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面板级封装报告：2030 年趋势、预测与竞争分析
市场调查报告书
商品编码
1416544

面板级封装报告：2030 年趋势、预测与竞争分析

Panel Level Packaging Report: Trends, Forecast and Competitive Analysis to 2030
出版日期: | 出版商: Lucintel | 英文 150 - page report | 商品交期: 3个工作天内

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简介目录

面板级封装趋势和预测

到2030年，全球面板级封装市场预计将达到44亿美元，2024年至2030年的复合年增长率为25.4%。该市场的主要驱动因素是对降低封装製程成本的需求不断增长以及对紧凑性和高功能性的需求不断增长。电子设备的普及和研发活动投资的增加。全球面板级封装市场的未来前景广阔，消费性电器产品、IT 和通讯、工业、航太和国防、汽车和医疗保健市场充满机会。

面板级封装市场洞察

Lucintel 预计该服务在预测期内将实现更高的成长。

由于智慧型设备和穿戴式装置的日益普及，以及智慧家庭等应用中消费者物联网电器产品的成长趋势，消费性电子产品将继续成为该市场的最大细分市场。

由于领先的半导体製造商的存在、消费性电器产品的需求不断增长以及该地区先进技术的采用不断增加，亚太地区在整个预测期内仍将是最大的地区。

常问问题

Q.1 面板级封装的市场规模有多大？

A1. 到2030年，全球面板级封装市场预计将达到44亿美元。

Q.2 面板级封装市场的成长预测为何：

A2. 2024年至2030年，全球面板级封装市场预计将以25.4%的复合年增长率成长。

Q.3 影响面板级封装市场成长的关键因素有哪些：

A3. 此市场的主要驱动因素是对降低封装製程成本的需求不断增加、对小型和高性能电子设备的需求不断增加以及对研发活动的投资不断增加。

Q4.市场的主要细分市场是：

A4. 全球面板级封装市场前景广阔，消费性电器产品、IT 和通讯、工业、航太和国防、汽车和医疗保健市场充满机会。

Q5.市场的主要企业是：

A5. 一些主要的面板级封装公司是：

  • Samsung Electronics
  • Intel Corporation
  • Nepes Corporation
  • ASE Group
  • Powertech Technology
  • Fraunhofer Institute for Reliability and Micro integration IZM
  • Unimicron Technology Corporation
  • DECA Technologies
  • JCET/STATSChipPAC

Q6.未来最大的细分市场是什么？

A6.Lucintel 预计服务在预测期内将经历更高的成长。

Q7. 未来五年预计哪些地区的市场成长最大？

A7.由于领先的半导体製造商的存在、消费性电器产品的需求不断增长以及该地区先进技术的采用不断增加，亚太地区在整个预测期内仍将是最大的地区。

Q8. 可以客製化报告吗？

A8. 是的，Lucintel 提供 10% 的客製化服务，无需额外付费。

目录

第一章执行摘要

第二章全球面板级封装市场：市场动态

  • 简介、背景、分类
  • 供应链
  • 产业驱动因素与挑战

第三章 2018-2030年市场趋势及预测分析

  • 宏观经济趋势（2018-2023）与预测（2024-2030）
  • 全球面板级封装市场趋势（2018-2023）与预测（2024-2030）
  • 全球面板级封装市场（按组件）
    • 软体
    • 服务
  • 全球面板级封装市场，依发展划分
    • 公共
    • 私人的
    • 混合
  • 按公司规模分類的全球面板级封装市场
    • 中小企业
    • 大公司
  • 全球面板级封装市场（依最终用途）
    • 家用电器
    • 资讯科技/通讯
    • 工业的
    • 航太和国防
    • 车
    • 卫生保健
    • 其他的

