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市场调查报告书
商品编码
1425063

半导体封装市场 - 2024 年至 2029 年预测

Semiconductor Packaging Market - Forecasts from 2024 to 2029
出版日期: | 出版商: Knowledge Sourcing Intelligence | 英文 140 Pages | 商品交期: 最快1-2个工作天内

价格
简介目录

2022年半导体封装市值为227.69亿美元，复合年增长率为2.48%，到2029年市场规模将达270.28亿美元。

推动半导体封装市场成长的主要原因之一是全球半导体产业的扩张。众多终端用户产业不断增长的需求以及使用封装来提高电子系统的性能、可靠性和成本效益，有助于在整合度、能源效率和产品特性方面不断改进，从而加速市场成长。对产业产生影响的另一个因素是家用电子电器和工业产品对采用应力分析、动态、动力学和传热等机械工程概念的创新包装的需求不断增长。此外，半导体行业的成长、可支配收入的增加以及降低相关成本和提高 IC 整体效率的迫切需求正在对半导体封装市场产生有益的影响。此外，物联网、人工智慧的出现以及先进电子产品的普及为市场参与企业带来了利润丰厚的可能性。

介绍

半导体封装材料用于半导体装置製造的最后阶段，以保护半导体装置免受劣化和其他外部影响。有机基板、焊球、接合线、引线框架等材料具有优异的性能，用于电子设备中防止腐蚀和磨损。近年来，平板电脑、行动电话和其他通讯设备等电子设备的普及激增，导致半导体封装市场的需求不断增加。由于家用电子电器需求不断增长等因素，半导体和IC封装市场正在经历显着扩张。此外，由于人们对电子封装材料的使用意识不断增强，半导体、 IC封装材料市场的主要竞争对手拥有巨大的市场潜力。

促进因素

  • 消费者对先进电子产品的兴趣日益浓厚正在推动市场扩张：推动半导体封装市场的关键因素之一是对智慧型手机、平板电脑、穿戴式装置和物联网设备等高科技电子产品的需求不断增长。客户需要更紧凑、更强大且功能丰富的产品，需要创新的封装概念来适应复杂的功能，同时保持最大的效能和可靠性。
  • 封装解决方案的创新：半导体封装技术的不断改进正在扩大市场。新的包装方法、组件和设计不断涌现，以满足不断变化的行业需求。采用扇出封装、晶圆层次电子构装(WLP) 和覆晶等尖端封装技术可提高效能、小型化和成本效率，是推动市场扩张的部分原因。
  • 日益关注小型化和整合度：主要成长要素之一是半导体元件的小型化和更高整合度的趋势。随着设备变得更小、整合度更高，需要封装技术来将更多处理器、被动元件和互连装置安装到有限的空间中。系统级封装 (SiP) 和 3D 封装是先进封装技术的范例，可提供更高层级的整合和卓越的功能。
  • 对高效能、低功耗解决方案的需求不断增加：对高效能运算、人工智慧和边缘运算应用的需求不断增长，需要能够提供高处理能力同时降低功耗的半导体封装解决方案。为了实现这些应用，迫切需要具有改进的温度控管、功率传输和讯号完整性的封装解决方案，这有助于半导体封装并推动成长。
  • 5G 技术使用的增加推动了市场扩张：由于 5G 网络，特别是射频 (RF) 和毫米波设备的广泛部署，半导体需求迅速增加。这些组件需要特殊的封装解决方案才能在 5G 应用中完美可靠地运作。由于云端处理服务需求的增加和资料中心的快速成长，对高效能运算（HPC）解决方案的需求不断增加。资料中心的效能和能源效率需求必须透过2.5D和3D封装等先进封装技术来满足。

