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市场调查报告书
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1387381

半导体资本设备市场报告：2030 年趋势、预测与竞争分析

Semiconductor Capital Equipment Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 Pages | 商品交期: 3个工作天内

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简介目录

半导体资本设备趋势与预测

预计到 2030 年，全球半导体资本设备市场将达到 1,093 亿美元，2024 年至 2030 年复合年增长率为 6.5%。该市场的主要驱动因素是便携式智慧型设备的发明和创造、智慧设备的创新和开发、各个工业领域数位化的提高以及物联网在数位电子产品中的利用。全球半导体资本设备市场的未来前景广阔，消费性电子、医疗保健、汽车、资讯科技和通讯市场充满机会。

半导体资本设备市场洞察

Lucintel 预测，由于积体电路生产对组装设备的强劲需求，组装设备在预测期内仍将是最大的细分市场。

由于消费性电子产业半导体资本设备的使用不断扩大以及半导体资本设备产业的成长（主要在中国、印度和日本等国家），预计亚太地区在预测期内仍将是最大的地区。马苏。

本报告回答了 11 个关键问题：

  • Q.1. 细分市场中最有前途和高成长的机会是什么？
  • Q.2.哪个细分市场将以更快的速度成长？为什么？
  • Q.3.您认为哪些地区未来会出现更快的成长？为什么？
  • Q.4. 影响市场动态的主要因素有哪些？市场的主要挑战和商业风险是什么？
  • Q.5. 这个市场的商业风险和竞争威胁是什么？
  • Q.6.这个市场有哪些新趋势？为什么？
  • Q.7.市场客户需求有何改变？
  • Q.8. 该市场有哪些新发展以及哪些公司处于领先地位？
  • Q.9.这个市场的主要企业有哪些？主要企业采取哪些策略配合措施来发展业务？
  • Q.10. 该市场上的竞争产品有哪些？由于材料或产品替代而导致市场占有率下降的威胁有多大？
  • Q.11.过去五年发生了哪些併购事件，对产业产生了哪些影响？

目录

第一章执行摘要

第二章全球半导体资本设备市场：市场动态

  • 简介、背景、分类
  • 供应链
  • 产业驱动因素与挑战

第三章 2018-2030年市场趋势及预测分析

  • 宏观经济趋势（2018-2023）与预测（2024-2030）
  • 全球半导体资本设备市场趋势（2018-2023）与预测（2024-2030）
  • 按类型分類的全球半导体资本设备市场
    • 组装设备
    • 自动测试设备
    • 晶圆级製造设备
  • 全球半导体资本设备市场（依最终用途）
    • 消费性电子产品
    • 卫生保健
    • 汽车
    • 资讯科技/通讯

第四章 2018-2030年区域市场趋势及预测分析

  • 全球半导体资本设备市场（按地区）
  • 北美半导体资本设备市场
  • 欧洲半导体资本设备市场
  • 亚太半导体资本设备市场
  • 其他地区半导体固定设备市场

第五章竞争分析

  • 产品系列分析
  • 营运整合
  • 波特五力分析

第六章 成长机会与策略分析

  • 成长机会分析
    • 全球半导体资本设备市场成长机会（按类型）
    • 全球半导体资本设备市场成长机会（依最终用途）
    • 按地区分類的全球半导体资本设备市场成长机会
  • 全球半导体资本设备市场新趋势
  • 战略分析
    • 新产品开发
    • 扩大全球半导体资本设备市场的产能
    • 全球半导体资本设备市场的合併、收购和合资企业
    • 认证和许可

第七章主要企业概况

  • Tokyo Electron
  • Canon
  • Concurrent Design
  • ASML
  • Advantest
  • EV Group
  • AMEC
  • Lam Research
  • Hitachi High-Technologies
  • Applied Materials
简介目录

Semiconductor Capital Equipment Trends and Forecast

The future of the global semiconductor capital equipment market looks promising with opportunities in the consumer electronics, healthcare, automotive, and information technology & telecommunication markets. The global semiconductor capital equipment market is expected to reach an estimated $109.3 billion by 2030 with a CAGR of 6.5% from 2024 to 2030. The major drivers for this market are invention and creation of portable and intelligent gadgets, smart device innovation and development, along with a rise in digitalization across a range of industrial sectors, and the use of IoT in digital electronic devices.

A more than 150-page report is developed to help in your business decisions.

Semiconductor Capital Equipment by Segment

The study includes a forecast for the global semiconductor capital equipment by type, end use, and region.

Semiconductor Capital Equipment Market by Type [Shipment Analysis by Value from 2018 to 2030]:

  • Assembly Equipment
  • Automated Test Equipment
  • Wafer Level Manufacturing Equipment

Semiconductor Capital Equipment Market by End Use [Shipment Analysis by Value from 2018 to 2030]:

  • Consumer Electronics
  • Healthcare
  • Automotive
  • Information Technology & Telecommunication

Semiconductor Capital Equipment Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Semiconductor Capital Equipment Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies semiconductor capital equipment companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the semiconductor capital equipment companies profiled in this report include-

  • Tokyo Electron
  • Canon
  • Concurrent Design
  • ASML
  • Advantest
  • EV Group
  • AMEC
  • Lam Research
  • Hitachi High-Technologies
  • Applied Materials

Semiconductor Capital Equipment Market Insights

Lucintel forecasts that assembly equipment will remain the largest segment over the forecast period due to strong demand for assembly equipment in the production of integrated circuits.

