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市场调查报告书
商品编码
1407943

高端半导体封装：市场占有率分析、产业趋势与统计、2024年至2029年成长预测

High-end Semiconductor Packaging - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts 2024 - 2029
出版日期: | 出版商: Mordor Intelligence | 英文 100 Pages | 商品交期: 2-3个工作天内

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简介目录

高阶半导体封装市场规模预计到2024年为369.5亿美元，预计到2029年将达到859.1亿美元，在预测期内（2024-2029年）复合年增长率为15.10%。

高阶半导体封装-市场-IMG1

封装越来越多地用于提高电子系统的性能、可靠性和成本效益，并且在行业内各个终端用户垂直领域的需求量很大，从而导致整合度、能源效率和产品性能的不断发展正在加速市场成长。例如，2022年3月，英特尔链在欧盟半导体价值链上投资了800亿欧元，其中包括尖端封装技术。

主要亮点

  • 包装可保护电子系统免受高频噪音辐射、静电放电、机械损坏和冷却的影响。全球半导体产业的成长是推动半导体封装市场成长的关键因素之一。此外，2023年2月，半导体产业协会（SIA）宣布，2022年全球半导体产业销售额将达到5,741亿美元，创历史最高年度总合，较上年公布的5,559亿美元成长3.3%。
  • 此外，物联网、人工智慧的兴起以及复杂电子设备的普及正在推动消费性电子和汽车产业的高端应用。由于这些因素，正在采用更先进的半导体封装技术来维持需求。
  • 此外，2022年6月，代表欧洲整个电子製造和设计供应链的组织SEMI Europe呼吁儘早通过《欧洲晶片法》，并邀请欧盟委员会、成员国和议会讨论法案。参与。该法律旨在增强欧洲在半导体技术和应用方面的竞争力和弹性，同时支持该地区向数位和绿色经济转型。
  • 该领域研究活动的活性化进一步刺激了市场需求。例如，德累斯顿已发展成为着名的半导体研究中心。 2022 年 6 月，Fraunhofer IPMS 和 IZM-ASSID 宣布合作建立萨克森高级 CMOS 和异质整合中心。该中心将提供整个300毫米微电子价值链，并需要高科技研究来实现未来的创新。
  • Fraunhofer IPMS在无尘室设备上投资超过1.4亿欧元，在CMOS製造前端的现代300毫米晶圆行业标准的应用研究方面在德国拥有强大的地位。 Fraunhofer IZM-ASSID 提供的创新封装和系统整合技术补充了这项知识。
  • 此外，由于 5G、物联网、汽车和 HPC 等多个长期成长驱动因素，半导体封装市场预计将扩大。例如，印度政府最近核准了一项100亿美元的奖励计划，以建立一个完整的半导体生态系统，包括晶圆厂、本土晶片设计和化合物半导体工厂。
  • 此外，俄罗斯和乌克兰之间持续的衝突预计将对电子产业产生重大影响。这场衝突已经加剧了已经影响该行业的半导体供应链问题和晶片短缺问题。这种干扰可能会表现为镍、钯、铜、钛、铝和铁矿石等关键原料的价格波动，从而导致材料短缺。这可能会成为所研究市场的製造障碍。