主要企业提供的产品

  • 2.5D封装：i-Cube(TM) & H-Cube(TM)，三星：i-Cube采用平行水平晶片排列，提升效能的同时减少热量产生。三星的硅通孔(TSV) 和BEOL（后段生产线）技术为两个或多个晶片结合其专业功能提供了基础，为现代电子产品提供了有效的解决方案。正因为如此，它们比各自技术的总合更有效。成分。根据内插器层的类型，I-CubeTM 可提供 I-CubeSTM 和 I-CubeETM 变体。
  • 基于引线框架的封装，ChipMOS：ChipMOS 提供多种封装变体，为我们的客户提供多种封装选择。基于引线框架的封装包括小外形封装 (SOP)、薄型小外形封装 (TSOP) 和四方扁平封装 (LQFP/TQFP)。也提供基于基板的封装，例如 FBGA、VFBGA、堆迭式 CSP、TFBGA、LGA、COG 和 COF。为了促进封装设计和製造参数的最佳化，ChipMOS 使用最先进的电脑辅助工程 (CAE) 模拟工具进行电气和热评估。

包装材料领域陶瓷包装领域成长显着

陶瓷封装领域以最高的收益占据市场主导地位，预计将以显着的成长率扩张。 Al2O3 占陶瓷封装的 90% 至 94%，其余成分是形成玻璃的碱土硅酸盐。硅晶片安装在封装内部，玻璃或金属顶部将封装固定到位。由于安全功能、舒适性、稳定性和高性能等多种汽车零件中电子元件的快速采用，汽车行业对陶瓷封装的需求大幅增加，预计该子区隔将大幅增长。整个时期发展。

亚太地区预计将占据半导体封装市场的主要份额：

亚太地区的收益占有率在半导体封装市场中处于领先地位，预计在整个预测期内将继续保持这一领先地位。由于中国、台湾、韩国和新加坡等国家，亚太地区已成为世界半导体生产中心。这些国家进行了大规模的基础设施投资、最尖端科技和技术纯熟劳工，为半导体供应链创造了有利的环境。台积电（台湾积体电路製造公司）、三星和SK海力士只是亚洲最大、最前沿的半导体公司中的一些。这些公司正在为半导体封装技术的创新和製定行业标准铺平道路。为了生产半导体，亚太地区开发了专门的丛集。例如，台湾新竹科学园区是世界领先的半导体研发中心之一的所在地。亚太地区庞大的半导体製造量带来了规模经济，从而降低了当地公司的成本。亚太国家大力投资半导体技术研发，鼓励创新，保持该产业处于封装技术和材料的前沿。

目录

第一章简介

  • 市场概况
  • 市场定义
  • 调查范围
  • 市场区隔
  • 货币
  • 先决条件
  • 基准年和预测年时间表

第二章调查方法

  • 调查资料
  • 调查过程

第三章执行摘要

  • 主要发现

第四章市场动态

  • 市场驱动因素
  • 市场限制因素
  • 波特五力分析
  • 产业价值链分析

第五章半导体封装市场：依封装类型

  • 介绍
  • 先进封装
    • 覆晶
    • 嵌入式晶粒
    • 扇出级封装 (FO-WLP)
    • 扇入级封装 (FI-WLP)

第六章半导体封装市场：依封装材料分类

  • 介绍
  • 有机基材
  • 引线框架
  • 陶瓷包装
  • 接合线
  • 其他的

第七章 半导体封装市场：依最终使用者分类

  • 介绍
  • 家用电器
  • 航太和国防
  • 医疗设备
  • 通讯和电讯
  • 其他的

第八章半导体封装市场：依地区

  • 介绍
  • 北美洲
    • 美国
    • 加拿大
    • 墨西哥
  • 南美洲
    • 巴西
    • 阿根廷
    • 其他的
  • 欧洲
    • 英国
    • 德国
    • 法国
    • 义大利
    • 西班牙
    • 其他的
  • 中东/非洲
    • 沙乌地阿拉伯
    • 阿拉伯聯合大公国
    • 其他的
  • 亚太地区
    • 日本
    • 中国
    • 印度
    • 韩国
    • 台湾
    • 泰国
    • 印尼
    • 其他的

第九章竞争环境及分析

  • 主要企业及策略分析
  • 市场占有率分析
  • 合併、收购、协议和合作
  • 供应商竞争力矩阵

第十章 公司简介

  • ASE
  • Amkor Technology
  • Powertech Technology Inc.
  • Fujitsu Semiconductor Limited
  • ChipMOS TECHNOLOGIES INC.
  • Intel Corporation
  • Samsung Electronics Co. Ltd
  • Unisem（M）Berhad
  • ISI-Interconnect Systems
  • Jiangsu Changjiang Electronics Technology Co. Ltd.（JCET）
简介目录
Product Code: KSI061616099

The semiconductor packaging market is evaluated at US$22.769 billion for the year 2022 growing at a CAGR of 2.48% reaching the market size of US$27.028 billion by the year 2029.