APAC will remain the largest region over the forecast period due to expanding use of semiconductor capital equipment in the consumer electronics industry, as well as, growth of the semiconductor capital equipment industry mostly to countries such as China, India, and Japan.

Features of the Global Semiconductor Capital Equipment Market

Market Size Estimates: Semiconductor capital equipment market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Semiconductor capital equipment market size by type, end use, and region in terms of value ($B).

Regional Analysis: Semiconductor capital equipment market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different type, end use, and regions for the semiconductor capital equipment market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the semiconductor capital equipment market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the semiconductor capital equipment market size?

Answer: The global semiconductor capital equipment market is expected to reach an estimated $109.3 billion by 2030.

Q2. What is the growth forecast for semiconductor capital equipment market?

Answer: The global semiconductor capital equipment market is expected to grow with a CAGR of 6.5% from 2024 to 2030.

Q3. What are the major drivers influencing the growth of the semiconductor capital equipment market?

Answer: The major drivers for this market are invention and creation of portable and intelligent gadgets, smart device innovation and development, along with a rise in digitalization across a range of industrial sectors, and the use of IoT in digital electronic devices.

Q4. What are the major segments for semiconductor capital equipment market?

Answer: The future of the global semiconductor capital equipment market looks promising with opportunities in the consumer electronics, healthcare, automotive, and information technology & telecommunication markets.

Q5. Who are the key semiconductor capital equipment market companies?

Answer: Some of the key semiconductor capital equipment companies are as follows:

  • Tokyo Electron
  • Canon
  • Concurrent Design
  • ASML
  • Advantest
  • EV Group
  • AMEC
  • Lam Research
  • Hitachi High-Technologies
  • Applied Materials

Q6. Which semiconductor capital equipment market segment will be the largest in future?

Answer: Lucintel forecasts that assembly equipment will remain the largest segment over the forecast period due to strong demand for assembly equipment in the production of integrated circuits.

Q7. In semiconductor capital equipment market, which region is expected to be the largest in next 5 years?

Answer: APAC will remain the largest region over the forecast period due to expanding use of semiconductor capital equipment in the consumer electronics industry, as well as, growth of the semiconductor capital equipment industry mostly to countries such as China, India, and Japan.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the semiconductor capital equipment market by type (assembly equipment, automated test equipment, and wafer level manufacturing equipment), end use (consumer electronics, healthcare, automotive, and information technology & telecommunication), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Semiconductor Capital Equipment Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Semiconductor Capital Equipment Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Semiconductor Capital Equipment Market by Type
    • 3.3.1: Assembly Equipment
    • 3.3.2: Automated Test Equipment
    • 3.3.3: Wafer Level Manufacturing Equipment
  • 3.4: Global Semiconductor Capital Equipment Market by End Use
    • 3.4.1: Consumer electronics
    • 3.4.2: Healthcare
    • 3.4.3: Automotive
    • 3.4.4: Information Technology & Telecommunication

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Semiconductor Capital Equipment Market by Region
  • 4.2: North American Semiconductor Capital Equipment Market
    • 4.2.2: North American Semiconductor Capital Equipment Market by End Use: Consumer electronics, Healthcare, Automotive, and Information Technology & Telecommunication
  • 4.3: European Semiconductor Capital Equipment Market
    • 4.3.1: European Semiconductor Capital Equipment Market by Type: Assembly Equipment, Automated Test Equipment, and Wafer Level Manufacturing Equipment
    • 4.3.2: European Semiconductor Capital Equipment Market by End Use: Consumer electronics, Healthcare, Automotive, and Information Technology & Telecommunication
  • 4.4: APAC Semiconductor Capital Equipment Market
    • 4.4.1: APAC Semiconductor Capital Equipment Market by Type: Assembly Equipment, Automated Test Equipment, and Wafer Level Manufacturing Equipment
    • 4.4.2: APAC Semiconductor Capital Equipment Market by End Use: Consumer electronics, Healthcare, Automotive, and Information Technology & Telecommunication
  • 4.5: ROW Semiconductor Capital Equipment Market
    • 4.5.1: ROW Semiconductor Capital Equipment Market by Type: Assembly Equipment, Automated Test Equipment, and Wafer Level Manufacturing Equipment
    • 4.5.2: ROW Semiconductor Capital Equipment Market by End Use: Consumer electronics, Healthcare, Automotive, and Information Technology & Telecommunication

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Semiconductor Capital Equipment Market by Type
    • 6.1.2: Growth Opportunities for the Global Semiconductor Capital Equipment Market by End Use
    • 6.1.3: Growth Opportunities for the Global Semiconductor Capital Equipment Market by Region
  • 6.2: Emerging Trends in the Global Semiconductor Capital Equipment Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Semiconductor Capital Equipment Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Semiconductor Capital Equipment Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Tokyo Electron
  • 7.2: Canon
  • 7.3: Concurrent Design
  • 7.4: ASML
  • 7.5: Advantest
  • 7.6: EV Group
  • 7.7: AMEC
  • 7.8: Lam Research
  • 7.9: Hitachi High-Technologies
  • 7.10: Applied Materials