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封面
市场调查报告书
商品编码
1433454

全球3D半导体封装市场2023-2030

Global 3D Semiconductor Packaging Market 2023-2030
出版日期: | 出版商: Orion Market Research | 英文 120 Pages | 商品交期: 2-3个工作天内

价格

预计全球 3D 半导体封装市场在预测期内（2024-2031 年）将以 10.2% 的复合CAGR成长。微电子设备对3D半导体封装的需求增加推动了3D半导体封装产业的成长。越来越多采用先进封装技术，提高效率，降低功耗，是支持全球市场成长的关键因素。市场参与者也专注于推出 3D 半导体封装解决方案，以进一步促进市场成长。例如，2023 年 11 月，半导体封装和测试服务供应商 Amkor Technology, Inc. 宣布在亚利桑那州皮奥里亚建造先进的封装和测试设施。到工程全部完成时，Amkor 预计将在新工厂投资约 20 亿美元并僱用约 2,000 名员工。

细分市场前景

全球 3D 半导体封装市场按技术、材料和产业垂直领域进行细分。根据技术，市场可细分为 3D 硅通孔、3D 层迭封装、基于 3D 扇出和 3D 引线接合。根据材料，市场细分为有机基板、键合线、引线框架、封装树脂和陶瓷封装。此外，根据垂直产业，市场细分为电子、工业、汽车和运输、医疗保健、IT 和电信以及航空航太和国防。在垂直行业中，由于透过将多个半导体晶片堆迭在一起的 3D 封装整合发展到了新的水平，预计电子子细分市场将占据相当大的市场份额。

3D 硅通孔子细分市场预计将在全球 3D 半导体封装市场中占据相当大的份额

其中，3D硅通孔技术预计将在全球3D半导体封装市场中占据相当大的份额。细分市场的成长归因于 3D 封装中硅通孔 (TSV) 结构的影响力日益增强。 TSV 用于建构包含多个半导体晶片的 2.5D 和 3D 封装。该结构能够实现垂直堆迭，无需先前在有机基板上的堆迭封装中使用的边缘布线或引线键合。例如，2022 年9 月，EV Group (EVG) 推出了NanoCleave，这是一种革命性的硅层释放技术，可实现前端处理的超薄层堆迭，包括先进逻辑、记忆体和功率装置形成，以及3D半导体先进的封装。

区域展望

全球3D半导体封装市场根据地理位置进一步细分，包括北美（美国和加拿大）、欧洲（英国、义大利、西班牙、德国、法国和欧洲其他地区）、亚太地区（印度、中国、日本、韩国和亚洲其他地区）以及世界其他地区（中东和非洲以及拉丁美洲。其中，亚太地区预计将在全球市场中占据显着份额。为了方便用户使用，对紧凑电子电路的需求以及电子设备尺寸的减小是该区域市场高份额的关键因素。

2021 年半导体产业按活动和地区分類的增加值 (%)

目录

第 1 章：报告摘要

  • 目前行业分析及成长潜力展望
  • 研究方法和工具
  • 市场区隔
    • 按细分
    • 按地区

第 2 章：市场概述与见解

  • 报告范围
  • 分析师见解和当前市场趋势
    • 主要发现
    • 建议
    • 结论

第 3 章：竞争格局

  • 主要公司分析
  • Advanced Micro Devices, Inc.
    • 概述
    • 财务分析
    • SWOT分析
    • 最近的发展
  • Intel Corp.
    • 概述
    • 财务分析
    • SWOT分析
    • 最近的发展
  • Samsung Electronics Co., Ltd.
    • 概述
    • 财务分析
    • SWOT分析
    • 最近的发展
  • 关键策略分析

第 4 章：市场细分

  • 按技术分類的全球 3D 半导体封装市场
    • 3D 硅通孔
    • 3D 封装
    • 基于 3D 扇出
    • 3D 焊接线
  • 按材料分類的全球 3D 半导体封装市场
    • 有机基材
    • 键合线
    • 引线框架
    • 封装树脂
    • 陶瓷封装
  • 按垂直产业分類的全球 3D 半导体封装市场
    • 电子产品
    • 工业的
    • 汽车与运输
    • 卫生保健
    • 资讯科技与电信
    • 航太与国防

第 5 章：区域分析

  • 北美洲
    • 美国
    • 加拿大
  • 欧洲
    • 英国
    • 德国
    • 义大利
    • 西班牙
    • 法国
    • 欧洲其他地区
  • 亚太
    • 中国
    • 印度
    • 日本
    • 韩国
    • 亚太其他地区
  • 世界其他地区