高端半导体封装市场趋势

消费性电子产业可望提振市场

  • 消费性电子部门正在半导体封装市场进行大量投资。智慧型手机的成长、穿戴式装置和智慧型装置的普及不断提高，以及消费者物联网装置在智慧家庭等应用中的普及不断提高，是影响该细分市场成长的一些因素。爱立信预计，2022年全球智慧型手机行动网路用户数量预计将达到约66亿，2028年将超过78亿人。
  • 此外，由于复杂的半导体元件可以提供越来越多的功能和特性，智慧型手錶和智慧扬声器市场近年来变得非常受欢迎。因此，对Wi-Fi和蓝牙晶片的需求急剧增加。消费性电子製造商也利用半导体元件为其产品配备物联网和人工智慧模型，以改善用户体验并为产品增添光彩。
  • 例如，2023年3月，华为计画在未来几年推出一款电池大幅升级的折迭式智慧型手机。据传该设备将进行电池升级并命名为「Mate X3」。此外，华为很可能会采用高硅负极材料来增强智慧型手机的电池容量，预计达到5060mAh。
  • 电脑和笔记型电脑现已成为大力投资科技的年轻消费者的必需品。此外，电子产业的创新和进步预计将在未来十年推动半导体封装销售。由于物联网和人工智慧的引入，全球新兴市场和已开发市场的半导体封装销售额预计将增加。
  • 2022年6月，英特尔公司与伦敦大学学院（UCL）联合发布了一款新型非接触式计算机，可以透过手、头、脸和全身的手势进行操作和控制。电子市场不断要求更高的功耗、更快的速度、更多的引脚数、更小的占地面积和更薄的设计。半导体的小型化和整合化正在创造更轻、更小、更便携的家用电器，例如智慧型手机、平板电脑和新兴的物联网设备。
高阶半导体封装-市场-IMG2

北美市场正在经历显着成长

  • 美国和加拿大的半导体产业在人工智慧、量子运算和 5G 等先进无线网路等未来关键技术中保持着重要地位。例如，根据GSMA的预测，2025年5G将成为美国领先的网路技术。 5G 网路的持续部署与对更即时和高效能运算设备的需求不断增长相一致，其中半导体是其中的关键要素。
  • 美国政府正在进行重大投资，以促进先进技术的普及，从而增强对高端半导体封装的需求。美国是世界上成长最快的经济体之一。根据 WSTS 数据，2022 年 10 月美洲半导体销售额为 122.9 亿美元，高于上月的 120.3 亿美元。
  • 美国参议院最近宣布了促进美国製造半导体（FABS）法案。该法案可为半导体製造设备和製造工厂的投资提供 25% 的投资税额扣抵。
  • 此外，2022年9月，拜登政府宣布将加强国内半导体产业，以对抗对中国的依赖，因为美国消耗了全球25%的最先进晶片，这些晶片对国家安全至关重要，且产量为零。将投资500亿美元发展拜登总统于 2022 年 8 月签署了 2800 亿美元的 CHIPS 法案，以促进国内高科技製造业，作为增强美国对中国竞争力的努力的一部分。该地区半导体行业如此强劲的投资可能会为研究市场的成长提供利润丰厚的机会。
  • 此外，美国是最大的电动车市场之一，近年来电动车销量激增。据 KBB 称，2022 年第二季度美国售出近 196,800 辆纯电动车。与去年同期相比成长约66.4%。
  • 近年来，美国实施了许多法规来促进电动车的普及。例如，纽约州立法机关最近通过了一项法案，实际上要求到 2035 年该州销售的所有新小客车都必须采用电力驱动。此外，美国也制定了2030年该国销售的汽车一半为电动车的目标。

高端半导体封装产业概况

高端半导体封装市场正在整合。公司正在利用产品创新、扩张和联盟来在竞争中生存并扩大市场范围。

2022年10月，台积电宣布成立开放创新平台（OIP）3D Fabric联盟。最新的台积电 3D Fabric 联盟是台积电的第六个 OIP 联盟，为半导体设计、内存模组、测试、製造、基板技术和封装提供全面的一流解决方案和服务，包括 3D IC半导体公司的同类联盟与合作伙伴合作，加速生态系统的准备与创新。

2022 年 8 月，英特尔公布了其最新的架构和封装突破，可实现基于 2.5D 和 3D 区块的晶片设计，开创了晶片製造技术和影响的新时代。英特尔的系统代工模式以封装改进为特色，该公司计划在 2030 年将封装上的电晶体数量从 1,000 亿个增加到 1 兆个。

其他福利：

  • Excel 格式的市场预测 (ME) 表
  • 3 个月的分析师支持

目录

第一章简介

  • 研究假设和市场定义
  • 调查范围

第二章调查方法

第三章执行摘要

第四章市场洞察

  • 市场概况
  • 产业吸引力－波特五力分析
    • 供应商的议价能力
    • 买方议价能力
    • 新进入者的威胁
    • 替代品的威胁
    • 竞争公司之间敌对关係的强度
  • 产业价值链分析
  • 评估宏观经济趋势对市场的影响

