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市场调查报告书
商品编码
1418039

嵌入式晶片封装市场报告：2030 年趋势、预测与竞争分析

Embedded Chip Packaging Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 - page report | 商品交期: 3个工作天内

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简介目录

嵌入式晶片封装趋势与预测

预计2024年至2030年全球嵌入式晶片封装市场将以20.7%的复合年增长率成长。该市场的主要驱动力是半导体封装的持续进步，例如扇出晶圆级封装 (FOWLP)、系统级封装(SiP)、3D 封装、异构整合、穿戴式装置和智慧型手机。需求不断增长物联网、汽车电子等各领域的更薄、更小的电子设备，以及提高客户对提高电子设备的效用和性能的期望。全球嵌入式晶片封装市场的未来充满希望，小型封装和系统内建市场蕴藏着机会。

嵌入式晶片封装细分领域

该研究包括按类型、应用和地区分類的全球嵌入式晶片封装的预测。

按类型分類的嵌入式晶片封装市场（2018-2030 年出货分析（按金额））

  • 单晶片
  • 多晶片
  • MEMS
  • 被动元件
  • 其他的

嵌入式晶片封装市场：依应用划分（2018年至2030年出货金额）

  • 小包装
  • 系统内侧
  • 其他的

嵌入式晶片封装市场：依地区划分（2018-2030年出货收益分析）

  • 北美洲
  • 欧洲
  • 亚太地区
  • 世界其他地区

嵌入式晶片封装

Lucintel 预测，单晶片预计将在预测期内实现最高成长，因为与多晶片和其他复杂配置相比，它提供了更简单、更经济的封装解决方案。

亚太地区是一个不断成长的市场，苹果、三星和华为等主要电子製造商在该地区（尤其是中国）拥有大型生产基地，对整合晶片等尖端封装选项有强烈需求。见证预测期内的最高成长。

常问问题

Q1.市场成长预测如何？

A1. 2024年至2030年，全球嵌入式晶片封装市场预计将以20.7%的复合年增长率成长。

Q2.影响市场成长的主要驱动因素有哪些？

A2. 此市场的主要驱动力是半导体封装的持续进步，例如扇出晶圆级封装 (FOWLP)、系统级封装(SiP)、3D 封装、异构整合、穿戴式装置对更薄、更小的电子产品的需求不断增加智慧型手机、物联网和汽车电子等各个领域的设备，以及客户对提高电子设备的效用和效能的期望越来越高。

Q3.市场的主要细分市场有哪些？

A3. 全球嵌入式晶片封装市场前景广阔，小型封装与系统内建市场蕴藏机会。

Q4.市场上主要企业有哪些？

A4.主要嵌入式晶片封装公司如下。

  • ASE
  • ATS
  • GE
  • Shinko
  • Taiyo Yuden
  • TDK
  • Wurth Elektronik
  • Texas Instruments
  • Siemens
  • Infineon

Q5.未来最大的细分市场是什么？

A5.Lucintel 预计单晶片在预测期内将实现最高成长，因为与多晶片和其他复杂配置相比，封装提供了更简单、更经济的解决方案。

Q6. 未来五年预计哪个地区将成为最大的市场？

预计 A6.APAC 在预测期内将出现最高成长。这是因为苹果、三星和华为等主要电子製造商在该地区（尤其是中国）拥有大型生产基地，并且对整合晶片等尖端封装选项有强烈需求。

Q7. 可以客製化报告吗？

A7. 是的，Lucintel 提供 10% 的客製化服务，无需额外付费。

目录

第一章执行摘要

第二章全球嵌入式晶片封装市场：市场动态

  • 简介、背景、分类
  • 供应链
  • 产业驱动因素与挑战

第三章 2018-2030年市场趋势及预测分析

  • 宏观经济趋势（2018-2023）与预测（2024-2030）
  • 全球嵌入式晶片封装市场趋势（2018-2023）与预测（2024-2030）
  • 全球嵌入式晶片封装市场（按类型）
    • 单晶片
    • 多晶片
    • MEMS
    • 被动元件
    • 其他的
  • 全球嵌入式晶片封装市场（按应用）
    • 小包装
    • 系统内侧
    • 其他的

第四章 2018-2030年区域市场趋势及预测分析

  • 全球嵌入式晶片封装市场区域分布
  • 北美嵌入式晶片封装市场
  • 欧洲嵌入式晶片封装市场
  • 亚太嵌入式晶片封装市场
  • 其他地区嵌入式晶片封装市场

第五章 竞争分析

  • 产品系列分析
  • 营运整合
  • 波特五力分析

第六章 成长机会与策略分析

  • 成长机会分析
    • 全球嵌入式晶片封装市场成长机会（按类型）
    • 全球嵌入式晶片封装市场成长机会（按应用）
    • 全球嵌入式晶片封装市场按地区成长机会
  • 全球嵌入式晶片封装市场的新兴趋势
  • 战略分析
    • 新产品开发
    • 扩大全球嵌入式晶片封装市场产能
    • 全球嵌入式晶片封装市场的併购与合资
    • 认证和许可

第七章主要企业概况

  • ASE
  • ATS
  • GE
  • Shinko
  • Taiyo Yuden
  • TDK
  • Wurth Elektronik
  • Texas Instruments
  • Siemens
  • Infineon
简介目录

Embedded Chip Packaging Trends and Forecast

The future of the global embedded chip packaging market looks promising with opportunities in the tiny package and system-in-boards markets. The global embedded chip packaging market is expected to grow with a CAGR of 20.7% from 2024 to 2030. The major drivers for this market are continuous advancements in semiconductor packaging, include fan-out wafer-level packaging (FOWLP), system-in-package (SiP), 3D packaging, and heterogeneous integration, growing demand for thinner and smaller electronics across a variety of sectors, including wearables, smartphones, Internet of Things, and automotive electronics, as well as, increasing expectations from customers for improved usefulness and performance in electronic devices.

