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市场调查报告书
商品编码
1418046

先进半导体封装市场报告：2030 年趋势、预测与竞争分析

Advanced Semiconductor Packaging Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 - page report | 商品交期: 3个工作天内

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简介目录

先进半导体封装趋势与预测

全球先进半导体封装市场预计到 2030 年将达到 474 亿美元，2024 年至 2030 年复合年增长率为 7.6%。该市场的主要驱动力是电子设备普及的不断提高、对晶圆级封装的日益关注以及对半导体封装技术的投资和研发不断增长。全球先进半导体封装市场的未来前景看好，汽车、航太和国防、医疗设备和消费性电子产业市场充满机会。

先进半导体封装市场洞察

Lucintel 预测，由于卓越的电气性能、高连接器密度和小外形尺寸，扇出晶圆级封装在预测期内仍将是最大的细分市场。

由于对创新封装技术的需求不断增加，汽车和消费性电子产业市场的快速发展和扩张，以及5G、人工智慧和物联网等新兴技术的崛起，亚太地区将在预测期内继续成为最大的细分市场。那。

常问问题

Q1.市场规模有多大？

A1. 到2030年，全球先进半导体封装市场预计将达到474亿美元。

Q2.市场成长预测如何？

A2. 2024年至2030年，全球先进半导体封装市场预计将以7.6%的复合年增长率成长。

Q3.影响市场成长的主要驱动因素有哪些？

A3. 该市场的主要驱动力是电子设备的日益普及、对晶圆级封装的日益关注以及半导体封装技术的投资和研发的扩大。

Q4.市场的主要细分市场是什么？

A4. 全球先进半导体封装市场前景广阔，汽车、航太和国防、医疗设备和消费性电子产业市场充满机会。

Q5.市场上主要企业有哪些？

A5. 先进半导体封装的主要企业如下。

  • Advanced Semiconductor Engineering
  • Intel
  • Advanced Micro Devices
  • Amkor Technology
  • Hitachi Chemical
  • Jiangsu Changjiang Electronics Technology
  • Infineon
  • Kyocera
  • Sumitomo Chemical
  • China Wafer Level CSP

Q6.未来最大的细分市场是什么？

A6.Lucintel 预测，由于扇出晶圆级封装具有卓越的电气性能、高连接器密度和小外形尺寸，因此在预测期内仍将是最大的细分市场。

Q7. 未来五年预计哪个地区将成为最大的市场？

A7.由于对创新封装技术的需求不断增加，汽车和消费性电子产业市场的快速发展和扩大，以及5G、人工智慧和物联网等新兴技术的崛起，亚太地区在预测期内仍将是最大的细分市场。

Q8. 可以客製化报告吗？

A8. 是的，Lucintel 提供 10% 的客製化服务，无需额外付费。

目录

第一章执行摘要

第二章全球先进半导体封装市场：市场动态

  • 简介、背景、分类
  • 供应链
  • 产业驱动因素与挑战

第三章 2018-2030年市场趋势及预测分析

  • 宏观经济趋势（2018-2023）与预测（2024-2030）
  • 全球先进半导体封装市场趋势（2018-2023）与预测（2024-2030）
  • 全球先进半导体封装市场（按类型）
    • 扇出晶圆级封装
    • 5D/3D
    • 扇入式晶圆级封装
    • 覆晶
  • 全球先进半导体封装市场（依应用）
    • 车
    • 航太和国防
    • 医疗设备
    • 家用电器
    • 其他的

第四章 2018-2030年区域市场趋势及预测分析

  • 全球先进半导体封装市场区域分布
  • 北美先进半导体封装市场
  • 欧洲先进半导体封装市场
  • 亚太先进半导体封装市场
  • 其他地区先进半导体封装市场