第 6 章：公司简介

  • Amkor Technology
  • Analog Devices, Inc.
  • Cadence Design Systems, Inc.
  • GlobalFoundries
  • Indium Corp.
  • Micron Technology, Inc.
  • NVIDIA Corp.
  • Qualcomm Technologies, Inc.
  • Semiconductor Components Industries, LLC
  • Siliconware Precision Industries Co., Ltd.
  • SK HYNIX INC.
  • STMicroelectronics
  • Taiwan Semiconductor Manufacturing Company Ltd.
  • TEKTRONIX, INC.
  • Texas Instruments Inc.
  • Thermo Fisher Scientific Inc.
  • Tower Semiconductor
  • United Microelectronics Corp.
Product Code: OMR2028041

Global 3D Semiconductor Packaging Market Size, Share & Trends Analysis Report by Technology (Organic Substrate, Bonding Wire, Leadframe, Encapsulation Resin and Ceramic Package), by Material (Organic Substrate, Bonding Wire, Leadframe, Encapsulation Resin and Ceramic Package), and by Industry Vertical (Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication and Aerospace & Defense), Forecast Period (2024-2031)

The global 3D semiconductor packaging market is anticipated to grow at a considerable CAGR of 10.2% during the forecast period (2024-2031). An increased demand for 3D semiconductor packaging in microelectronic devices drives the growth in the 3D semiconductor packaging industry. The growing adoption of advanced packaging technology with improved efficiency, and less power consumption is the key factor supporting the growth of the market globally. The market players are also focusing on introducing 3D semiconductor packaging solutions that further bolster the market growth. For instance, in November 2023, Amkor Technology, Inc., a provider of semiconductor packaging and test services, announced to building of an advanced packaging and test facility in Peoria, Arizona. By the time of full project completion, Amkor projects to invest approximately $2 billion and employ approximately 2,000 people at the new facility.

Segmental Outlook

The global 3D semiconductor packaging market is segmented on the technology, material, and industry verticals. Based on the technology, the market is sub-segmented into 3D through silicon via, 3D package on package, 3D fan out based and 3D wire bonded. Based on the material, the market is sub-segmented into organic substrate, bonding wire, leadframe, encapsulation resin and ceramic package. Further, on the basis of industry verticals, the market is sub-segmented into electronics, industrial, automotive & transport, healthcare, IT & telecommunication and aerospace & defense. Among the industry vertical, the electronics sub-segment is anticipated to hold a considerable share of the market owing to the rise in the development of 3D packaging integration to the next level by stacking multiple semiconductor dies on top of each other.

The 3D Through silicon via Sub-Segment is Anticipated to Hold a Considerable Share of the Global 3D Semiconductor Packaging Market

Among the technology, the 3D Through silicon via sub-segment is expected to hold a considerable share of the global 3D semiconductor packaging market. The segmental growth is attributed to the growing influence of the Through-Silicon Via (TSV) Structures in 3D Packages. TSVs are used to build 2.5D and 3D packages that contain multiple semiconductor dies. The structures enable vertical stacking without the edge wiring or wire bonding that was formerly used in stacked packages on organic substrates. For instance, in September 2022, EV Group (EVG) launched NanoCleave, a revolutionary layer release technology for silicon that enables ultra-thin layer stacking for front-end processing, including advanced logic, memory and power device formation, as well as 3D semiconductor advanced packaging.

Regional Outlook

The global 3D semiconductor packaging market is further segmented based on geography including North America (the US, and Canada), Europe (UK, Italy, Spain, Germany, France, and the Rest of Europe), Asia-Pacific (India, China, Japan, South Korea, and Rest of Asia), and the Rest of the World (the Middle East & Africa, and Latin America. Among these, Asia-Pacific is anticipated to hold a prominent share of the market across the globe. The increased demand for compact electronic circuitry with the decreasing size of electronic devices for ease of access for users is a key contributor to the high share of the regional market.

Semiconductor Industry Value Added by Activity and Region 2021 (%)

Source: Semiconductor Industry Association

North America is Expected to Grow at a Considerable CAGR in the Global 3D Semiconductor Packaging Market

Among all regions, the North America regions is anticipated to grow at a considerable CAGR over the forecast period. Regional growth is attributed to the increasing production of semiconductor components, the presence of a large consumer base for electronics products, the high penetration of smartphones among the young population and a strong R&D pipeline for the semiconductor industries drive the growth of the market in the region. The key market players include Advanced Micro Devices, Inc., Amkor Technology, Intel Corp., Microchip Technology Inc., NVIDIA Corp. and others.

Making substantial investments in domestic packaging capabilities and R&D is critical to creating a thriving semiconductor ecosystem in the region. For instance, in November 2023, the National Institute of Standards and Technology (NIST) released an approximately $3 billion National Advanced Packaging Manufacturing Program. The program boosts U.S. advanced packaging capabilities for semiconductors.