第四章 2018-2030年区域市场趋势及预测分析

  • 全球面板级封装市场（按地区）
  • 北美面板级封装市场
  • 欧洲面板级封装市场
  • 亚太面板级封装市场
  • 其他地区面板级封装市场

第五章 竞争分析

  • 产品系列分析
  • 营运整合
  • 波特五力分析

第六章 成长机会与策略分析

  • 成长机会分析
    • 全球面板级封装市场成长机会（按组件）
    • 全球面板级封装市场的部署成长机会
    • 按公司规模分類的全球面板级封装市场成长机会
    • 全球面板级封装市场成长机会（依最终用途）
    • 全球面板级封装市场区域成长机会
  • 全球面板级封装市场的新兴趋势
  • 战略分析
    • 新产品开发
    • 扩大全球面板级封装市场产能
    • 全球面板级封装市场的合併、收购与合资企业
    • 认证和许可

第七章主要企业概况

  • Samsung Electronics
  • Intel Corporation
  • Nepes Corporation
  • ASE Group
  • Powertech Technology
  • Fraunhofer Institute for Reliability and Micro integration IZM
  • Unimicron Technology Corporation
  • DECA Technologies
  • JCET/STATSChipPAC
简介目录

Panel Level Packaging Trends and Forecast

The future of the global panel level packaging market looks promising with opportunities in the consumer electronic, IT & telecommunication, industrial, aerospace & defense, automotive, and healthcare markets. The global panel level packaging market is expected to reach an estimated $4.4 billion by 2030 with a CAGR of 25.4% from 2024 to 2030. The major drivers for this market are rising need for reduced cost of packaging process, increasing demand for compact and high functionality electronic devices, and growing investment in research & development activities.

A more than 150-page report is developed to help in your business decisions.

Panel Level Packaging by Segment

The study includes a forecast for the global panel level packaging by component, deployment, enterprise size, end use, and region

Panel Level Packaging Market by Component [Shipment Analysis by Value from 2018 to 2030]:

  • Software
  • services

Panel Level Packaging Market by Deployment [Shipment Analysis by Value from 2018 to 2030]:

  • Public
  • Private
  • Hybrid

Panel Level Packaging Market by Enterprise Size [Shipment Analysis by Value from 2018 to 2030]:

  • Small & Medium Enterprise
  • Large Enterprise

Panel Level Packaging Market by End Use [Shipment Analysis by Value from 2018 to 2030]:

  • Consumer Electronics
  • IT and Telecommunication
  • Industrial
  • Aerospace and Defense
  • Automotive
  • Healthcare
  • Others

Panel Level Packaging Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Panel Level Packaging Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies panel level packaging companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the panel level packaging companies profiled in this report include-

  • Samsung Electronics
  • Intel Corporation
  • Nepes Corporation
  • ASE Group
  • Powertech Technology
  • Fraunhofer Institute for Reliability and Micro integration IZM
  • Unimicron Technology Corporation
  • DECA Technologies
  • JCET/ STATSChipPAC

Panel Level Packaging Market Insights

Lucintel forecasts that services is expected to witness higher growth over the forecast period.

Within this market, consumer electronics will remain the largest segment due to rising adoption of smart devices and wearables and increasing inclination towards consumer IOT devices in applications like smart homes.

APAC will remain the largest region over the forecast period due to the presence of major semiconductor manufacturers, rising consumer electronics demand, and growing adoption of advanced technologies in the region.

Features of the Global Panel Level Packaging Market

Market Size Estimates: Panel level packaging market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Panel level packaging market size by various segments, such as by component, deployment, enterprise size, end use, and region in terms of value ($B).

Regional Analysis: Panel level packaging market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different components, deployments, enterprise sizes, end uses, and regions for the panel level packaging market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the panel level packaging market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q.1 What is the panel level packaging market size?

Answer: The global panel level packaging market is expected to reach an estimated $4.4 billion by 2030.

Q.2 What is the growth forecast for panel level packaging market?

Answer: The global panel level packaging market is expected to grow with a CAGR of 25.4% from 2024 to 2030.

Q.3 What are the major drivers influencing the growth of the panel level packaging market?

Answer: The major drivers for this market are rising need for reduced cost of packaging process, increasing demand for compact and high functionality electronic devices, and growing investment in research & development activities.

Q4. What are the major segments for panel level packaging market?

Answer: The future of the global panel level packaging market looks promising with opportunities in the consumer electronic, IT & telecommunication, industrial, aerospace & defense, automotive, and healthcare markets

Q5. Who are the key panel level packaging market companies?

