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市场调查报告书
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全球 MEMS 封装市场 - COVID-19 的增长、趋势、影响和预测（2022-2027 年）

Global MEMS Packaging Market - Growth, Trends, and Forecasts (2022 - 2027)
出版日期: | 出版商: Mordor Intelligence | 英文 120 Pages | 商品交期: 2-3个工作天内

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简介目录

全球 MEMS 封装市场预计在预测期内（2022-2027 年）将以 17.8% 的复合年增长率增长。

由于全球对智能汽车解决方案的需求不断增加，预计 MEMS 封装市场的需求将会上升。对连接设备和消费电子产品的需求不断增长，预计将推动传感器市场。此外，随着传感器的使用不断增长，全球工业传感器的使用量也在飙升，推动了对 MEMS 设备的需求。

主要亮点

  • 由于MEMS器件应用的显着扩展，MEMS封装已经从MEMS器件封装发展到MEMS系统封装。创新高效的包装技术和新型包装材料正变得越来越重要。
  • 最近，单芯片技术的发展，如低温晶圆键合与 CMOS 兼容的 MEMS 製造工艺正在推动 MEMS 封装市场的创新。另一个新兴趋势是将裸晶圆堆迭应用于低成本无铅半导体封装。这使得低成本、小引脚封装的大规模生产成为可能。
  • MEMS 的日益普及也促进了嵌入式芯片封装市场的新需求。虽然这项技术并非该市场独有，但由于成本高、良率低，已多元化进入利基应用领域，但未来发展潜力巨大。蓝牙、射频模块的进步以及 WiFi-6 的兴起将进一步加速对该技术的投资。
  • 此外，MEMS 器件的日益普及正促使 MEMS 封装供应商进一步开发创新封装技术，以提高这些器件的效率和运行性能。例如，2021 年，半导体製造巨头 T-SMART 宣布，正致力于开发一种基于热电堆传感器异构集成的新型 MEMS 封装技术。
  • 此外，根据 IEEE 的说法，由于 MEMS 器件的多样性以及需要同时暴露和保护许多器件免受环境影响，MEMS 封装比 IC 封装更具挑战性。此外，在 MEMS 封装中，还存在诸如芯片处理、芯片附着、界面张力和除气等挑战。这些新的 MEMS 封装挑战需要紧急研究和开发。
  • 随着世界各地的科技公司加速创新以对抗 COVID-19 流行病，MEMS 在芯片行业的使用出现了巨大的增长。对更小设备的需求正在推动电子产品的进步，从更快的热成像和床旁检测到基于微流体的聚合□链反应 (PCR) 工具和 SARS-CoV-2 检测技术。然而，大流行改变了製造业对全球供应链的看法，导致价值链更加区域化和区域化。

主要市场趋势

智能手机和联网设备的普及有望刺激需求

  • 全球智能手机用户数量正在迅速增加。消费者正在转向智能手机以利用它们提供的一系列功能，包括连接、支付、游戏、摄影和 GPS。智能手机用户的增加预计将对所研究市场的增长产生积极影响，因为智能手机硬件包含多个传感器来实现此类功能。
  • 根据Ericsson Mobility Report，印度智能手机用户数量预计将从 2020 年的 8.1 亿增长到 2026 年的 12 亿。农村地区正在推动支持互联网的手机的销售，随着互联网连接变得更加普遍，预计对智能手机的需求也将增加。
  • 此外，MEMS 器件正在彻底改变消费电子市场。通过结合所有智能手机和平板电脑中的 MEMS 麦克风和 CMOS 图像传感器，消费电子製造商正在将传统设备转变为可通过智能手机轻鬆远程控制的连接设备。
  • 健康意识的提高，尤其是在 COVID-19 爆发之后，正在推动使用传感器跟踪用户生物特征数据的连接可穿戴设备市场。由于 MEMS 器件在这些器件中发挥着不可或缺的作用，预计不断增长的需求将对研究市场产生积极影响。例如，根据 CISCO Systems 的数据，到 2022 年，全球可穿戴设备的总数预计将达到 11 亿台。

