
• 5.2. Market Share & Forecast
  • 5.2.1. By Packaging Platform (Advanced Packaging, Traditional Packaging)
  • 5.2.2. By Type (Flip Chip, Embedded DIE, Fan-in WLP, Fan-out WLP)
  • 5.2.3. By Technology (Grid Array, Small Outline Package, Flat no-leads packages, Dual-flat no-leads (DFN), Quad-flat no-leads (QFN), Dual In-Line Package, Plastic Dual Inline Package (PDIP), Ceramic Dual Inline Package (CDIP), Others)
  • 5.2.4. By End-user Industry (Consumer Electronics, Aerospace & Defense, Medical Devices, Communications & Telecom, Automotive, and Energy & Lighting)
  • 5.2.5. By Region
  • 5.2.6. By Company (2025)
• 5.3. Market Map

6. North America Semiconductor Packaging Market Outlook

• 6.1. Market Size & Forecast
  • 6.1.1. By Value
• 6.2. Market Share & Forecast
  • 6.2.1. By Packaging Platform
  • 6.2.2. By Type
  • 6.2.3. By Technology
  • 6.2.4. By End-user Industry
  • 6.2.5. By Country
• 6.3. North America: Country Analysis
  • 6.3.1. United States Semiconductor Packaging Market Outlook
    • 6.3.1.1. Market Size & Forecast
      • 6.3.1.1.1. By Value
    • 6.3.1.2. Market Share & Forecast
      • 6.3.1.2.1. By Packaging Platform
      • 6.3.1.2.2. By Type
      • 6.3.1.2.3. By Technology
      • 6.3.1.2.4. By End-user Industry
  • 6.3.2. Canada Semiconductor Packaging Market Outlook
    • 6.3.2.1. Market Size & Forecast
      • 6.3.2.1.1. By Value
    • 6.3.2.2. Market Share & Forecast
      • 6.3.2.2.1. By Packaging Platform
      • 6.3.2.2.2. By Type
      • 6.3.2.2.3. By Technology
      • 6.3.2.2.4. By End-user Industry
  • 6.3.3. Mexico Semiconductor Packaging Market Outlook
    • 6.3.3.1. Market Size & Forecast
      • 6.3.3.1.1. By Value
    • 6.3.3.2. Market Share & Forecast
      • 6.3.3.2.1. By Packaging Platform
      • 6.3.3.2.2. By Type
      • 6.3.3.2.3. By Technology
      • 6.3.3.2.4. By End-user Industry

7. Europe Semiconductor Packaging Market Outlook

• 7.1. Market Size & Forecast
  • 7.1.1. By Value
• 7.2. Market Share & Forecast
  • 7.2.1. By Packaging Platform
  • 7.2.2. By Type
  • 7.2.3. By Technology
  • 7.2.4. By End-user Industry
  • 7.2.5. By Country
• 7.3. Europe: Country Analysis
  • 7.3.1. Germany Semiconductor Packaging Market Outlook
    • 7.3.1.1. Market Size & Forecast
      • 7.3.1.1.1. By Value
    • 7.3.1.2. Market Share & Forecast
      • 7.3.1.2.1. By Packaging Platform
      • 7.3.1.2.2. By Type
      • 7.3.1.2.3. By Technology
      • 7.3.1.2.4. By End-user Industry
  • 7.3.2. France Semiconductor Packaging Market Outlook
    • 7.3.2.1. Market Size & Forecast
      • 7.3.2.1.1. By Value
    • 7.3.2.2. Market Share & Forecast
      • 7.3.2.2.1. By Packaging Platform
      • 7.3.2.2.2. By Type
      • 7.3.2.2.3. By Technology
      • 7.3.2.2.4. By End-user Industry
  • 7.3.3. United Kingdom Semiconductor Packaging Market Outlook
    • 7.3.3.1. Market Size & Forecast
      • 7.3.3.1.1. By Value
    • 7.3.3.2. Market Share & Forecast
      • 7.3.3.2.1. By Packaging Platform
      • 7.3.3.2.2. By Type
      • 7.3.3.2.3. By Technology
      • 7.3.3.2.4. By End-user Industry
  • 7.3.4. Italy Semiconductor Packaging Market Outlook
    • 7.3.4.1. Market Size & Forecast
      • 7.3.4.1.1. By Value
    • 7.3.4.2. Market Share & Forecast
      • 7.3.4.2.1. By Packaging Platform
      • 7.3.4.2.2. By Type
      • 7.3.4.2.3. By Technology
      • 7.3.4.2.4. By End-user Industry
  • 7.3.5. Spain Semiconductor Packaging Market Outlook
    • 7.3.5.1. Market Size & Forecast
      • 7.3.5.1.1. By Value
    • 7.3.5.2. Market Share & Forecast
      • 7.3.5.2.1. By Packaging Platform
      • 7.3.5.2.2. By Type
      • 7.3.5.2.3. By Technology
      • 7.3.5.2.4. By End-user Industry