Answer: Some of the key panel level packaging companies are as follows:

  • Samsung Electronics
  • Intel Corporation
  • Nepes Corporation
  • ASE Group
  • Powertech Technology
  • Fraunhofer Institute for Reliability and Micro integration IZM
  • Unimicron Technology Corporation
  • DECA Technologies
  • JCET/ STATSChipPAC

Q6. Which panel level packaging market segment will be the largest in future?

Answer: Lucintel forecasts that services is expected to witness higher growth over the forecast period.

Q7. In panel level packaging market, which region is expected to be the largest in next 5 years?

Answer: APAC will remain the largest region over the forecast period due to the presence of major semiconductor manufacturers, rising consumer electronics demand, and growing adoption of advanced technologies in the region.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the panel level packaging market by component (software and services), deployment (public, private, and hybrid), enterprise size (small & medium enterprise, and large enterprise), end use (consumer electronics, IT & telecommunication, industrial, aerospace & defense, automotive, healthcare, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Panel Level Packaging Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Panel Level Packaging Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Panel Level Packaging Market by Component
    • 3.3.1: Software
    • 3.3.2: Services
  • 3.4: Global Panel Level Packaging Market by Deployment
    • 3.4.1: Public
    • 3.4.2: Private
    • 3.4.3: Hybrid
  • 3.5: Global Panel Level Packaging Market by Enterprise Size
    • 3.5.1: Small & Medium Enterprise
    • 3.5.2: Large Enterprise
  • 3.6: Global Panel Level Packaging Market by End Use
    • 3.6.1: Consumer Electronics
    • 3.6.2: IT and Telecommunication
    • 3.6.3: Industrial
    • 3.6.4: Aerospace and Defense
    • 3.6.5: Automotive
    • 3.6.6: Healthcare
    • 3.6.7: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Panel Level Packaging Market by Region
  • 4.2: North American Panel Level Packaging Market
    • 4.2.1: North American Panel Level Packaging Market by Component: Software and Services
    • 4.2.2: North American Panel Level Packaging Market by End Use: Consumer Electronics, IT and Telecommunication, Industrial, Aerospace and Defense, Automotive, Healthcare, and Others
  • 4.3: European Panel Level Packaging Market
    • 4.3.1: European Panel Level Packaging Market by Component: Software and Services
    • 4.3.2: European Panel Level Packaging Market by End Use: Consumer Electronics, IT and Telecommunication, Industrial, Aerospace and Defense, Automotive, Healthcare, and Others
  • 4.4: APAC Panel Level Packaging Market
    • 4.4.1: APAC Panel Level Packaging Market by Component: Software and Services
    • 4.4.2: APAC Panel Level Packaging Market by End Use: Consumer Electronics, IT and Telecommunication, Industrial, Aerospace and Defense, Automotive, Healthcare, and Others
  • 4.5: ROW Panel Level Packaging Market
    • 4.5.1: ROW Panel Level Packaging Market by Component: Software and Services
    • 4.5.2: ROW Panel Level Packaging Market by End Use: Consumer Electronics, IT and Telecommunication, Industrial, Aerospace and Defense, Automotive, Healthcare, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Panel Level Packaging Market by Component
    • 6.1.2: Growth Opportunities for the Global Panel Level Packaging Market by Deployment
    • 6.1.3: Growth Opportunities for the Global Panel Level Packaging Market by Enterprise Size
    • 6.1.4: Growth Opportunities for the Global Panel Level Packaging Market by End Use
    • 6.1.5: Growth Opportunities for the Global Panel Level Packaging Market Region
  • 6.2: Emerging Trends in the Global Panel Level Packaging Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Panel Level Packaging Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Panel Level Packaging Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Samsung Electronics
  • 7.2: Intel Corporation
  • 7.3: Nepes Corporation
  • 7.4: ASE Group
  • 7.5: Powertech Technology
  • 7.6: Fraunhofer Institute for Reliability and Micro integration IZM
  • 7.7: Unimicron Technology Corporation
  • 7.8: DECA Technologies
  • 7.9: JCET/ STATSChipPAC