北美有望占据重要市场份额

  • 北美地区历来是全球电子行业的主要股东，因为其强大的研发能力、Intel、Dell等一些最大的半导体和技术公司的存在，以及在电子、物联网和先进的汽车。这是由于技术渗透率高等因素造成的。例如，该地区被认为是采用支持 ADAS 的车辆和自动交通解决方案的先驱之一。据Deutsche Bank称，到 2021 年，美国 ADAS 汽车产量预计将增长到 1845 万辆。
  • 汽车製造商越来越多地采用 MEMS 设备来为其车辆添加独特的功能。例如，基于 MEMS 的激光雷达正在取代自动/无人驾驶车辆、工业机器人、无人机等。2021 年 9 月，General Motors选择 Cepton 为 2023 年的生产提供基于 MEME 的激光雷达。General Motors预计将使用 Cepton LiDAR 来增强自动紧急制动和行人检测等 ADAS 功能，并在未来推出 Ultra Cruise 系统。
  • 此外，每家公司都专注于最新传感器的创新，并被评为创新产品。例如，2022 年 4 月，北美和世界各地的半导体封装和测试服务提供商 UNICEM 在 MEMS 和 SENSORS 技术大会 (MSTC) 上展示了 MEMS 腔体封装，赢得了封装工艺摊牌。
  • 在全球芯片短缺的情况下，北美半导体产业近年来被迫增加政府对半导体及相关产业的投资。例如，通过在 2022 年初投资 2.4 亿美元，加拿大政府致力于与当地研究人员和公司合作，进一步加强加拿大在工业领域的地位。预计此类案例将为所研究市场的增长创造有利的市场情景。
  • 此外，智能手机和消费电子产品是推动 MEMS 设备需求的关键行业之一，对该地区对封装服务的需求产生了积极影响。例如，根据消费者技术协会（CTA）的数据，预计 2021 年美国 5G 智能手机出货量将达到 1.06 亿部。

竞争格局

MEMS封装市场竞争温和。作为一个资本密集型行业，市场上的主要供应商正在利用其多样化的产品组合和产品开发来确保优势。供应商的创新能力高度依赖于其在研发方面的投资。此外，作为资本密集型行业也是新进入者的障碍。在市场上运营的主要公司包括 ChipMos Technologies Inc.、AAC Technologies、Bosch Sensortec GmbH、Infineon Technologies AG 和 Analog Devices, Inc.。

  • 2022年8月——MEMS技术解决方案的领先公司美新发布首款MEMS 6轴惯性传感器（IMU）MIC6100HG。该产品集成了3轴加速度计和3轴陀螺仪，可支持高灵敏度的智能遥控器、游戏控制器等运动感应和交互系统。此外，MIC6100HG 6轴IMU传感器具有超大FIFO容量，支持I2C/I3C/SPI通信模式。LGA封装尺寸为2.5x3x0.83mm，数据输出频率为2200Hz。
  • 2022 年 2 月——意法半导体推出第三代 MEMS 传感器。据该公司称，新传感器旨在实现智能行业、消费移动、医疗保健和零售领域的性能和功能的下一次飞跃。新推出的 LPS22DF 和防水 LPS28DFW 气压传感器的工作电流为 1.7μA，在最小的占地面积 (2.0 x 2.0 x 0.74mm) 内具有 0.5hPa 的绝对压力精度。

其他福利

  • Excel 格式的市场预测 (ME) 表
  • 3 个月的分析师支持

目录

第 1 章 简介

  • 研究假设和市场定义
  • 调查范围

第二章研究方法论

第三章执行摘要

第四章市场洞察

  • 市场概况
  • 产业吸引力——波特五力分析
    • 供应商的议价能力
    • 买方议价能力
    • 新进入者的威胁
    • 替代品的威胁
    • 竞争对手之间的竞争
  • 技术快照
  • 评估 COVID-19 对市场的影响

第五章市场动态

  • 市场驱动力
    • 智能汽车市场的增长
    • 智能手机普及率和连接设备的增加
    • 传感器在工业中的应用
  • 市场製约因素
    • 复杂的製造过程

第六章市场细分

  • 按传感器类型
    • 惯性传感器
    • 光学传感器
    • 环境传感器
    • 超声波传感器
    • 射频微机电系统
    • 其他
  • 按最终用户
    • 汽车
    • 手机
    • 消费类电子产品
    • 医疗器材
    • 工业设备
    • 其他
  • 区域信息
    • 北美
    • 欧洲
    • 亚太地区
    • 世界其他地区

第 7 章 竞争格局

  • 公司简介
    • ChipMos Technologies Inc.
    • AAC Technologies Holdings Inc.
    • Bosch Sensortec GmbH
    • Infineon Technologies AG
    • Analog Devices, Inc.
    • Texas Instruments Incorporated.
    • Taiwan Semiconductor Manufacturing Company Limited
    • MEMSCAP S.A.
    • Orbotech Ltd.
    • TDK Corporation
    • MEMSIC Semiconductor Co., Ltd
    • STMicroelectronics

第八章投资分析

第九章市场展望

简介目录
Product Code: 66887

The global MEMS packaging market is projected to grow at a CAGR of 17.8% during the forecast period (2022- 2027). Owing to the increase in global demand for smart automotive solutions, the need for the MEMS packaging market is expected to go up. The increasing demand for connected devices and consumer electronics is expected to drive the market for sensors. Additionally, the global industrial sensor usage is soaring due to the ever-increasing applications of sensors, driving the demand for MEMs devices.