One of the key reasons propelling the growth of the semiconductor packaging market is the expansion of the semiconductor industry globally. The growing demand across numerous end-user industries and the use of packaging to enhance the performance, reliability, and cost-effectiveness of electronic systems all contribute to ongoing improvements in terms of integration, energy efficiency, and product characteristics, which accelerate market growth. The industry is also being affected by the rise in demand for innovative packaging in consumer electronics and industrial items that use mechanical engineering concepts including stress analysis, fluid mechanics, dynamics, and heat transfer. Furthermore, the growth of the semiconductor industry, the rise in disposable income, and the pressing need to reduce the associated costs and improve the overall efficacy of ICs have a beneficial impact on the semiconductor packaging market. Additionally, the emergence of IoT, AI, and the widespread use of advanced electronics in the projection period open up lucrative potential for market participants.

Introduction:

Semiconductor packaging materials are used in the final stages of the production of semiconductor devices to protect them from degradation and other external influences. Organic substrates, solder balls, bonding wires, lead frames, and other materials provide superior performance and are used to guard against corrosion and wear and tear on electronic equipment. Due to the surge in popularity of electronic devices like tablets, mobile phones, and other communication devices during the past few years, there has been an increase in the need for semiconductor packaging market. Due to factors including the increase in demand for consumer electronics, the market for semiconductor, and IC packaging market has seen tremendous expansion. Additionally, the leading competitors in the semiconductor, and IC packaging materials market have tremendous market potential due to the growing awareness of the use of electronic packaging materials.

Drivers:

  • Growing consumer interest in advanced electronic devices is boosting market expansion: One of the main factors propelling the semiconductor packaging market is the rising demand for high-tech electronic gadgets like smartphones, tablets, wearables, and IoT devices. Customers are looking for products that are more compact, powerful, and feature-rich, thus there is a need for innovative package ideas that can contain complex features while maintaining maximum performance and dependability.
  • Innovations in Technology for Packaging Solutions: The market is expanding as a result of the ongoing improvements in semiconductor packaging technology. To suit the changing needs of the industry, new packaging methods, components, and designs are being invented. The adoption of cutting-edge packaging techniques like fan-out packaging, wafer-level packaging (WLP), and flip-chip, which offer enhanced performance, miniaturization, and cost-effectiveness, are a few reasons aiding in market expansion.
  • Greater attention paid to miniaturization and integration: One of the main growth drivers is the tendency for semiconductor components to get smaller and more integrated. There is a need for packaging methods that can fit many processors, passive components, and interconnects within constrained space as devices get smaller and more concise. System-in-package (SiP) and 3D packaging are examples of advanced packaging technologies that offer higher degrees of integration and better functionality.
  • Rise in demand for high-performance and low-power solutions: The need for semiconductor packaging solutions that can give high processing power while reducing power consumption is being fueled by the rising need for high-performance computing, artificial intelligence, and edge computing applications. To enable these applications, packaging solutions with improved heat management, power delivery, and signal integrity are highly sought after which is aided by semiconductor packaging thus fueling growth.
  • Rise in the usage of 5G technology to fuel market expansion: The need for semiconductors has surged as a result of the widespread deployment of 5G networks, notably for RF (Radio Frequency) and mm-wave devices. For these components to work flawlessly and with dependability in 5G applications, special packaging solutions are required. The requirement for high-performance computing (HPC) solutions has increased due to the growing demand for cloud computing services and the quick growth of data centers. The performance and power efficiency requirements for data centers must be met through the use of advanced packaging technologies, such as 2.5D and 3D packaging.