8. Asia Pacific Semiconductor Packaging Market Outlook

• 8.1. Market Size & Forecast
  • 8.1.1. By Value
• 8.2. Market Share & Forecast
  • 8.2.1. By Packaging Platform
  • 8.2.2. By Type
  • 8.2.3. By Technology
  • 8.2.4. By End-user Industry
  • 8.2.5. By Country
• 8.3. Asia Pacific: Country Analysis
  • 8.3.1. China Semiconductor Packaging Market Outlook
    • 8.3.1.1. Market Size & Forecast
      • 8.3.1.1.1. By Value
    • 8.3.1.2. Market Share & Forecast
      • 8.3.1.2.1. By Packaging Platform
      • 8.3.1.2.2. By Type
      • 8.3.1.2.3. By Technology
      • 8.3.1.2.4. By End-user Industry
  • 8.3.2. India Semiconductor Packaging Market Outlook
    • 8.3.2.1. Market Size & Forecast
      • 8.3.2.1.1. By Value
    • 8.3.2.2. Market Share & Forecast
      • 8.3.2.2.1. By Packaging Platform
      • 8.3.2.2.2. By Type
      • 8.3.2.2.3. By Technology
      • 8.3.2.2.4. By End-user Industry
  • 8.3.3. Japan Semiconductor Packaging Market Outlook
    • 8.3.3.1. Market Size & Forecast
      • 8.3.3.1.1. By Value
    • 8.3.3.2. Market Share & Forecast
      • 8.3.3.2.1. By Packaging Platform
      • 8.3.3.2.2. By Type
      • 8.3.3.2.3. By Technology
      • 8.3.3.2.4. By End-user Industry
  • 8.3.4. South Korea Semiconductor Packaging Market Outlook
    • 8.3.4.1. Market Size & Forecast
      • 8.3.4.1.1. By Value
    • 8.3.4.2. Market Share & Forecast
      • 8.3.4.2.1. By Packaging Platform
      • 8.3.4.2.2. By Type
      • 8.3.4.2.3. By Technology
      • 8.3.4.2.4. By End-user Industry
  • 8.3.5. Australia Semiconductor Packaging Market Outlook
    • 8.3.5.1. Market Size & Forecast
      • 8.3.5.1.1. By Value
    • 8.3.5.2. Market Share & Forecast
      • 8.3.5.2.1. By Packaging Platform
      • 8.3.5.2.2. By Type
      • 8.3.5.2.3. By Technology
      • 8.3.5.2.4. By End-user Industry