Key Highlights

  • MEMS packaging has evolved from packaging MEMS devices to packaging MEMS systems as the application of MEMS devices has expanded significantly. Innovative and efficient packaging technology is becoming increasingly important, as are new packaging materials.
  • The recent technological development of CMOS-compatible MEMS manufacturing processes for low-temperature wafer bonding and other single-chip integration are among the driving innovations in the MEMS packaging market. Another emerging trend is the application of bare wafer stacks for low-cost lead-free semiconductor packages. This enables a low-cost, small-pin package for high-volume production.
  • The increasing adoption of MEMS is also contributing to new demand in the embedded die packaging market. The technology is not unique to the market, but its high cost and low yields have diversified it into niche applications, but the potential for future development is immense. Advancements in Bluetooth and RF modules and the rise of WiFi-6 will likely accelerate investment in this technology further.
  • The growing adoption of MEMS devices is also encouraging the MEMS packaging vendors to develop innovative packaging techniques further to enhance these devices' efficiency and operational performances. For instance, in 2021, T-SMART, a leading semiconductor manufacturing company, announced that it is working towards a new MEMS packaging technology based on Heterogeneous Integration for the thermopile sensor.
  • Furthermore, according to IEEE, MEMS packaging is more challenging than IC packaging due to the diversity of MEMS devices and the need for many devices to be in contact with and protected from the environment simultaneously. In addition, there are also challenges within MEMS packaging, such as die handling, die attachment, interfacial tension, and outgassing. These new MEMS packaging challenges require urgent R&D efforts.
  • The usage of MEMS in the chip industry has witnessed immense growth as technology companies around the world accelerated innovation in the fight against the COVID-19 pandemic. The need for tiny devices drives advances in electronics, ranging from thermal imaging and faster point-of-care testing to microfluidics-based polymerase chain reaction (PCR) tools and techniques to detect SARS-CoV-2. However, the pandemic has changed the perception of the global supply chain in manufacturing, where more localized value chains and regionalization have come into the picture.

Key Market Trends

Growing Adoption of Smartphones and Connected Devices is Expected to Drive the Demand

  • The number of smartphone users is rising enormously worldwide. Consumers are switching to smartphones to access various functionality they offer, including connectivity, payment, gaming, photography, and GPS. As multiple sensors are integrated into the smartphone's hardware to enable such functionality, the growing number of smartphone users is expected to positively impact the studied market growth.
  • According to Ericsson Mobility Report, smartphone subscription in India is expected to grow from 810 million in 2020 to 1.2 billion in 2026. With rural areas driving the sale of internet-enabled phones, demand for smartphones is expected to increase as Internet connectivity spreads further.
  • Moreover, MEMS devices are also revolutionizing the consumer electronics market. Combining the MEMS microphones and CMOS image sensors found in all smartphones and tablets, the consumer electronic device manufacturing companies are turning the traditional devices into connected ones that can easily be remotely controlled through smartphones.
  • The increasing health consciousness, especially after the outbreak of COVID-19, drives the market for connected wearable devices that use sensors to track users' biological data. As MEMS devices play an integral role in these devices, the increasing demand is expected to impact the studied market positively. For instance, according to CISCO Systems, the total number of wearable devices is expected to reach 1.1 billion globally by 2022.

North America to Hold Significant Market Share

  • The North American region traditionally has been a major shareholder of the global electronics industry owing to factors such as higher R&D capabilities, the presence of some of the biggest semiconductor and tech companies such as Intel, Dell, etc., along with higher penetration of electronic devices, IoT, and advanced automotive technologies. For instance, the region is considered one of the pioneers in adopting ADAS-enabled vehicles and autonomous transportation solutions. According to Deutsche Bank, ADAS vehicle production in the US is expected to grow to 18.45 million by 2021.
  • Automotive companies are increasingly adopting MEMS devices to add unique functionality to their vehicles. For instance, MEMS-based LiDARs were an alternative to autonomous/driverless cars, industrial robots, UAVs, etc.; in September 2021, General Motors selected Cepton for the supply of MEME-based LiDAR for 2023 production. General Motor is expected to use the Cepton LiDAR to enhance ADAS capabilities for automatic emergency braking and pedestrian detection and to enable its upcoming Ultra Cruise system.​
  • Companies are also focused on innovating the latest sensors and are receiving recognition for their innovative products. For instance, in April 2022, Unisem, a North American and global semiconductor assembly and test services provider, won the Packaging Process Showdown at MEMS and SENSORS Technical Congress (MSTC) for its presentation, MEMS Cavity Packages.
  • The recent push to the local semiconductor industry amid the global chip shortage has forced the governments in the North American region to increase their investment in the semiconductor and related industries. For instance, through a USD 240 million investment in early 2022, the government Canadian government has committed to work with local researchers and companies to strengthen Canada's position in the industryfurther. Such instances are expected to create a favorable market scenario for the growth of the studied market.
  • Furthermore, the smartphone and consumer electronics also are among the leading industries driving the demand for MEMS devices which n turn is positively impacting the demand for packaging services in the region. For instance, according to the Consumer Technology Association (CTA), the 5G smartphone shipments in the United States was expected to reach 106 million in 2021.