第五章市场动态

  • 市场驱动因素
    • 各行业半导体元件消费扩大
    • 扩大 3D 列印在半导体封装的应用
  • 市场抑制因素
    • 半导体IC设计初始投资高、复杂

第六章市场区隔

  • 依技术
    • 3D SoC
    • 3D堆迭内存
    • 2.5D中介层
    • UHD FO
    • 内置硅桥
  • 按最终用户
    • 消费性电子产品
    • 航太/国防
    • 医疗设备
    • 电讯
    • 车
    • 其他最终用户
  • 按地区
    • 北美洲
      • 美国
      • 加拿大
    • 欧洲
      • 英国
      • 德国
      • 法国
      • 义大利
      • 其他欧洲国家
    • 亚太地区
      • 中国
      • 印度
      • 日本
      • 澳洲
      • 东南亚
      • 其他亚太地区
    • 世界其他地区

第七章竞争形势

  • 公司简介
    • Intel Corporation
    • Taiwan Semiconductor Manufacturing Company
    • Advanced Semiconductor Engineering, Inc.
    • Samsung Electronics Co. Ltd
    • Amkor Technology Inc.
    • JCET Group Co., Ltd.
    • TongFu Microelectronics Co., Ltd.
    • Fujitsu Limited
    • Siliconware Precision Industries Co. Ltd
    • Powertech Technology, Inc.

第八章投资分析

第9章市场的未来

简介目录
Product Code: 91352
High-end Semiconductor Packaging - Market - IMG1

The High-end Semiconductor Packaging Market size is estimated at USD 36.95 billion in 2024, and is expected to reach USD 85.91 billion by 2029, growing at a CAGR of 15.10% during the forecast period (2024-2029).

The continuous advancements in integration, energy efficiency, and product characteristics because of the growing demand across various end-user verticals of the industry and the use of packaging for improving the performance, reliability, and cost-effectiveness of electronic systems accelerate the market's growth. For instance, in March 2022, Intel Corp. invested EUR 80 billion across the entire semiconductor value chain in the European Union, including cutting-edge packaging technologies.

Key Highlights

  • Packaging protects an electronic system from radio frequency noise emission, electrostatic discharge, mechanical damage, and cooling. The rise in the semiconductor industry worldwide is one of the major factors driving the growth of the semiconductor packaging market. In addition, in February 2023, the Semiconductor Industry Association (SIA) announced global semiconductor industry sales totaled USD 574.1 billion in 2022, the highest-ever annual total and an increase of 3.3% compared to the previous year's total of USD 555.9 billion.
  • Furthermore, the rise of IoT and AI and the proliferation of complex electronics drive the high-end application segment in the consumer electronics and automotive industries. Due to these factors, more advanced semiconductor packaging technologies are being adopted to sustain demand.
  • Further, in June 2022, SEMI Europe, the organization representing the entire European electronics manufacturing and design supply chain, immediately called for the quick passage of the European Chips Act and invited the European Commission, Member States, and Parliament to participate in discussions about the proposed legislation. The Act intends to support the region's transition to a digital and green economy while enhancing Europe's competitiveness and resilience in semiconductor technologies and applications.
  • The growing research activities in the sector further bolstered the market's demand. For instance, Dresden is developing into a renowned hub for semiconductor research. In June 2022, Fraunhofer IPMS and IZM-ASSID announced a collaboration to form the Center for Advanced CMOS & Heterointegration Saxony. The center will provide the entire 300 mm microelectronics value chain, requiring high-tech research for upcoming innovations.
  • Fraunhofer IPMS is positioned in Germany in applied research on the contemporary 300mm wafer industry standard in the front end of CMOS manufacturing, having recently invested over EUR 140 million in clean room equipment. Innovative packaging and system integration technologies from Fraunhofer IZM-ASSID supplement this knowledge.
  • Furthermore, the semiconductor packaging market is expected to expand due to multiple long-term growth drivers, like 5G, IoT, automotive, and HPC. For instance, the government of India recently approved a USD 10 billion incentive package to build a complete semiconductor ecosystem, including fabs, home-grown chip design, and compound semiconductor plants.
  • Moreover, the ongoing conflict between Russia and Ukraine is expected to impact the electronics industry significantly. The conflict has already exacerbated the semiconductor supply chain issues and the chip shortage that have affected the industry for some time. The disruption may come in the form of volatile pricing for critical raw materials such as nickel, palladium, copper, titanium, aluminum, and iron ore, resulting in material shortages. This would obstruct manufacturing in the studied market.