第五章 竞争分析

  • 产品系列分析
  • 营运整合
  • 波特五力分析

第六章 成长机会与策略分析

  • 成长机会分析
    • 全球先进半导体封装市场成长机会（按类型）
    • 全球先进半导体封装市场成长机会（按应用）
    • 全球先进半导体封装市场成长机会（按地区）
  • 全球先进半导体封装市场新趋势
  • 战略分析
    • 新产品开发
    • 扩大全球先进半导体封装市场产能
    • 全球先进半导体封装市场的合併、收购与合资
    • 认证和许可

第七章主要企业概况

  • Advanced Semiconductor Engineering
  • Intel
  • Advanced Micro Devices
  • Amkor Technology
  • Hitachi Chemical
  • Jiangsu Changjiang Electronics Technology
  • Infineon
  • Kyocera
  • Sumitomo Chemical
  • China Wafer Level CSP
简介目录

Advanced Semiconductor Packaging Trends and Forecast

The future of the global advanced semiconductor packaging market looks promising with opportunities in the automotive, aerospace and defence, medical device, and consumer electronics markets. The global advanced semiconductor packaging market is expected to reach an estimated $47.4 billion by 2030 with a CAGR of 7.6% from 2024 to 2030. The major drivers for this market are rising adoption of electronic devices, increasing focus on wafer-level packages, as well as, growing investments and R&D in semiconductor packaging technologies.

A more than 150-page report is developed to help in your business decisions.

Advanced Semiconductor Packaging by Segment

The study includes a forecast for the global advanced semiconductor packaging by type, application, and region.

Advanced Semiconductor Packaging Market by Type [Shipment Analysis by Value from 2018 to 2030]:

  • Fan-Out Wafer Level Package
  • 5D/3D
  • Fan-In Wafer Level Package
  • Flip Chip

Advanced Semiconductor Packaging Market by Application [Shipment Analysis by Value from 2018 to 2030]:

  • Automotive
  • Aerospace and Defence
  • Medical Devices
  • Consumer Electronics
  • Others

Advanced Semiconductor Packaging Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Advanced Semiconductor Packaging Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies advanced semiconductor packaging companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the advanced semiconductor packaging companies profiled in this report include-

  • Advanced Semiconductor Engineering
  • Intel
  • Advanced Micro Devices
  • Amkor Technology
  • Hitachi Chemical
  • Jiangsu Changjiang Electronics Technology
  • Infineon
  • Kyocera
  • Sumitomo Chemical
  • China Wafer Level CSP

Advanced Semiconductor Packaging Market Insights

Lucintel forecasts that fan-out wafer level package will remain the largest segment over the forecast period due to its superior electrical performance, high connector density, and small form factor.

APAC will remain the largest segment over the forecast period due to region's increasing demand for innovative packaging technologies, rapid developments and expansion of automotive, and consumer electronics industries, as well as the rise of emerging technologies like 5G, AI, and IoT.

Features of the Global Advanced Semiconductor Packaging Market

Market Size Estimates: Advanced semiconductor packaging market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Advanced semiconductor packaging market size by type, application, and region in terms of value ($B).

Regional Analysis: Advanced semiconductor packaging market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different type, application, and regions for the advanced semiconductor packaging market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the advanced semiconductor packaging market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the advanced semiconductor packaging market size?

Answer: The global advanced semiconductor packaging market is expected to reach an estimated $47.4 billion by 2030.

Q2. What is the growth forecast for advanced semiconductor packaging market?

Answer: The global advanced semiconductor packaging market is expected to grow with a CAGR of 7.6% from 2024 to 2030.

Q3. What are the major drivers influencing the growth of the advanced semiconductor packaging market?

Answer: The major drivers for this market are rising adoption of electronic devices, increasing focus on wafer-level packages, as well as, growing investments and R&D in semiconductor packaging technologies.

Q4. What are the major segments for advanced semiconductor packaging market?

Answer: The future of the global advanced semiconductor packaging market looks promising with opportunities in the automotive, aerospace and defence, medical device, and consumer electronics markets.

Q5. Who are the key advanced semiconductor packaging market companies?

Answer: Some of the key advanced semiconductor packaging companies are as follows.