Products offered by key companies:

  • 2.5D Package: I-Cube™ & H-Cube™, Samsung: Parallel horizontal chip arrangement is used by I-Cube to improve performance while reducing heat buildup. Silicon Via (TSV) and Backend-of-the-Line (BEOL) technologies from Samsung serve as a basis for two or more chips to combine their specialized capabilities and become more effective than the sum of their components to provide effective solutions for contemporary electronics. Depending on the interposer type, I-CubeTM is offered in the variants I-CubeSTM and I-CubeETM.
  • Leadframe-based packages, ChipMOS: To provide its clients with a variety of packaging choices, ChipMOS delivers a wide selection of package variants. Leadframe-based packages like the small outline package (SOP), thin small outline package (TSOP), and quad flat package (LQFP/TQFP) are among the packages that are offered. Substrate-based packages like FBGA, VFBGA, stacked CSP, TFBGA, LGA, COG, and COF are also available. To ease package design and manufacturing parameter optimization, ChipMOS uses cutting-edge computer-aided engineering (CAE) simulation tools for both electrical and thermal evaluations.

The prominent growth in the ceramic package sector under the Packaging Material Segment

The ceramic package segment is projected to dominate the market with the highest revenue and is expected to expand at a significant growth rate. Al2O3 makes up 90% to 94% of ceramic packaging, with the remaining ingredients being glass-forming alkaline earth silicates. The package has a silicon chip installed inside, and a glass or metal top secures the package. This sub-segment is anticipated to develop throughout the forecast period due to the large rise in demand for ceramic packaging from the automotive sector as a result of the quick adoption of electronic components in several vehicle parts that include safety features, comfort, stability, and high performance.

The Asia Pacific region is expected to hold a significant share of the Semiconductor Packaging market:

Asia Pacific led the market for semiconductor packaging in terms of revenue share and is anticipated to continue to do so throughout the anticipated period. Asia Pacific has established itself as the hub of semiconductor production globally thanks to countries like China, Taiwan, South Korea, and Singapore. These countries have invested in large infrastructure investments, cutting-edge technology, and skilled labour, creating a favourable environment for the semiconductor supply chain. TSMC (Taiwan Semiconductor Manufacturing Company), Samsung, and SK Hynix are just some of Asia's largest and most cutting-edge semiconductor companies. These companies are paving the path for innovation in semiconductor packaging technologies and setting standards for the industry. To produce semiconductors, Asia Pacific has developed specialized clusters. Taiwan's Hsinchu Science Park, for example, is home to one of the world's most important semiconductor research and development centers. As a result of economies of scale made possible by the sheer volume of semiconductor manufacture in the Asia Pacific region, costs are reduced for local companies. Asia Pacific nations make considerable investments in semiconductor technology research and development, encouraging innovation and keeping the field at the cutting edge of packaging techniques and materials.

Key developments

  • A new kind of semiconductor packaging named Foveros Omni is being developed by Intel, and it will be released in September 2023. With the use of the 3D packaging method Foveros Omni, it is possible to stack many dies on top of one another, which can result in considerable performance and power efficiency gains.
  • VIPack, an advanced packaging platform created to support vertically integrated packaging solutions, was introduced by ASE Group in June 2022. The VIPack is ASE's next-generation 3D heterogeneous integration architecture, which offers extremely high performance and density while extending design principles.

SEGMENTS:

BY PACKAGING TYPE

  • Advanced Packaging
  • Flip Chip
  • Embedded Die
  • Fan-Out Level Packaging (FO-WLP)
  • Fan-In Level Packaging (FI-WLP)

BY PACKAGING MATERIAL

  • Organic Substrate
  • Leadframe
  • Ceramic Packaging
  • Bonding-Wire
  • Others

BY END-USER

  • Consumer Electronics
  • Aerospace and Defense
  • Medical Devices
  • Communication and Telecom
  • Others