High-end Semiconductor Packaging Market Trends

Consumer Electronics Sector is Expected to Boost the Market

  • The consumer electronics sector is significantly investing in the semiconductor packaging market. Growth of the smartphone, rising wearable and smart device adoption, and increasing consumer IoT device penetration in applications like smart homes are a few of the influential factors influencing the segment's growth. According to Ericsson, smartphone mobile network subscriptions worldwide reached nearly 6.6 billion in 2022 and are predicted to exceed 7.8 billion by 2028.
  • Additionally, markets for smartwatches and smart speakers have become extremely popular in recent years due to the growing number of features and functionalities they can offer due to sophisticated semiconductor components. As a result, demand for Wi-Fi and Bluetooth chips increased dramatically. Consumer electronics manufacturers also use semiconductor components to equip their products with IoT and AI models, enhancing user experience and making products brighter.
  • For instance, in March 2023, Huawei planned to launch its foldable smartphone with a significant battery upgrade in the coming years. The device will feature an upgrade to its battery, and it is rumored to be named the Mate X3. Further, Huawei will likely use the high-silicon anode material to enhance the smartphone's battery capacity, which is expected to be 5060mAh.
  • Personal computers and laptops are now essential for young consumers heavily invested in technology. In addition, over the next ten years, innovation and advancement in the electronics sector are anticipated to drive semiconductor packaging sales. Sales of semiconductor packaging are expected to increase globally in both developing and developed markets due to the introduction of IoT and AI.
  • Intel Corporation and the University College London (UCL) collaborated in June 2022 to introduce a new touchless computer that can be operated and controlled by gesturing the hands, head, face, and entire body. Higher power dissipation, faster speeds, higher pin counts, smaller footprints, and lower profiles are all constant demands in the electronics market. Semiconductor miniaturization and integration have resulted in lighter, smaller, and more portable appliances such as smartphones, tablets, and emerging IoT devices.
High-end Semiconductor Packaging - Market - IMG2

North America to Experience Significant Market Growth

  • The semiconductor sector in the United States and Canada has maintained a significant position in key future technologies, such as AI, quantum computing, and sophisticated wireless networks like 5G. For instance, as per GSMA, 5G will become the lead network technology in the US by 2025. The increasing implementation of 5G networks coincides with the growing demand for more immediate high-performance computing appliances, for which semiconductors form a critical element.
  • The United States Government has significantly invested in boosting the penetration of advanced technologies, bolstering the demand for high-end semiconductor packaging. The United States is one of the world's fastest-expanding economies. According to WSTS, in October 2022, semiconductor sales in the Americas amounted to USD 12.29 billion, an increase from the USD 12.03 billion recorded for the previous month.
  • The US Senate recently announced the Facilitating American-Built Semiconductors (FABS) Act, which may provide tax incentives to semiconductor manufacturers. The bill may establish a 25% investment tax credit for semiconductor manufacturing investments in equipment or fabs.
  • Additionally, in September 2022, the Biden administration announced that it would invest USD 50 billion in building up the domestic semiconductor industry to counter dependency on China, as the US produces zero and consumes 25% of the world's leading-edge chips vital for its national security. President Joe Biden signed a USD 280 billion CHIPS bill in August 2022 to boost domestic high-tech manufacturing, part of his administration's push to increase US competitiveness over China. Such robust investments in the semiconductor sector in the region would offer lucrative opportunities for the growth of the studied Market.
  • Furthermore, the United States is one of the largest markets for electric vehicles, and the country has also recorded rapid growth in EV sales in recent years. According to KBB, in the Q2 of 2022, just under 196,800 battery electric cars were sold in the United States. This was a year-over-year boost of around 66.4% compared to the sales recorded in Q2 of the previous year.
  • Many regulations have been implemented in recent years to promote the use of electric vehicles in the country. For instance, New York state lawmakers recently passed a bill that essentially mandates that all new passenger cars sold in the state run on electric power by 2035. Moreover, the United States has set a target to ensure half of the vehicles sold in the country are electric by 2030.