9. Middle East & Africa Semiconductor Packaging Market Outlook

• 9.1. Market Size & Forecast
  • 9.1.1. By Value
• 9.2. Market Share & Forecast
  • 9.2.1. By Packaging Platform
  • 9.2.2. By Type
  • 9.2.3. By Technology
  • 9.2.4. By End-user Industry
  • 9.2.5. By Country
• 9.3. Middle East & Africa: Country Analysis
  • 9.3.1. Saudi Arabia Semiconductor Packaging Market Outlook
    • 9.3.1.1. Market Size & Forecast
      • 9.3.1.1.1. By Value
    • 9.3.1.2. Market Share & Forecast
      • 9.3.1.2.1. By Packaging Platform
      • 9.3.1.2.2. By Type
      • 9.3.1.2.3. By Technology
      • 9.3.1.2.4. By End-user Industry
  • 9.3.2. UAE Semiconductor Packaging Market Outlook
    • 9.3.2.1. Market Size & Forecast
      • 9.3.2.1.1. By Value
    • 9.3.2.2. Market Share & Forecast
      • 9.3.2.2.1. By Packaging Platform
      • 9.3.2.2.2. By Type
      • 9.3.2.2.3. By Technology
      • 9.3.2.2.4. By End-user Industry
  • 9.3.3. South Africa Semiconductor Packaging Market Outlook
    • 9.3.3.1. Market Size & Forecast
      • 9.3.3.1.1. By Value
    • 9.3.3.2. Market Share & Forecast
      • 9.3.3.2.1. By Packaging Platform
      • 9.3.3.2.2. By Type
      • 9.3.3.2.3. By Technology
      • 9.3.3.2.4. By End-user Industry

10. South America Semiconductor Packaging Market Outlook

• 10.1. Market Size & Forecast
  • 10.1.1. By Value
• 10.2. Market Share & Forecast
  • 10.2.1. By Packaging Platform
  • 10.2.2. By Type
  • 10.2.3. By Technology
  • 10.2.4. By End-user Industry
  • 10.2.5. By Country
• 10.3. South America: Country Analysis
  • 10.3.1. Brazil Semiconductor Packaging Market Outlook
    • 10.3.1.1. Market Size & Forecast
      • 10.3.1.1.1. By Value
    • 10.3.1.2. Market Share & Forecast
      • 10.3.1.2.1. By Packaging Platform
      • 10.3.1.2.2. By Type
      • 10.3.1.2.3. By Technology
      • 10.3.1.2.4. By End-user Industry
  • 10.3.2. Colombia Semiconductor Packaging Market Outlook
    • 10.3.2.1. Market Size & Forecast
      • 10.3.2.1.1. By Value
    • 10.3.2.2. Market Share & Forecast
      • 10.3.2.2.1. By Packaging Platform
      • 10.3.2.2.2. By Type
      • 10.3.2.2.3. By Technology
      • 10.3.2.2.4. By End-user Industry
  • 10.3.3. Argentina Semiconductor Packaging Market Outlook
    • 10.3.3.1. Market Size & Forecast
      • 10.3.3.1.1. By Value
    • 10.3.3.2. Market Share & Forecast
      • 10.3.3.2.1. By Packaging Platform
      • 10.3.3.2.2. By Type
      • 10.3.3.2.3. By Technology
      • 10.3.3.2.4. By End-user Industry

11. Market Dynamics

• 11.1. Drivers
• 11.2. Challenges

12. Market Trends & Developments

• 12.1. Merger & Acquisition (If Any)
• 12.2. Product Launches (If Any)
• 12.3. Recent Developments

13. Global Semiconductor Packaging Market: SWOT Analysis

14. Porter's Five Forces Analysis

• 14.1. Competition in the Industry
• 14.2. Potential of New Entrants
• 14.3. Power of Suppliers
• 14.4. Power of Customers
• 14.5. Threat of Substitute Products

15. Competitive Landscape

• 15.1. ASE Technology Holding Co., Ltd.
  • 15.1.1. Business Overview
  • 15.1.2. Products & Services
  • 15.1.3. Recent Developments
  • 15.1.4. Key Personnel
  • 15.1.5. SWOT Analysis
• 15.2. Amkor Technology, Inc.
• 15.3. Taiwan Semiconductor Manufacturing Company
• 15.4. Intel Corporation
• 15.5. Samsung Electronics Co., Ltd.
• 15.6. Jiangsu Changjiang Electronics Technology Co., Ltd.
• 15.7. Powertech Technology Inc.
• 15.8. ChipMOS Technologies Inc.
• 15.9. Siliconware Precision Industries Co., Ltd.
• 15.10. Texas Instruments Incorporated

16. Strategic Recommendations

17. About Us & Disclaimer