Market Players Outlook

The major companies serving the 3D semiconductor packaging market include Advanced Micro Devices, Inc., Amkor Technology, Intel Corp., Samsung Electronics Co., Ltd., United Microelectronics Corp., and others. The market players are considerably contributing to the market growth by the adoption of various strategies including mergers and acquisitions, partnerships, collaborations, funding, and new product launches, to stay competitive in the market. For instance, in June 2023, Cadence Design Systems, Inc. expanded collaboration with Samsung Foundry to accelerate 3D-IC design development for integrity 3D-IC platform supports Samsung's new 3D CODE standard, enabling designers to create a variety of advanced packaging technologies.

The Report Covers:

  • Market value data analysis of 2023 and forecast to 2031.
  • Annualized market revenues ($ million) for each market segment.
  • Country-wise analysis of major geographical regions.
  • Key companies operating in the global 3D semiconductor packaging market. Based on the availability of data, information related to new product launches, and relevant news is also available in the report.
  • Analysis of business strategies by identifying the key market segments positioned for strong growth in the future.
  • Analysis of market-entry and market expansion strategies.
  • Competitive strategies by identifying 'who-stands-where' in the market.

Table of Contents

1. Report Summary

  • Current Industry Analysis and Growth Potential Outlook
  • 1.1. Research Methods and Tools
  • 1.2. Market Breakdown
    • 1.2.1. By Segments
    • 1.2.2. By Region

2. Market Overview and Insights

  • 2.1. Scope of the Report
  • 2.2. Analyst Insight & Current Market Trends
    • 2.2.1. Key Findings
    • 2.2.2. Recommendations
    • 2.2.3. Conclusion

3. Competitive Landscape

  • 3.1. Key Company Analysis
  • 3.2. Advanced Micro Devices, Inc.
    • 3.2.1. Overview
    • 3.2.2. Financial Analysis
    • 3.2.3. SWOT Analysis
    • 3.2.4. Recent Developments
  • 3.3. Intel Corp.
    • 3.3.1. Overview
    • 3.3.2. Financial Analysis
    • 3.3.3. SWOT Analysis
    • 3.3.4. Recent Developments
  • 3.4. Samsung Electronics Co., Ltd.
    • 3.4.1. Overview
    • 3.4.2. Financial Analysis
    • 3.4.3. SWOT Analysis
    • 3.4.4. Recent Developments
  • 3.5. Key Strategy Analysis

4. Market Segmentation

  • 4.1. Global 3D Semiconductor Packaging Market by Technology
    • 4.1.1. 3D Through silicon via
    • 4.1.2. 3D Package on Package
    • 4.1.3. 3D Fan Out Based
    • 4.1.4. 3D Wire Bonded
  • 4.2. Global 3D Semiconductor Packaging Market by Material
    • 4.2.1. Organic Substrate
    • 4.2.2. Bonding Wire
    • 4.2.3. Leadframe
    • 4.2.4. Encapsulation Resin
    • 4.2.5. Ceramic Package
  • 4.3. Global 3D Semiconductor Packaging Market by Industry Vertical
    • 4.3.1. Electronics
    • 4.3.2. Industrial
    • 4.3.3. Automotive & Transport
    • 4.3.4. Healthcare
    • 4.3.5. IT & Telecommunication
    • 4.3.6. Aerospace & Defense

5. Regional Analysis

  • 5.1. North America
    • 5.1.1. United States
    • 5.1.2. Canada
  • 5.2. Europe
    • 5.2.1. UK
    • 5.2.2. Germany
    • 5.2.3. Italy
    • 5.2.4. Spain
    • 5.2.5. France
    • 5.2.6. Rest of Europe
  • 5.3. Asia-Pacific
    • 5.3.1. China
    • 5.3.2. India
    • 5.3.3. Japan
    • 5.3.4. South Korea
    • 5.3.5. Rest of Asia-Pacific
  • 5.4. Rest of the World

6. Company Profiles

  • 6.1. Amkor Technology
  • 6.2. Analog Devices, Inc.
  • 6.3. Cadence Design Systems, Inc.
  • 6.4. GlobalFoundries
  • 6.5. Indium Corp.
  • 6.6. Micron Technology, Inc.
  • 6.7. NVIDIA Corp.
  • 6.8. Qualcomm Technologies, Inc.
  • 6.9. Semiconductor Components Industries, LLC
  • 6.10. Siliconware Precision Industries Co., Ltd.
  • 6.11. SK HYNIX INC.
  • 6.12. STMicroelectronics
  • 6.13. Taiwan Semiconductor Manufacturing Company Ltd.
  • 6.14. TEKTRONIX, INC.
  • 6.15. Texas Instruments Inc.
  • 6.16. Thermo Fisher Scientific Inc.
  • 6.17. Tower Semiconductor
  • 6.18. United Microelectronics Corp.