High-end Semiconductor Packaging Industry Overview

The market for high-end semiconductor packaging is consolidated. Companies employ product innovation, expansions, and partnerships to stay ahead of the competition and widen their market reach. Several recent market developments include:

In October 2022, TSMC announced the Open Innovation Platform (OIP) 3D Fabric Alliance. The latest TSMC 3DFabric Alliance is TSMC's sixth OIP Alliance and the first of its variety in the semiconductor firm that joins forces with partners to accelerate 3D IC ecosystem readiness and innovation, with an entire expanse of best-in-class solutions and services for semiconductor design, memory modules, testing, manufacturing, substrate technology, and packaging.

In August 2022, Intel showcased the most recent architectural and packaging breakthroughs that enabled 2.5D and 3D tile-based chip designs, ushering in a new era in chipmaking technologies and their significance. Intel's system foundry model features improved packaging, and the company intends to increase the number of transistors on a package from 100 billion to 1 trillion by 2030.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definitions
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.2.1 Bargaining Power of Suppliers
    • 4.2.2 Bargaining Power of Buyers
    • 4.2.3 Threat of New Entrants
    • 4.2.4 Threat of Substitute Products
    • 4.2.5 Intensity of Competitive Rivalry
  • 4.3 Industry Value Chain Analysis
  • 4.4 Assessment of the Impact of Macroeconomic Trends on the Market

5 MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Growing Consumption of Semiconductor Devices Across Industries
    • 5.1.2 Growing adoption of 3D printing in semiconductor packaging
  • 5.2 Market Restraints
    • 5.2.1 High Initial Investment and Increasing Complexity of Semiconductor IC Designs

6 MARKET SEGMENTATION

  • 6.1 By Technology
    • 6.1.1 3D SoC
    • 6.1.2 3D Stacked Memory
    • 6.1.3 2.5D interposers
    • 6.1.4 UHD FO
    • 6.1.5 Embedded Si Bridge
  • 6.2 By End-users
    • 6.2.1 Consumer Electronics
    • 6.2.2 Aerospace and Defense
    • 6.2.3 Medical Devices
    • 6.2.4 Telecom and Communication
    • 6.2.5 Automotive
    • 6.2.6 Other End-users
  • 6.3 By Geography
    • 6.3.1 North America
      • 6.3.1.1 U.S.
      • 6.3.1.2 Canada
    • 6.3.2 Europe
      • 6.3.2.1 United Kingdom
      • 6.3.2.2 Germany
      • 6.3.2.3 France
      • 6.3.2.4 Italy
      • 6.3.2.5 Rest of Europe
    • 6.3.3 Asia-Pacific
      • 6.3.3.1 China
      • 6.3.3.2 India
      • 6.3.3.3 Japan
      • 6.3.3.4 Australia
      • 6.3.3.5 South East Asia
      • 6.3.3.6 Rest of Asia-Pacific
    • 6.3.4 Rest of the World

7 COMPETITIVE LANDSCAPE

  • 7.1 Company Profiles
    • 7.1.1 Intel Corporation
    • 7.1.2 Taiwan Semiconductor Manufacturing Company
    • 7.1.3 Advanced Semiconductor Engineering, Inc.
    • 7.1.4 Samsung Electronics Co. Ltd
    • 7.1.5 Amkor Technology Inc.
    • 7.1.6 JCET Group Co., Ltd.
    • 7.1.7 TongFu Microelectronics Co., Ltd.
    • 7.1.8 Fujitsu Limited
    • 7.1.9 Siliconware Precision Industries Co. Ltd
    • 7.1.10 Powertech Technology, Inc.

8 INVESTMENTS ANALYSIS

9 FUTURE OF THE MARKET