A more than 150-page report is developed to help in your business decisions.

Embedded Chip Packaging by Segment

The study includes a forecast for the global embedded chip packaging by type, application, and region.

Embedded Chip Packaging Market by Type [Shipment Analysis by Value from 2018 to 2030]:

  • Single Chip
  • Multichip
  • MEMS
  • Passive Components
  • Others

Embedded Chip Packaging Market by Application [Shipment Analysis by Value from 2018 to 2030]:

  • Tiny Package
  • System-In-Boards
  • Others

Embedded Chip Packaging Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Embedded Chip Packaging Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies embedded chip packaging companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the embedded chip packaging companies profiled in this report include-

  • ASE
  • ATS
  • GE
  • Shinko
  • Taiyo Yuden
  • TDK
  • Wurth Elektronik
  • Texas Instruments
  • Siemens
  • Infineon

Embedded Chip Packaging

Lucintel forecasts that single chip is expected to witness highest growth over the forecast period because the packages offer a simpler and more economical solution compared to multi-chip or other complex configurations.

APAC is expected to witness highest growth over the forecast period because the major manufacturers of electronics, like Apple, Samsung, and Huawei, have substantial production bases in the region, especially in China, owing to strong need for cutting-edge packaging options like integrated chips.

Features of the Global Embedded Chip Packaging Market

Market Size Estimates: Embedded chip packaging market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Embedded chip packaging market size by type, application, and region in terms of value ($B).

Regional Analysis: Embedded chip packaging market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different type, application, and regions for the embedded chip packaging market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the embedded chip packaging market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the growth forecast for embedded chip packaging market?

Answer: The global embedded chip packaging market is expected to grow with a CAGR of 20.7% from 2024 to 2030.

Q2. What are the major drivers influencing the growth of the embedded chip packaging market?

Answer: The major drivers for this market are continuous advancements in semiconductor packaging, include fan-out wafer-level packaging (FOWLP), system-in-package (SiP), 3D packaging, and heterogeneous integration, growing demand for thinner and smaller electronics across a variety of sectors, including wearables, smartphones, Internet of Things, and automotive electronics, as well as, increasing expectations from customers for improved usefulness and performance in electronic devices.

Q3. What are the major segments for embedded chip packaging market?

Answer: The future of the global embedded chip packaging market looks promising with opportunities in the tiny package and system-in-boards markets.

Q4. Who are the key embedded chip packaging market companies?

Answer: Some of the key embedded chip packaging companies are as follows.

  • ASE
  • ATS
  • GE
  • Shinko
  • Taiyo Yuden
  • TDK
  • Wurth Elektronik
  • Texas Instruments
  • Siemens
  • Infineon

Q5. Which embedded chip packaging market segment will be the largest in future?

Answer: Lucintel forecasts that single chip is expected to witness highest growth over the forecast period because the packages offer a simpler and more economical solution compared to multi-chip or other complex configurations.

Q6. In embedded chip packaging market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period because the major manufacturers of electronics, like Apple, Samsung, and Huawei, have substantial production bases in the region, especially in China, owing to strong need for cutting-edge packaging options like integrated chips.

Q7. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the embedded chip packaging market by type (single chip, multichip, mems, passive components, and others), application (tiny package, system-in-boards, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Embedded Chip Packaging Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Embedded Chip Packaging Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Embedded Chip Packaging Market by Type
    • 3.3.1: Single Chip
    • 3.3.2: Multichip
    • 3.3.3: MEMS
    • 3.3.4: Passive Components
    • 3.3.5: Others
  • 3.4: Global Embedded Chip Packaging Market by Application
    • 3.4.1: Tiny Package
    • 3.4.2: System-In-Boards
    • 3.4.3: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Embedded Chip Packaging Market by Region
  • 4.2: North American Embedded Chip Packaging Market
    • 4.2.2: North American Embedded Chip Packaging Market by Application: Tiny Package, System-In-Boards, and Others
  • 4.3: European Embedded Chip Packaging Market
    • 4.3.1: European Embedded Chip Packaging Market by Type: Single Chip, Multichip, MEMS, Passive Components, and Others
    • 4.3.2: European Embedded Chip Packaging Market by Application: Tiny Package, System-In-Boards, and Others
  • 4.4: APAC Embedded Chip Packaging Market
    • 4.4.1: APAC Embedded Chip Packaging Market by Type: Single Chip, Multichip, MEMS, Passive Components, and Others
    • 4.4.2: APAC Embedded Chip Packaging Market by Application: Tiny Package, System-In-Boards, and Others
  • 4.5: ROW Embedded Chip Packaging Market
    • 4.5.1: ROW Embedded Chip Packaging Market by Type: Single Chip, Multichip, MEMS, Passive Components, and Others
    • 4.5.2: ROW Embedded Chip Packaging Market by Application: Tiny Package, System-In-Boards, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Embedded Chip Packaging Market by Type
    • 6.1.2: Growth Opportunities for the Global Embedded Chip Packaging Market by Application
    • 6.1.3: Growth Opportunities for the Global Embedded Chip Packaging Market by Region
  • 6.2: Emerging Trends in the Global Embedded Chip Packaging Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Embedded Chip Packaging Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Embedded Chip Packaging Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: ASE
  • 7.2: ATS
  • 7.3: GE
  • 7.4: Shinko
  • 7.5: Taiyo Yuden
  • 7.6: TDK
  • 7.7: Wurth Elektronik
  • 7.8: Texas Instruments
  • 7.9: Siemens
  • 7.10: Infineon