Competitive Landscape

The MEMS packaging market is moderately competitive. As the industry is capital intensive, major vendors in the market are banking on diverse product portfolios and product development to gain an edge. The innovation capabilities of the vendors are highly dependent on their R&D investments. Additionally, the industry's capital-intensive nature poses an entry barrier to new entrants. Some key players operating in the market are ChipMos Technologies Inc., AAC Technologies, Bosch Sensortec GmbH, Infineon Technologies AG, and Analog Devices, Inc., among others.

  • August 2022 - MEMSIC, a leading MEMS technology solution provider, releases the first MEMS 6-axis inertial sensor (IMU) MIC6100HG. The product integrates a 3-axis accelerometer and a 3-axis gyroscope, which can support motion-sensing interactive systems such as smart remote controls and game controllers with sensitive sensing. Additionally, the MIC6100HG 6-axis IMU sensor has a large FIFO and supports I2C/I3C/SPI communication mode. The LGA package size is 2.5x3x0.83mm, and the data output frequency is 2200Hz.
  • February 2022 - STMicroelectronics introduced its third generation of MEMS sensors. According to the company, the new sensors are designed to enable the next leap in performance and features for smart industries, consumer mobiles, healthcare, and retail sectors. The newly launched LPS22DF and waterproof LPS28DFW barometric pressure sensors, which operate from 1.7µA and have absolute pressure accuracy of 0.5hPa and are packed in one of the smallest footprints (2.0 x 2.0 x 0.74mm).

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Industry Attractiveness - Porter's Five Force Analysis
    • 4.2.1 Bargaining Power of Suppliers
    • 4.2.2 Bargaining Power of Buyers
    • 4.2.3 Threat of New Entrants
    • 4.2.4 Threat of Substitute Products
    • 4.2.5 Intensity of Competitive Rivalry
  • 4.3 Technology Snapshot
  • 4.4 Assessment of the Impact of COVID-19 on the Market

5 MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Growing Smart Automotive Market
    • 5.1.2 Increasing Smart Phone Adoption Rate & Connected Devices
    • 5.1.3 Sensor Usage in Industries
  • 5.2 Market Restraints
    • 5.2.1 Complex Manufacturing Process

6 MARKET SEGMENTATION

  • 6.1 By Sensor Type
    • 6.1.1 Inertial Sensors
    • 6.1.2 Optical Sensors
    • 6.1.3 Environmental Sensors
    • 6.1.4 Ultrasonic Sensors
    • 6.1.5 RF MEMS
    • 6.1.6 Others
  • 6.2 By End User
    • 6.2.1 Automotive
    • 6.2.2 Mobile Phones
    • 6.2.3 Consumer Electronics
    • 6.2.4 Medical Systems
    • 6.2.5 Industrial
    • 6.2.6 Others
  • 6.3 By Geography
    • 6.3.1 North America
    • 6.3.2 Europe
    • 6.3.3 Asia Pacific
    • 6.3.4 Rest of the World

7 COMPETITIVE LANDSCAPE

  • 7.1 Company Profiles
    • 7.1.1 ChipMos Technologies Inc.
    • 7.1.2 AAC Technologies Holdings Inc.
    • 7.1.3 Bosch Sensortec GmbH
    • 7.1.4 Infineon Technologies AG
    • 7.1.5 Analog Devices, Inc.
    • 7.1.6 Texas Instruments Incorporated.
    • 7.1.7 Taiwan Semiconductor Manufacturing Company Limited
    • 7.1.8 MEMSCAP S.A.
    • 7.1.9 Orbotech Ltd.
    • 7.1.10 TDK Corporation
    • 7.1.11 MEMSIC Semiconductor Co., Ltd
    • 7.1.12 STMicroelectronics

8 INVESTMENT ANALYSIS

9 FUTURE OUTLOOK OF THE MARKET