  • Advanced Semiconductor Engineering
  • Intel
  • Advanced Micro Devices
  • Amkor Technology
  • Hitachi Chemical
  • Jiangsu Changjiang Electronics Technology
  • Infineon
  • Kyocera
  • Sumitomo Chemical
  • China Wafer Level CSP

Q6. Which advanced semiconductor packaging market segment will be the largest in future?

Answer: Lucintel forecasts that fan-out wafer level package will remain the largest segment over the forecast period due to its superior electrical performance, high connector density, and small form factor.

Q7. In advanced semiconductor packaging market, which region is expected to be the largest in next 5 years?

Answer: APAC will remain the largest segment over the forecast period due to region's increasing demand for innovative packaging technologies, rapid developments and expansion of automotive, and consumer electronics industries, as well as the rise of emerging technologies like 5G, AI, and IoT.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the advanced semiconductor packaging market by type (fan-out wafer level package , 5D/3D, fan-in wafer level package , and flip chip), application (automotive, aerospace and defence, medical devices, consumer electronics, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Advanced Semiconductor Packaging Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Advanced Semiconductor Packaging Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Advanced Semiconductor Packaging Market by Type
    • 3.3.1: Fan-out Wafer Level Package
    • 3.3.2: 5D/3D
    • 3.3.3: Fan-in Wafer Level Package
    • 3.3.4: Flip Chip
  • 3.4: Global Advanced Semiconductor Packaging Market by Application
    • 3.4.1: Automotive
    • 3.4.2: Aerospace and Defence
    • 3.4.3: Medical Devices
    • 3.4.4: Consumer Electronics
    • 3.4.5: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Advanced Semiconductor Packaging Market by Region
  • 4.2: North American Advanced Semiconductor Packaging Market
    • 4.2.2: North American Advanced Semiconductor Packaging Market by Application: Automotive, Aerospace and Defence, Medical Devices, Consumer Electronics, and Others
  • 4.3: European Advanced Semiconductor Packaging Market
    • 4.3.1: European Advanced Semiconductor Packaging Market by Type: Fan-out Wafer Level Package , 5D/3D, Fan-in Wafer Level Package , and Flip Chip
    • 4.3.2: European Advanced Semiconductor Packaging Market by Application: Automotive, Aerospace and Defence, Medical Devices, Consumer Electronics, and Others
  • 4.4: APAC Advanced Semiconductor Packaging Market
    • 4.4.1: APAC Advanced Semiconductor Packaging Market by Type: Fan-out Wafer Level Package , 5D/3D, Fan-in Wafer Level Package , and Flip Chip
    • 4.4.2: APAC Advanced Semiconductor Packaging Market by Application: Automotive, Aerospace and Defence, Medical Devices, Consumer Electronics, and Others
  • 4.5: ROW Advanced Semiconductor Packaging Market
    • 4.5.1: ROW Advanced Semiconductor Packaging Market by Type: Fan-out Wafer Level Package , 5D/3D, Fan-in Wafer Level Package , and Flip Chip
    • 4.5.2: ROW Advanced Semiconductor Packaging Market by Application: Automotive, Aerospace and Defence, Medical Devices, Consumer Electronics, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Advanced Semiconductor Packaging Market by Type
    • 6.1.2: Growth Opportunities for the Global Advanced Semiconductor Packaging Market by Application
    • 6.1.3: Growth Opportunities for the Global Advanced Semiconductor Packaging Market by Region
  • 6.2: Emerging Trends in the Global Advanced Semiconductor Packaging Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Advanced Semiconductor Packaging Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Advanced Semiconductor Packaging Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Advanced Semiconductor Engineering
  • 7.2: Intel
  • 7.3: Advanced Micro Devices
  • 7.4: Amkor Technology
  • 7.5: Hitachi Chemical
  • 7.6: Jiangsu Changjiang Electronics Technology
  • 7.7: Infineon
  • 7.8: Kyocera
  • 7.9: Sumitomo Chemical
  • 7.10: China Wafer Level CSP