LIST OF TABLES

  • 1. GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY TECHNOLOGY, 2023-2031 ($ MILLION)
  • 2. GLOBAL 3D THROUGH SILICON VIA SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 3. GLOBAL 3D PACKAGE ON PACKAGE SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 4. GLOBAL 3D FAN OUT BASED SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 5. GLOBAL 3D WIRE BONDED SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 6. GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY MATERIAL, 2023-2031 ($ MILLION)
  • 7. GLOBAL ORGANIC SUBSTRATE 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 8. GLOBAL BONDING WIRE 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 9. GLOBAL LEADFRAME 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 10. GLOBAL ENCAPSULATION RESIN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 11. GLOBAL CERAMIC PACKAGE 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 12. GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY INDUSTRY VERTICAL, 2023-2031 ($ MILLION)
  • 13. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR ELECTRONICS MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 14. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR INDUSTRIAL MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 15. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR AUTOMOTIVE & TRANSPORT MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 16. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR HEALTHCARE MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 17. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR IT & TELECOMMUNICATION MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 18. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR AEROSPACE & DEFENSE MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 19. GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 20. NORTH AMERICAN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY COUNTRY, 2023-2031 ($ MILLION)
  • 21. NORTH AMERICAN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY TECHNOLOGY, 2023-2031 ($ MILLION)
  • 22. NORTH AMERICAN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY MATERIAL, 2023-2031 ($ MILLION)
  • 23. NORTH AMERICAN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY INDUSTRY VERTICAL, 2023-2031 ($ MILLION)
  • 24. EUROPEAN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY COUNTRY, 2023-2031 ($ MILLION)
  • 25. EUROPEAN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY TECHNOLOGY, 2023-2031 ($ MILLION)
  • 26. EUROPEAN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY MATERIAL, 2023-2031 ($ MILLION)
  • 27. EUROPEAN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY INDUSTRY VERTICAL, 2023-2031 ($ MILLION)
  • 28. ASIA- PACIFIC 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY COUNTRY, 2023-2031 ($ MILLION)
  • 29. ASIA- PACIFIC 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY TECHNOLOGY, 2023-2031 ($ MILLION)
  • 30. ASIA- PACIFIC 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY MATERIAL, 2023-2031 ($ MILLION)
  • 31. ASIA- PACIFIC 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY INDUSTRY VERTICAL, 2023-2031 ($ MILLION)
  • 32. REST OF THE WORLD 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023-2031 ($ MILLION)
  • 33. REST OF THE WORLD 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY TECHNOLOGY, 2023-2031 ($ MILLION)
  • 34. REST OF THE WORLD 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY MATERIAL, 2023-2031 ($ MILLION)
  • 35. REST OF THE WORLD 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY INDUSTRY VERTICAL, 2023-2031 ($ MILLION)

LIST OF FIGURES

  • 1. GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY TECHNOLOGY, 2023 VS 2031 (%)
  • 2. GLOBAL 3D THROUGH SILICON VIA SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 3. GLOBAL 3D PACKAGE ON PACKAGE SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 4. GLOBAL 3D FAN OUT BASED SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 5. GLOBAL 3D WIRE BONDED SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 6. GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY MATERIAL, 2023 VS 2031 (%)
  • 7. GLOBAL ORGANIC SUBSTRATE 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 8. GLOBAL BONDING WIRE 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 9. GLOBAL LEADFRAME 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 10. GLOBAL ENCAPSULATION RESIN 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 11. GLOBAL CERAMIC PACKAGE 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 12. GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY INDUSTRY VERTICAL, 2023 VS 2031 (%)
  • 13. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR ELECTRONICS MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 14. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR INDUSTRIAL MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 15. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR AUTOMOTIVE & TRANSPORT MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 16. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR HEALTHCARE MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 17. GLOBAL 3D SEMICONDUCTOR PACKAGING FOR IT & TELECOMMUNICATION MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 18. GLOBAL 3D SEMICONDUCTOR PACKAGING AEROSPACE & DEFENSE MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 19. GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET RESEARCH AND ANALYSIS BY REGION, 2023 VS 2031 (%)
  • 20. US 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 21. CANADA 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 22. UK 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 23. FRANCE 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 24. GERMANY 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 25. ITALY 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 26. SPAIN 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 27. REST OF EUROPE 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 28. INDIA 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 29. CHINA 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 30. JAPAN 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 31. SOUTH KOREA 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 32. REST OF ASIA-PACIFIC 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)
  • 33. REST OF THE WORLD 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2023-2031 ($ MILLION)