BY GEOGRAPHY

  • North America
  • United States
  • Canada
  • Mexico
  • South America
  • Brazil
  • Argentina
  • Others
  • Europe
  • United Kingdom
  • Germany
  • France
  • Italy
  • Spain
  • Others
  • Middle East and Africa
  • Saudi Arabia
  • UAE
  • Others
  • Asia Pacific
  • Japan
  • China
  • India
  • South Korea
  • Taiwan
  • Thailand
  • Indonesia
  • Others

TABLE OF CONTENTS

1. INTRODUCTION

  • 1.1. Market Overview
  • 1.2. Market Definition
  • 1.3. Scope of the Study
  • 1.4. Market Segmentation
  • 1.5. Currency
  • 1.6. Assumptions
  • 1.7. Base, and Forecast Years Timeline

2. RESEARCH METHODOLOGY

  • 2.1. Research Data
  • 2.2. Research Process

3. EXECUTIVE SUMMARY

  • 3.1. Key Findings

4. MARKET DYNAMICS

  • 4.1. Market Drivers
  • 4.2. Market Restraints
  • 4.3. Porter's Five Forces Analysis
    • 4.3.1. Bargaining Power of Suppliers
    • 4.3.2. Bargaining Power of Buyers
    • 4.3.3. Threat of New Entrants
    • 4.3.4. Threat of Substitutes
    • 4.3.5. Competitive Rivalry in the Industry
  • 4.4. Industry Value Chain Analysis

5. SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING TYPE

  • 5.1. Introduction
  • 5.2. Advanced Packaging
    • 5.2.1. Flip Chip
    • 5.2.2. Embedded Die
    • 5.2.3. Fan-Out Level Packaging (FO-WLP)
    • 5.2.4. Fan-In Level Packaging (FI-WLP)

6. SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL

  • 6.1. Introduction
  • 6.2. Organic Substrate
  • 6.3. Leadframe
  • 6.4. Ceramic Packaging
  • 6.5. Bonding-Wire
  • 6.6. Others

7. SEMICONDUCTOR PACKAGING MARKET, BY END-USER

  • 7.1. Introduction
  • 7.2. Consumer Electronics
  • 7.3. Aerospace and Defense
  • 7.4. Medical Devices
  • 7.5. Communication and Telecom
  • 7.6. Others

8. SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY

  • 8.1. Introduction
  • 8.2. North America
    • 8.2.1. United States
    • 8.2.2. Canada
    • 8.2.3. Mexico
  • 8.3. South America
    • 8.3.1. Brazil
    • 8.3.2. Argentina
    • 8.3.3. Others
  • 8.4. Europe
    • 8.4.1. United Kingdom
    • 8.4.2. Germany
    • 8.4.3. France
    • 8.4.4. Italy
    • 8.4.5. Spain
    • 8.4.6. Others
  • 8.5. The Middle East and Africa
    • 8.5.1. Saudi Arabia
    • 8.5.2. UAE
    • 8.5.3. Others
  • 8.6. Asia Pacific
    • 8.6.1. Japan
    • 8.6.2. China
    • 8.6.3. India
    • 8.6.4. South Korea
    • 8.6.5. Taiwan
    • 8.6.6. Thailand
    • 8.6.7. Indonesia
    • 8.6.8. Others

9. COMPETITIVE ENVIRONMENT AND ANALYSIS

  • 9.1. Major Players and Strategy Analysis
  • 9.2. Market Share Analysis
  • 9.3. Mergers, Acquisitions, Agreements, and Collaborations
  • 9.4. Vendor Competitiveness Matrix

10. COMPANY PROFILES

  • 10.1. ASE
  • 10.2. Amkor Technology
  • 10.3. Powertech Technology Inc.
  • 10.4. Fujitsu Semiconductor Limited
  • 10.5. ChipMOS TECHNOLOGIES INC.
  • 10.6. Intel Corporation
  • 10.7. Samsung Electronics Co. Ltd
  • 10.8. Unisem (M) Berhad
  • 10.9. ISI - Interconnect Systems
  • 10.10. Jiangsu Changjiang Electronics Technology Co. Ltd. (JCET)